Cheong; Yew Wee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheong; Yew Wee.The latest application filed is for "die molding for flip chip molded matrix array package using uv curable tape".

Company Profile

0.6.9

Cheong; Yew Wee - Penang MY
Cheong; Yew Wee - Bayan Lepas MY
Cheong, Yew Wee - Gelugor MY
Cheong, Yew Wee - Jalan Sungai Dua MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die Molding For Flip Chip Molded Matrix Array Package Using Uv Curable Tape App 20090025882 - Lim; Szu Shing ; et al.	2009-01-29
Die molding for flip chip molded matrix array package using UV curable tape Grant 7,465,368 - Lim , et al. December 16, 2	2008-12-16
Wafer grinding method Grant 7,210,987 - Cheong May 1, 2	2007-05-01
Substrate grooves to reduce underfill fillet bridging Grant 7,179,683 - Low , et al. February 20, 2	2007-02-20
Apparatus for controlled fracture substrate singulation Grant 7,172,951 - Chin , et al. February 6, 2	2007-02-06
Apparatus for controlled fracture substrate singulation App 20060084241 - Chin; Oi Fong ; et al.	2006-04-20
Substrate grooves to reduce underfill fillet bridging App 20060046352 - Low; Al Ling ; et al.	2006-03-02
Controlled fracture substrate singulation Grant 7,005,317 - Chin , et al. February 28, 2	2006-02-28
Low-K interlayer dielectric wafer grinding App 20050221728 - Cheong, Yew Wee	2005-10-06
Wafer grinding using an adhesive gel material App 20050221722 - Cheong, Yew Wee	2005-10-06
Die molding for flip chip molded matrix array package using UV curable tape App 20050145328 - Lim, Szu Shing ; et al.	2005-07-07
Combination back grind tape and underfill for flip chips App 20050126686 - Cheong, Yew Wee ; et al.	2005-06-16
Controlled fracture substrate singulation App 20050101109 - Chin, Oi Fong ; et al.	2005-05-12
Method of thinning a wafer utilizing a laminated reinforcing layer over the device side Grant 6,713,366 - Mong , et al. March 30, 2	2004-03-30
Method Of Thinning A Wafer Utilizing A Laminated Reinforcing Layer Over The Device Side App 20030235937 - Mong, Weng Khoon ; et al.	2003-12-25

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