Patent | Date |
---|
Semiconductor Memory Devices And Methods Of Manufacturing Thereof App 20220285399 - Liou; Peng-Chun ;   et al. | 2022-09-08 |
Semiconductor Memory Devices And Methods Of Manufacturing Thereof App 20220285397 - Liou; Peng-Chun ;   et al. | 2022-09-08 |
Barrier layer above anti-punch through (APT) implant region to improve mobility of channel region of fin field effect transistor (finFET) device structure Grant 11,158,508 - Wen , et al. October 26, 2 | 2021-10-26 |
Method for FinFET LDD Doping App 20210242310 - Tsai; Chun Hsiung ;   et al. | 2021-08-05 |
Method for FinFET LDD doping Grant 10,991,800 - Tsai , et al. April 27, 2 | 2021-04-27 |
Method Of Metal Gate Formation And Structures Formed By The Same App 20210028069 - LEE; YI-JING ;   et al. | 2021-01-28 |
Source and drain dislocation fabrication in FinFETs Grant RE48,304 - Wu , et al. November 10, 2 | 2020-11-10 |
Semiconductor Device And Manufacturing Method Thereof App 20200343339 - TSAI; Chun Hsiung ;   et al. | 2020-10-29 |
Method of metal gate formation and structures formed by the same Grant 10,804,163 - Lee , et al. October 13, 2 | 2020-10-13 |
Method Of Metal Gate Formation And Structures Formed By The Same App 20200135589 - LEE; YI-JING ;   et al. | 2020-04-30 |
Method for FinFET LDD Doping App 20190288067 - Tsai; Chun Hsiung ;   et al. | 2019-09-19 |
Method for FinFET LDD doping Grant 10,396,156 - Tsai , et al. A | 2019-08-27 |
Method for FinFET LDD Doping App 20190237543 - Tsai; Chun Hsiung ;   et al. | 2019-08-01 |
Barrier Layer Above Anti-punch Through (apt) Implant Region To Improve Mobility Of Channel Region Of Fin Field Effect Transistor (finfet) Device Structure App 20180204726 - WEN; Tsung-Yao ;   et al. | 2018-07-19 |
Barrier layer above anti-punch through (APT) implant region to improve mobility of channel region of fin field effect transistor (FinFET) device structure Grant 9,953,836 - Wen , et al. April 24, 2 | 2018-04-24 |
Integrated high-speed probe system Grant 9,519,010 - Wang , et al. December 13, 2 | 2016-12-13 |
Barrier Layer Above Anti-punch Through (apt) Implant Region To Improve Mobility Of Channel Region Of Fin Field Effect Transistor (finfet) Device Structure App 20160218104 - WEN; Tsung-Yao ;   et al. | 2016-07-28 |
Source and drain dislocation fabrication in FinFETs Grant 9,230,828 - Wu , et al. January 5, 2 | 2016-01-05 |
Thermal magnetic engine and thermal magnetic engine system Grant 8,984,885 - Kuo , et al. March 24, 2 | 2015-03-24 |
Integrated High-speed Probe System App 20150022227 - WANG; Chun-Chi ;   et al. | 2015-01-22 |
Method For Manufacturing An Embedded Package And Structure Thereof App 20150016080 - Lung; Chen Hsuan ;   et al. | 2015-01-15 |
Source and Drain Dislocation Fabrication in FinFETs App 20140349458 - Wu; Zhiqiang ;   et al. | 2014-11-27 |
Integrated high-speed probe system Grant 8,884,640 - Wang , et al. November 11, 2 | 2014-11-11 |
Source and drain dislocation fabrication in FinFETs Grant 8,866,235 - Wu , et al. October 21, 2 | 2014-10-21 |
Method and system for estimating traffic information by using integration of location update events and call events Grant 8,788,185 - Yen , et al. July 22, 2 | 2014-07-22 |
Source and Drain Dislocation Fabrication in FinFETs App 20140131812 - Wu; Zhiqiang ;   et al. | 2014-05-15 |
Method And System For Estimating Traffic Information By Using Integration Of Location Update Events And Call Events App 20140011484 - YEN; Sheng-Ying ;   et al. | 2014-01-09 |
Three-dimensional system-in-package package-on-package structure Grant 8,619,431 - Lin , et al. December 31, 2 | 2013-12-31 |
Thermal Magnetic Engine And Thermal Magnetic Engine System App 20130263599 - KUO; Chung-Jung ;   et al. | 2013-10-10 |
Eyeglasses Structure App 20130044288 - CHENG; YA-YUN | 2013-02-21 |
Card connector Grant 8,371,866 - Su , et al. February 12, 2 | 2013-02-12 |
Integrated High-speed Probe System App 20120274347 - Wang; Chun-Chi ;   et al. | 2012-11-01 |
EMI Shielding in a Package Module App 20120188727 - LIN; Nan-Chun ;   et al. | 2012-07-26 |
Three-dimensional System-in-package Package-on-package Structure App 20120161315 - Lin; Nan-Chun ;   et al. | 2012-06-28 |