Cheng; Shwang-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Shwang-Ming.The latest application filed is for "integration scheme for cu/low-k interconnects".

Company Profile

0.6.8

Cheng; Shwang-Ming - Hsin-Chu TW
Cheng; Shwang-Ming - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integration scheme for Cu/low-k interconnects Grant 7,564,136 - Yeh , et al. July 21, 2	2009-07-21
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip Grant 7,405,481 - Lin , et al. July 29, 2	2008-07-29
Repairing method for low-k dielectric materials Grant 7,314,828 - Lin , et al. January 1, 2	2008-01-01
Integration scheme for cu/low-k interconnects App 20070202676 - Yeh; Ming Ling ; et al.	2007-08-30
UV curing of low-k porous dielectrics App 20070161230 - Chen; I-I ; et al.	2007-07-12
Repairing method for low-k dielectric materials App 20070020952 - Lin; Keng-Chu ; et al.	2007-01-25
Decreasing metal-silicide oxidation during wafer queue time Grant 7,160,800 - Wu , et al. January 9, 2	2007-01-09
Sealing pores of low-k dielectrics using C.sub.xH.sub.y Grant 7,135,402 - Lin , et al. November 14, 2	2006-11-14
Silicon oxycarbide and silicon carbonitride based materials for MOS devices Grant 7,115,974 - Wu , et al. October 3, 2	2006-10-03
CxHy sacrificial layer for cu/low-k interconnects App 20060172530 - Cheng; Shwang-Ming ; et al.	2006-08-03
Sealing pores of low-k dielectrics using CxHy App 20060172531 - Lin; Keng-Chu ; et al.	2006-08-03
Decreasing Metal-Silicide Oxidation During Wafer Queue Time App 20060154481 - Wu; Zhen-Cheng ; et al.	2006-07-13
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip App 20060118921 - Lin; Keng-Chu ; et al.	2006-06-08
Silicon oxycarbide and silicon carbonitride based materials for MOS devices App 20050236694 - Wu, Zhen-Cheng ; et al.	2005-10-27

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