Cheng; Yung-Shih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Yung-Shih.The latest application filed is for "integrated circuit package and method of forming same".
- Cheng; Yung-Shih - Hsinchu TW
- Cheng; Yung-Shih - Hsinchu City TW
| Patent | Date |
|---|---|
| Semiconductor Devices And Methods Of Manufacture App 20220310527 - Huang; Yao-Te ; et al. | 2022-09-29 |
| Integrated Circuit Package and Method of Forming Same App 20220310556 - Huang; Yao-Te ; et al. | 2022-09-29 |
| Method Of Fabricating A Semiconductor Chip App 20220310559 - Chan; Hong-Wei ; et al. | 2022-09-29 |
| Structure and method of forming a semiconductor device with resistive elements Grant 11,437,313 - Chan , et al. September 6, 2 | 2022-09-06 |
| Semiconductor Devices And Method For Forming The Same App 20220028752 - HUANG; Wen-Sheh ; et al. | 2022-01-27 |
| Increasing Contact Areas of Contacts for MIM Capacitors App 20210391248 - Huang; Yao-Te ; et al. | 2021-12-16 |
| Structure And Method Of Forming A Semiconductor Device With Resistive Elements App 20210257296 - CHAN; Hong-Wei ; et al. | 2021-08-19 |
| Semiconductor Device And Method App 20210257295 - Chan; Hong-Wei ; et al. | 2021-08-19 |
| Methods of patterning small via pitch dimensions Grant 9,099,530 - Lin , et al. August 4, 2 | 2015-08-04 |
| Methods of Patterning Small Via Pitch Dimensions App 20140242794 - Lin; Chung-Yi ; et al. | 2014-08-28 |
| Methods of patterning small via pitch dimensions Grant 8,728,332 - Lin , et al. May 20, 2 | 2014-05-20 |
| Methods Of Patterning Small Via Pitch Dimensions App 20130295769 - Lin; Chung-Yi ; et al. | 2013-11-07 |
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