loadpatents
Patent applications and USPTO patent grants for Cheng; Yung-Shih.The latest application filed is for "integrated circuit package and method of forming same".
Patent | Date |
---|---|
Semiconductor Devices And Methods Of Manufacture App 20220310527 - Huang; Yao-Te ;   et al. | 2022-09-29 |
Integrated Circuit Package and Method of Forming Same App 20220310556 - Huang; Yao-Te ;   et al. | 2022-09-29 |
Method Of Fabricating A Semiconductor Chip App 20220310559 - Chan; Hong-Wei ;   et al. | 2022-09-29 |
Structure and method of forming a semiconductor device with resistive elements Grant 11,437,313 - Chan , et al. September 6, 2 | 2022-09-06 |
Semiconductor Devices And Method For Forming The Same App 20220028752 - HUANG; Wen-Sheh ;   et al. | 2022-01-27 |
Increasing Contact Areas of Contacts for MIM Capacitors App 20210391248 - Huang; Yao-Te ;   et al. | 2021-12-16 |
Structure And Method Of Forming A Semiconductor Device With Resistive Elements App 20210257296 - CHAN; Hong-Wei ;   et al. | 2021-08-19 |
Semiconductor Device And Method App 20210257295 - Chan; Hong-Wei ;   et al. | 2021-08-19 |
Methods of patterning small via pitch dimensions Grant 9,099,530 - Lin , et al. August 4, 2 | 2015-08-04 |
Methods of Patterning Small Via Pitch Dimensions App 20140242794 - Lin; Chung-Yi ;   et al. | 2014-08-28 |
Methods of patterning small via pitch dimensions Grant 8,728,332 - Lin , et al. May 20, 2 | 2014-05-20 |
Methods Of Patterning Small Via Pitch Dimensions App 20130295769 - Lin; Chung-Yi ;   et al. | 2013-11-07 |
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