Cheng; Shih-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Shih-Yuan.The latest application filed is for "line width roughness improvement with noble gas plasma".

Company Profile

0.5.4

Cheng; Shih-Yuan - Palo Alto CA
Cheng; Shih-Yuan - Foster City CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Line width roughness improvement with noble gas plasma Grant 9,466,502 - Cheng , et al. October 11, 2	2016-10-11
Line Width Roughness Improvement With Noble Gas Plasma App 20160155643 - CHENG; Shih-Yuan ; et al.	2016-06-02
Line width roughness improvement with noble gas plasma Grant 9,263,284 - Cheng , et al. February 16, 2	2016-02-16
Line Width Roughness Improvement With Noble Gas Plasma App 20140248779 - CHENG; Shih-Yuan ; et al.	2014-09-04
Line width roughness improvement with noble gas plasma Grant 8,753,804 - Cheng , et al. June 17, 2	2014-06-17
Line Width Roughness Improvement With Noble Gas Plasma App 20110104616 - Cheng; Shih-Yuan ; et al.	2011-05-05
Method and apparatus for nitride spacer etch process implementing in situ interferometry endpoint detection and non-interferometry endpoint monitoring App 20060040415 - Chou; Wen-Ben ; et al.	2006-02-23
Method and apparatus for nitride spacer etch process implementing in situ interferometry endpoint detection and non-interferometry endpoint monitoring Grant 6,977,184 - Chou , et al. December 20, 2	2005-12-20

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