Cherukuri; Satyam C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cherukuri; Satyam C..The latest application filed is for "final print medium having target regions corresponding to the nozzle of print array".

Company Profile

0.17.0

Cherukuri; Satyam C. - Mercer NJ
Cherukuri; Satyam C. - Cranbury NJ
Cherukuri; Satyam C. - Middlesex NJ
Cherukuri; Satyam C. - Northford CT
Cherukuri; Satyam C. - West Haven CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Final print medium having target regions corresponding to the nozzle of print array Grant 6,231,177 - Cherukuri , et al. May 15, 2	2001-05-15
Parallel print array Grant 6,154,226 - York , et al. November 28, 2	2000-11-28
Electrohydrodynamic receptor Grant 5,980,719 - Cherukuri , et al. November 9, 1	1999-11-09
Mounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electronic display Grant 5,880,705 - Onyskevych , et al. March 9, 1	1999-03-09
Tessellated electroluminescent display having a multilayer ceramic substrate Grant 5,644,327 - Onyskevych , et al. July 1, 1	1997-07-01
Apparatus and methods for controlling fluid flow in microchannels Grant 5,632,876 - Zanzucchi , et al. May 27, 1	1997-05-27
Method and system for inhibiting cross-contamination in fluids of combinatorial chemistry device Grant 5,603,351 - Cherukuri , et al. February 18, 1	1997-02-18
Partitioned microelectronic device array Grant 5,593,838 - Zanzucchi , et al. January 14, 1	1997-01-14
Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis Grant 5,585,069 - Zanzucchi , et al. December 17, 1	1996-12-17
Glass/ceramic sealing system Grant 5,047,371 - Cherukuri * September 10, 1	1991-09-10
Metal sealing glass composite with matched coefficients of thermal expansion Grant 5,043,222 - Cherukuri August 27, 1	1991-08-27
Semiconductor die attach system Grant 4,978,052 - Fister , et al. December 18, 1	1990-12-18
Sealing glass for matched sealing of copper and copper alloys Grant 4,952,531 - Cherukuri August 28, 1	1990-08-28
Semiconductor die attach system Grant 4,929,516 - Pryor , et al. May 29, 1	1990-05-29
Semiconductor die attach system Grant 4,872,047 - Fister , et al. October 3, 1	1989-10-03
Semiconductor casing Grant 4,796,083 - Cherukuri , et al. January 3, 1	1989-01-03
Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor Grant 4,769,345 - Butt , et al. September 6, 1	1988-09-06

Company Registrations

SEC

0001303934

Cherukuri Satyam C

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