Cheng; Shi-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Shi-Wei.The latest application filed is for "polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith".
- Cheng; Shi-Wei - Aurora IL
- Cheng; Shi-Wei - Taoyuan TW
- Cheng; Shi Wei - Kao Hsiung TW
| Patent | Date |
|---|---|
| Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith Grant 9,687,956 - Tsai , et al. June 27, 2 | 2017-06-27 |
| CMP polishing pad having edge exclusion region of offset concentric groove pattern Grant 9,409,276 - Tsai , et al. August 9, 2 | 2016-08-09 |
| Polishing Pad With Offset Concentric Grooving Pattern And Method For Polishing A Substrate Therewith App 20150298287 - Tsai; Ching-Ming ; et al. | 2015-10-22 |
| Cmp Polishing Pad Having Edge Exclusion Region Of Offset Concentric Groove Pattern App 20150111476 - TSAI; Ching-Ming ; et al. | 2015-04-23 |
| Printer Grant D478,620 - Cheng August 19, 2 | 2003-08-19 |
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