Cheng; Way Lee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Way Lee.The latest application filed is for "thermal structure for integrated circuit package".
- Cheng; Way Lee - Taipei TW
- Cheng; Way Lee - Doha QA
| Patent | Date |
|---|---|
| Thermal structure for integrated circuit package Grant 9,741,638 - Hsieh , et al. August 22, 2 | 2017-08-22 |
| Thermal Structure for Integrated Circuit Package App 20160254211 - Hsieh; Cheng-Chieh ; et al. | 2016-09-01 |
| Thermal structure for integrated circuit package Grant 9,337,123 - Hsieh , et al. May 10, 2 | 2016-05-10 |
| Thermal Structure for Integrated Circuit Package App 20140015106 - Hsieh; Cheng-Chieh ; et al. | 2014-01-16 |
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