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Patent applications and USPTO patent grants for Cheng; Yuan-Pao.The latest application filed is for "method for assemblying a semiconductor chip package with deflection-resistant leadfingers".
Patent | Date |
---|---|
Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant Leadfingers App 20120276692 - Feng; Chien-Te ;   et al. | 2012-11-01 |
Semiconductor chip package assembly with deflection-resistant leadfingers Grant 8,274,140 - Feng , et al. September 25, 2 | 2012-09-25 |
Semiconductor Chip Package Assembly with Deflection-Resistant Leadfingers App 20110163429 - Feng; Chien-Te ;   et al. | 2011-07-07 |
Semiconductor chip package assembly with deflection- resistant leadfingers Grant 7,928,544 - Feng , et al. April 19, 2 | 2011-04-19 |
Semiconductor Chip Package Assembly with Deflection- Resistant Leadfingers App 20090283880 - Feng; Chien-Te ;   et al. | 2009-11-19 |
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