Chesire; Daniel Patrick

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chesire; Daniel Patrick.The latest application filed is for "structure and method for fabricating flip chip devices".

Company Profile

0.8.9

Chesire; Daniel Patrick - Winter Garden FL
Chesire; Daniel Patrick - Winger Garden FL
Chesire; Daniel Patrick - Orlando FL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure and method for fabricating flip chip devices Grant 7,777,333 - Bachman , et al. August 17, 2	2010-08-17
Structure and Method for Fabricating Flip Chip Devices App 20090072393 - Bachman; Mark Adam ; et al.	2009-03-19
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink Grant 7,429,502 - Archer, III , et al. September 30, 2	2008-09-30
Structure and method for bonding to copper interconnect structures Grant 7,328,830 - Bachman , et al. February 12, 2	2008-02-12
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink Grant 7,327,029 - Archer, III , et al. February 5, 2	2008-02-05
Integrated Circuit Device Incorporating Metallurgical Bond to Enhance Thermal Conduction to a Heat Sink App 20080026508 - Archer; Vance D. III ; et al.	2008-01-31
Reinforced bond pad for a semiconductor device Grant 7,301,231 - Antol , et al. November 27, 2	2007-11-27
Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process Grant 7,221,173 - Bachman , et al. May 22, 2	2007-05-22
Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink App 20070069368 - Archer; Vance D. III ; et al.	2007-03-29
Reinforced bond pad for a semiconductor device App 20060226535 - Antol; Joze E. ; et al.	2006-10-12
Reinforced bond pad for a semiconductor device Grant 7,115,985 - Antol , et al. October 3, 2	2006-10-03
Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process App 20060066327 - Bachman; Mark Adam ; et al.	2006-03-30
Reinforced bond pad for a semiconductor device App 20060065969 - Antol; Joze E. ; et al.	2006-03-30
Reinforced bond pad Grant 6,960,836 - Bachman , et al. November 1, 2	2005-11-01
Methods and system for reinforcing a bond pad App 20050067709 - Bachman, Mark Adam ; et al.	2005-03-31
Structure and method for bonding to copper interconnect structures App 20040182915 - Bachman, Mark Adam ; et al.	2004-09-23
Bond pad support structure for a semiconductor device App 20030218259 - Chesire, Daniel Patrick ; et al.	2003-11-27

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