loadpatents
Patent applications and USPTO patent grants for Chesire; Daniel P..The latest application filed is for "routing under bond pad for the replacement of an interconnect layer".
Patent | Date |
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Routing Under Bond Pad For The Replacement Of An Interconnect Layer App 20130056868 - Archer, III; Vance D. ;   et al. | 2013-03-07 |
Routing under bond pad for the replacement of an interconnect layer Grant 8,319,343 - Archer, III , et al. November 27, 2 | 2012-11-27 |
Thermal monitoring and management of integrated circuits Grant 7,973,544 - Archer, III , et al. July 5, 2 | 2011-07-05 |
Thermal Monitoring And Management Of Integrated Circuits App 20100045326 - Archer, III; Vance D. ;   et al. | 2010-02-25 |
Selective isotropic etch for titanium-based materials Grant 7,476,951 - Campbell , et al. January 13, 2 | 2009-01-13 |
Semiconductor with damage detection circuitry Grant 7,397,103 - Archer , et al. July 8, 2 | 2008-07-08 |
Semiconductor with damage detection circuitry App 20070069365 - Archer; Vance D. ;   et al. | 2007-03-29 |
Routing Under Bond Pad For The Replacement Of An Interconnect Layer App 20070063352 - Archer; Vance D. III ;   et al. | 2007-03-22 |
Selective isotropic etch for titanium-based materials App 20060226553 - Campbell; Timothy S. ;   et al. | 2006-10-12 |
Selective isotropic etch for titanium-based materials Grant 7,078,337 - Campbell , et al. July 18, 2 | 2006-07-18 |
Selective isotropic etch for titanium-based materials App 20050068608 - Campbell, Timothy S. ;   et al. | 2005-03-31 |
High density plasma passivation layer and method of application Grant 6,153,543 - Chesire , et al. November 28, 2 | 2000-11-28 |
Integrated circuit electromigration monitor Grant 5,264,377 - Chesire , et al. November 23, 1 | 1993-11-23 |
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