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Patent applications and USPTO patent grants for Cheng; Yang-Chun.The latest application filed is for "metal heterojunction structure with capping metal layer".
Patent | Date |
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Vias with metal caps for underlying conductive lines Grant 11,133,247 - Ho , et al. September 28, 2 | 2021-09-28 |
Metal Heterojunction Structure With Capping Metal Layer App 20210272818 - LIN; Yi-Sheng ;   et al. | 2021-09-02 |
CMP slurry and CMP method Grant 11,094,555 - Hsu , et al. August 17, 2 | 2021-08-17 |
Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing App 20210183688 - Lee; Chia Hsuan ;   et al. | 2021-06-17 |
Metal heterojunction structure with capping metal layer Grant 11,037,799 - Lin , et al. June 15, 2 | 2021-06-15 |
External Heating System For Use In Chemical Mechanical Polishing System App 20210078129 - LIN; Yi-Sheng ;   et al. | 2021-03-18 |
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing Grant 10,937,691 - Lee , et al. March 2, 2 | 2021-03-02 |
Cmp Slurry And Cmp Method App 20200279751 - Hsu; Chun-Wei ;   et al. | 2020-09-03 |
CMP slurry and CMP method Grant 10,692,732 - Hsu , et al. | 2020-06-23 |
Vias With Metal Caps For Underlying Conductive Lines App 20200105668 - Ho; Chia-Wei ;   et al. | 2020-04-02 |
Methods Of Forming An Abrasive Slurry And Methods For Chemical-mechanical Polishing App 20200105580 - Lee; Chia Hsuan ;   et al. | 2020-04-02 |
Cmp Slurry And Cmp Method App 20200098590 - Hsu; Chun-Wei ;   et al. | 2020-03-26 |
Metal Heterojunction Structure With Capping Metal Layer App 20200098591 - Lin; Yi-Sheng ;   et al. | 2020-03-26 |
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