| Patent | Date |
|---|
Method for measuring a property of interconnections and structure for the same
Grant 7,646,207 - Lin , et al. January 12, 2 | 2010-01-12 |
Semiconductor device structure and methods of manufacturing the same
Grant 7,512,924 - Chen , et al. March 31, 2 | 2009-03-31 |
Method For Measuring A Property Of Interconnections And Structure For The Same
App 20090058434 - Lin; Jian-Hong ; et al. | 2009-03-05 |
TEOS deposition method
Grant 7,470,584 - Cheng , et al. December 30, 2 | 2008-12-30 |
Method for determining electro-migration failure mode
Grant 7,449,911 - Cheng , et al. November 11, 2 | 2008-11-11 |
System for heat dissipation in semiconductor devices
Grant 7,420,277 - Chen , et al. September 2, 2 | 2008-09-02 |
Method For Determining Electro-migration Failure Mode
App 20080184805 - Cheng; Yi-Lung ; et al. | 2008-08-07 |
Packaged Devices And Methods For Forming Packaged Devices
App 20070267737 - Chen; Hsien-Wei ; et al. | 2007-11-22 |
Bypass gas feed system and method to improve reactant gas flow and film deposition
Grant 7,296,532 - Cheng , et al. November 20, 2 | 2007-11-20 |
Method for forming IMD films
Grant 7,253,121 - Cheng , et al. August 7, 2 | 2007-08-07 |
Semiconductor device structure and methods of manufacturing the same
App 20070166887 - Chen; Hsien-Wei ; et al. | 2007-07-19 |
Method for designing interconnect for a new processing technology
App 20070158835 - Lin; Jian-Hong ; et al. | 2007-07-12 |
Plasma treatment method for electromigration reduction
Grant 7,208,415 - Lai , et al. April 24, 2 | 2007-04-24 |
Nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure
Grant 7,176,571 - Cheng , et al. February 13, 2 | 2007-02-13 |
Device structure having enhanced surface adhesion and failure mode analysis
Grant 7,157,367 - Lin , et al. January 2, 2 | 2007-01-02 |
CMP process leaving no residual oxide layer or slurry particles
Grant 7,125,802 - Wang , et al. October 24, 2 | 2006-10-24 |
Method for forming shallow trench isolation structures
App 20060166458 - Cheng; Yi-Lung ; et al. | 2006-07-27 |
TEOS deposition method
App 20060166514 - Cheng; Yi-Lung ; et al. | 2006-07-27 |
Method and system for fabricating a copper barrier layer with low dielectric constant and leakage current
Grant 7,078,336 - Cheng , et al. July 18, 2 | 2006-07-18 |
Method of forming a borderless contact opening featuring a composite tri-layer etch stop material
Grant 7,074,701 - Cheng , et al. July 11, 2 | 2006-07-11 |
Heat dissipation structure and method thereof
App 20060125090 - Chen; Hsuch-Chung ; et al. | 2006-06-15 |
Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency
App 20060076694 - Chen; Hsien-Wei ; et al. | 2006-04-13 |
Method for forming IMD films
App 20060051973 - Cheng; Yi-Lung ; et al. | 2006-03-09 |
Plasma treatment method for electromigration reduction
App 20060003486 - Lai; Jane-Bai ; et al. | 2006-01-05 |
Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same
Grant 6,979,656 - Jangjian , et al. December 27, 2 | 2005-12-27 |
Novel device structure having enhanced surface adhesion and failure mode analysis
App 20050272260 - Lin, Hway Chi ; et al. | 2005-12-08 |
Heat dissipation structure and method thereof
App 20050236716 - Chen, Hsuch-Chung ; et al. | 2005-10-27 |
System and method of heat dissipation in semiconductor devices
App 20050205991 - Chen, Hsien-Wei ; et al. | 2005-09-22 |
Novel nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure
App 20050153537 - Cheng, Yi-Lung ; et al. | 2005-07-14 |
Novel method to deposit carbon doped SiO2 films with improved film quality
App 20050124151 - Cheng, Yi-Lung ; et al. | 2005-06-09 |
Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same
App 20050121751 - Jangjian, Shiu-Ko ; et al. | 2005-06-09 |
CMP process leaving no residual oxide layer or slurry particles
Grant 6,903,019 - Wang , et al. June 7, 2 | 2005-06-07 |
Method of forming a borderless contact opening featuring a composite tri-layer etch stop material
App 20050112859 - Cheng, Yi-Lung ; et al. | 2005-05-26 |
Method and system for fabricating a copper barrier layer with low dielectric constant and leakage current
App 20050106858 - Cheng, Yi-Lung ; et al. | 2005-05-19 |
Novel method to increase fluorine stability to improve gap fill ability and reduce k value of fluorine silicate glass (FSG) film
App 20050009367 - Cheng, Yi-Lung ; et al. | 2005-01-13 |
Method to solve particle performance of FSG layer by using UFU season film for FSG process
Grant 6,815,072 - Yoo , et al. November 9, 2 | 2004-11-09 |
Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season film
Grant 6,815,007 - Yoo , et al. November 9, 2 | 2004-11-09 |
Semiconductor chamber process apparatus and method
Grant 6,802,935 - Cheng , et al. October 12, 2 | 2004-10-12 |
Method for capping over a copper layer
Grant 6,790,778 - Cheng , et al. September 14, 2 | 2004-09-14 |
Method of forming in-situ SRO HDP-CVD barrier film
Grant 6,759,347 - Cheng , et al. July 6, 2 | 2004-07-06 |
Bypass gas feed system and method to improve reactant gas flow and film deposition
App 20040118342 - Cheng, Yi-Lung ; et al. | 2004-06-24 |
CMP process leaving no residual oxide layer or slurry particles
App 20040097083 - Wang, Ying-Lang ; et al. | 2004-05-20 |
CMP process leaving no residual oxide layer or slurry particles
App 20040084415 - Wang, Ying-Lang ; et al. | 2004-05-06 |
Method of forming a metal nitride layer over exposed copper
Grant 6,713,407 - Cheng , et al. March 30, 2 | 2004-03-30 |
Method to neutralize charge imbalance following a wafer cleaning process
Grant 6,703,317 - Cheng , et al. March 9, 2 | 2004-03-09 |
CMP process leaving no residual oxide layer or slurry particles
Grant 6,660,638 - Wang , et al. December 9, 2 | 2003-12-09 |
Semiconductor chamber process apparatus and method
App 20030178141 - Cheng, Yi-Lung ; et al. | 2003-09-25 |
Method for removing residual fluorine in HDP-CVD chamber
Grant 6,602,560 - Cheng , et al. August 5, 2 | 2003-08-05 |
Method for improved cleaning in HDP-CVD process with reduced NF3 usage
Grant 6,584,987 - Cheng , et al. July 1, 2 | 2003-07-01 |
Method for reducing contaminants in a CVD chamber
App 20030068448 - Cheng, Yi-Lung ; et al. | 2003-04-10 |
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