Chengalva; Suresh K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chengalva; Suresh K..The latest application filed is for "driver assistance system".
Company Profile
1.22.24
- Chengalva; Suresh K. - Westfield IN
- Chengalva; Suresh K. - Kokomo IN
- Chengalva; Suresh K. - Carmel IN
Patent Activity
| Patent | Date |
|---|---|
| Driver Assistance System App 20200023840 - Taylor; Ronald M. ; et al. | 2020-01-23 |
| Navigation system that displays other-vehicle information Grant 9,726,514 - Pudiyathanda , et al. August 8, 2 | 2017-08-08 |
| Navigation System That Displays Other-Vehicle Information App 20160370201 - Pudiyathanda; Devaiah Aiappa ; et al. | 2016-12-22 |
| Self circulating heat exchanger Grant 8,797,739 - Brandenburg , et al. August 5, 2 | 2014-08-05 |
| Fluid cooled encapsulated microelectronic package Grant 8,471,380 - Brandenburg , et al. June 25, 2 | 2013-06-25 |
| Self Circulating Heat Exchanger App 20120325441 - BRANDENBURG; SCOTT D. ; et al. | 2012-12-27 |
| Fluid Cooled Encapsulated Microelectronic Package App 20120001319 - BRANDENBURG; SCOTT D. ; et al. | 2012-01-05 |
| Fluid cooled encapsulated microelectronic package Grant 8,026,597 - Brandenburg , et al. September 27, 2 | 2011-09-27 |
| Heat-dissipating component having stair-stepped coolant channels Grant 7,782,616 - Myers , et al. August 24, 2 | 2010-08-24 |
| Fluid cooled encapsulated microelectronic package App 20090108439 - Brandenburg; Scott D. ; et al. | 2009-04-30 |
| Fluid cooled encapsulated microelectronic package Grant 7,485,957 - Brandenburg , et al. February 3, 2 | 2009-02-03 |
| Fluid circulator for fluid cooled electronic device Grant 7,486,515 - Brandenburg , et al. February 3, 2 | 2009-02-03 |
| Heat sink electronic package having compliant pedestal Grant 7,440,282 - Brandenburg , et al. October 21, 2 | 2008-10-21 |
| Fluid circulator for fluid cooled electronic device App 20080192430 - Brandenburg; Scott D. ; et al. | 2008-08-14 |
| Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels Grant 7,364,684 - Brandenburg , et al. April 29, 2 | 2008-04-29 |
| Thermal management of surface-mount circuit devices Grant 7,365,273 - Fairchild , et al. April 29, 2 | 2008-04-29 |
| Flip chip heat sink package and method Grant 7,352,585 - Mandel , et al. April 1, 2 | 2008-04-01 |
| Vane integration into motor hub to enhance CD cooling Grant 7,334,243 - Chengalva , et al. February 19, 2 | 2008-02-19 |
| Electronic package and method of cooling electronics Grant 7,307,841 - Berlin , et al. December 11, 2 | 2007-12-11 |
| Heat sink electronic package having compliant pedestal App 20070268671 - Brandenburg; Scott D. ; et al. | 2007-11-22 |
| Cooled electronic assembly and method for cooling a printed circuit board Grant 7,230,832 - Brandenburg , et al. June 12, 2 | 2007-06-12 |
| Fluid cooled encapsulated microelectronic package App 20070114656 - Brandenburg; Scott D. ; et al. | 2007-05-24 |
| Fluid cooled encapsulated microelectronic package Grant 7,205,653 - Brandenburg , et al. April 17, 2 | 2007-04-17 |
| Flip chip heat sink package and method App 20070064399 - Mandel; Larry M. ; et al. | 2007-03-22 |
| Vane integration into motor hub to enhance CD cooling App 20070050794 - Chengalva; Suresh K. ; et al. | 2007-03-01 |
| Flip chip heat sink package and method Grant 7,180,745 - Mandel , et al. February 20, 2 | 2007-02-20 |
| Electronic package and method of cooling electronics App 20070025081 - Berlin; Carl W. ; et al. | 2007-02-01 |
| Cooled electronic assembly and method for cooling a printed circuit board App 20060285300 - Brandenburg; Scott D. ; et al. | 2006-12-21 |
| Electronic assembly with integral thermal transient suppression App 20060209516 - Chengalva; Suresh K. ; et al. | 2006-09-21 |
| Circuit board with localized stiffener for enhanced circuit component reliability Grant 7,094,975 - Chengalva , et al. August 22, 2 | 2006-08-22 |
| Thermal Management Of Surface-mount Circuit Devices App 20060120058 - Fairchild; Manuel R. ; et al. | 2006-06-08 |
| Fluid cooled encapsulated microelectronic package App 20060038284 - Brandenburg; Scott D. ; et al. | 2006-02-23 |
| Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels App 20060033236 - Brandenburg; Scott D. ; et al. | 2006-02-16 |
| Thermally enhanced electronic module with self-aligning heat sink Grant 6,999,317 - Chengalva , et al. February 14, 2 | 2006-02-14 |
| Integrated circuit package with integral leadframe convector and method therefor Grant 6,979,900 - Chengalva , et al. December 27, 2 | 2005-12-27 |
| Surface mounting of components App 20050163966 - Chengalva, Mahesh K. ; et al. | 2005-07-28 |
| Circuit board with localized stiffener for enhanced circuit component reliability App 20050109534 - Chengalva, Suresh K. ; et al. | 2005-05-26 |
| Method for forming an electronic assembly App 20050081377 - Brandenburg, Scott D. ; et al. | 2005-04-21 |
| Integrated circuit package with integral leadframe convector and method therefor App 20050082660 - Chengalva, Suresh K. ; et al. | 2005-04-21 |
| Semiconductor device heat sink package and method App 20050077614 - Chengalva, Suresh K. ; et al. | 2005-04-14 |
| Flip chip heat sink package and method App 20050078456 - Mandel, Larry M. ; et al. | 2005-04-14 |
| Thermally enhanced electronic module with self-aligning heat sink App 20050036292 - Chengalva, Suresh K. ; et al. | 2005-02-17 |
| Method for forming an electronic assembly Grant 6,807,731 - Brandenburg , et al. October 26, 2 | 2004-10-26 |
| Electromagnetic interference shield for overmolded packaging of an electronic assembly App 20030184976 - Brandenburg, Scott D. ; et al. | 2003-10-02 |
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