name:-0.0021488666534424
name:-0.0026581287384033
name:-0.0035281181335449
CHENGDU HUIFENG NEW MATERIAL TECHNOLOGY CO., LTD Patent Filings

CHENGDU HUIFENG NEW MATERIAL TECHNOLOGY CO., LTD

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHENGDU HUIFENG NEW MATERIAL TECHNOLOGY CO., LTD.The latest application filed is for "method for testing cutting performance of diamond saw blade, diamond grinding wheel and diamond drill bit".

Company Profile
2.2.1
  • CHENGDU HUIFENG NEW MATERIAL TECHNOLOGY CO., LTD - Chengdu, Sichuan N/A CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
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