CHENG; YAO-YI

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHENG; YAO-YI.The latest application filed is for "resin composition, method for making resin composition and film for circuit board, and circuit board".

Company Profile

0.9.2

CHENG; YAO-YI - Taoyuan TW
Cheng; Yao-Yi - Hsin Chu TW
Cheng; Yao-Yi - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition, Method For Making Resin Composition And Film For Circuit Board, And Circuit Board App 20180223048 - HSU; MAO-FENG ; et al.	2018-08-09
Dual damascene aperture formation method absent intermediate etch stop layer Grant 6,706,637 - Chen , et al. March 16, 2	2004-03-16
Minimizing coating defects in low dielectric constant films Grant 6,667,249 - Chen , et al. December 23, 2	2003-12-23
Dual damascene aperture formation method absent intermediate etch stop layer App 20030211746 - Chen, Yu-Huei ; et al.	2003-11-13
Methods of adhesion promoter between low-K layer and underlying insulating layer Grant 6,472,335 - Tsai , et al. October 29, 2	2002-10-29
Method to improve adhesion between an overlying oxide hard mask and an underlying low dielectric constant material Grant 6,331,480 - Tsai , et al. December 18, 2	2001-12-18
Method for forming low dielectric constant spin-on-polymer (SOP) dielectric layer Grant 6,255,232 - Chang , et al. July 3, 2	2001-07-03
Method of optimizing device performance via use of copper damascene structures, and HSQ/FSG, hybrid low dielectric constant materials Grant 6,187,663 - Yu , et al. February 13, 2	2001-02-13
Method for fabricating a hybrid low-dielectric-constant intermetal dielectric (IMD) layer with improved reliability for multilevel interconnections Grant 6,159,842 - Chang , et al. December 12, 2	2000-12-12
Method to improve adhesion between low dielectric constant layer and silicon containing dielectric layer Grant 6,143,670 - Cheng , et al. November 7, 2	2000-11-07
Method of stabilizing low dielectric constant films Grant 6,020,273 - Cheng , et al. February 1, 2	2000-02-01

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