Cheng; Yang-Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Yang-Chun.The latest application filed is for "metal heterojunction structure with capping metal layer".

Company Profile

7.5.8

Cheng; Yang-Chun - Hsinchu TW
CHENG; Yang-Chun - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vias with metal caps for underlying conductive lines Grant 11,133,247 - Ho , et al. September 28, 2	2021-09-28
Metal Heterojunction Structure With Capping Metal Layer App 20210272818 - LIN; Yi-Sheng ; et al.	2021-09-02
CMP slurry and CMP method Grant 11,094,555 - Hsu , et al. August 17, 2	2021-08-17
Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing App 20210183688 - Lee; Chia Hsuan ; et al.	2021-06-17
Metal heterojunction structure with capping metal layer Grant 11,037,799 - Lin , et al. June 15, 2	2021-06-15
External Heating System For Use In Chemical Mechanical Polishing System App 20210078129 - LIN; Yi-Sheng ; et al.	2021-03-18
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing Grant 10,937,691 - Lee , et al. March 2, 2	2021-03-02
Cmp Slurry And Cmp Method App 20200279751 - Hsu; Chun-Wei ; et al.	2020-09-03
CMP slurry and CMP method Grant 10,692,732 - Hsu , et al.	2020-06-23
Vias With Metal Caps For Underlying Conductive Lines App 20200105668 - Ho; Chia-Wei ; et al.	2020-04-02
Methods Of Forming An Abrasive Slurry And Methods For Chemical-mechanical Polishing App 20200105580 - Lee; Chia Hsuan ; et al.	2020-04-02
Cmp Slurry And Cmp Method App 20200098590 - Hsu; Chun-Wei ; et al.	2020-03-26
Metal Heterojunction Structure With Capping Metal Layer App 20200098591 - Lin; Yi-Sheng ; et al.	2020-03-26

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