loadpatents
Patent applications and USPTO patent grants for CHENG; SHIH JYE.The latest application filed is for "redistribution layer alloy structure and manufacturing method thereof".
Patent | Date |
---|---|
Redistribution Layer Alloy Structure And Manufacturing Method Thereof App 20150171039 - CHENG; SHIH JYE ;   et al. | 2015-06-18 |
Semiconductor structure having a silver alloy bump body and manufacturing method thereof Grant 8,877,630 - Cheng , et al. November 4, 2 | 2014-11-04 |
Semiconductor structure and manufacturing method thereof Grant 8,779,604 - Cheng , et al. July 15, 2 | 2014-07-15 |
Method for fabricating anisotropic conductive substrate Grant 7,140,101 - Cheng , et al. November 28, 2 | 2006-11-28 |
Modularized probe head Grant 6,946,860 - Cheng , et al. September 20, 2 | 2005-09-20 |
Probe card assembly Grant 6,853,205 - Cheng , et al. February 8, 2 | 2005-02-08 |
Probe Card Assembly App 20050012513 - Cheng, Shih-Jye ;   et al. | 2005-01-20 |
Modularized probe card with coaxial transmitters Grant 6,812,720 - Cheng , et al. November 2, 2 | 2004-11-02 |
Modularized probe card with compressible electrical connection device Grant 6,781,392 - Cheng , et al. August 24, 2 | 2004-08-24 |
Modular probe card assembly Grant 6,621,710 - Cheng , et al. September 16, 2 | 2003-09-16 |
SEC | 0001345439 | Cheng Shih Jye |
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