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CHENG; Shan-Yin Patent Filings

CHENG; Shan-Yin

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHENG; Shan-Yin.The latest application filed is for "heat exchanger fin and manufacturing method of the same".

Company Profile
5.3.11
  • CHENG; Shan-Yin - Taipei City TW
  • CHENG; Shan-Yin - New Taipei City TW
  • Cheng; Shan-Yin - New Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat Exchanger Fin And Manufacturing Method Of The Same
App 20220299271 - LIN; Chia Yu ;   et al.
2022-09-22
Heat Dissipation Device
App 20220299277 - LIN; Chia-Yu ;   et al.
2022-09-22
Heat Exchanger Fin And Manufacturing Method Of The Same
App 20220290928 - LIN; Chia Yu ;   et al.
2022-09-15
Heat dissipation device
Grant 11,384,999 - Lin , et al. July 12, 2
2022-07-12
Heat Dissipation Device
App 20220205723 - CHEN; Kui-Yen ;   et al.
2022-06-30
Method of manufacturing a heat exchanger
Grant 11,359,870 - Lin , et al. June 14, 2
2022-06-14
Vapor Chamber Heatsink Assembly
App 20220128316 - Wen; Yuanlong ;   et al.
2022-04-28
Heat Exchanger Fin And Manufacturing Method Of The Same
App 20210215437 - LIN; Chia Yu ;   et al.
2021-07-15
Heat Exchanger Fin And Manufacturing Method Of The Same
App 20210213511 - LIN; Chia Yu ;   et al.
2021-07-15
Vapor Chamber Heatsink Assembly
App 20210180873 - Lin; Chia yu ;   et al.
2021-06-17
Heat Dissipation Structure
App 20210088288 - WANG; Chi-Chuan ;   et al.
2021-03-25
Heat dissipation structure
Grant 10,907,907 - Wang , et al. February 2, 2
2021-02-02
Heat Dissipation Device
App 20200378698 - LIN; Chia-Yu ;   et al.
2020-12-03
Heat Dissipation Structure
App 20190195567 - WANG; Chi-Chuan ;   et al.
2019-06-27

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