William Cheng

USPTO Trademark & Patent Filings

Cheng William

Trademark applications and grants for William Cheng. William Cheng has 1 trademark applications. The latest application filed is for "YEODT"

Company Profile
    Company Aliases
  • William Cheng
  • william cheng
  • Cheng; William - Palo Alto CA
  • CHENG; William - New Taipei City TW
  • Cheng; William - San Gabriel CA
  • CHENG; William - Hsinchu City TW
  • Cheng; William - Plainview NY
  • Cheng; William - Hsinchu TW
Entity Type INDIVIDUAL
Address 157-20 18th Ave, Whitestone, NEW YORK UNITED STATES 11357

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents
Patent Applications
Patent ApplicationDate
Autonomous Wave Powered Desalination
20190314763 - 15/955684 Klebnikov; Alexander ;   et al.
2019-10-17
Touch Module and Display Device Using the Same
20150277615 - 14/224181 LIN; Wei-Ting ;   et al.
2015-10-01
SOFTWARE UNINSTALLATION SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT
20140189675 - 14/142601 Cheng; William ;   et al.
2014-07-03
STRUCTURE OF WAFER LEVEL CHIP MOLDED PACKAGE
20140117568 - 14/149936 LEE; Hsin-Hui ;   et al.
2014-05-01
SOFTWARE UNINSTALLATION SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT
20140109079 - 14/015277 Cheng; William ;   et al.
2014-04-17
Software uninstallation system, method and computer program product
9,292,273 - 14/142,601 Cheng , et al. March 22, 2
2016-03-22
Optical control sensor system with driver that switches frequencies of a set of different orthogonal signals and modulates the intensity of light
9,222,830 - 13/704,904 Borodin , et al. December 29, 2
2015-12-29
Optical control sensor system with driver that switches frequencies of a set of different orthogonal signals and modulates the intensity of light
9,222,830 - 13/704,904 Borodin , et al. December 29, 2
2015-12-29
Structure of wafer level chip molded package
9,064,817 - 14/149,936 Lee , et al. June 23, 2
2015-06-23
Structure and method of wafer level chip molded packaging
8,647,963 - 12/820,587 Lee , et al. February 11, 2
2014-02-11
Patent Grants & Applications
Trademark Applications
Mark Image

Registration | Serial
Trademark
Application Date
 YEODT
"YEODT"
97320904
YEODT
2022-03-19

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