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name:-0.018929004669189
name:-0.018417835235596
name:-0.0052368640899658
Cheng; Nai-Wen Patent Filings

Cheng; Nai-Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Nai-Wen.The latest application filed is for "semiconductor packaging device comprising a shield structure".

Company Profile
4.15.14
  • Cheng; Nai-Wen - Hsinchu TW
  • Cheng; Nai-Wen - Tainan City TW
  • Cheng; Nai-Wen - Tainan TW
  • CHENG; Nai-Wen - Hsinchu City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Storage devices mapped to registers and mapping methods thereof
Grant 11,321,091 - Cheng , et al. May 3, 2
2022-05-03
Semiconductor Packaging Device Comprising A Shield Structure
App 20210296258 - Chien; Wei-Yu ;   et al.
2021-09-23
Semiconductor packaging device comprising a shield structure
Grant 11,037,885 - Chien , et al. June 15, 2
2021-06-15
Storage Devices Mapped To Registers And Mapping Methods Thereof
App 20210124584 - CHENG; Nai-Wen ;   et al.
2021-04-29
Ion Through-substrate Via
App 20210082787 - Shen; Yu-Yang ;   et al.
2021-03-18
Semiconductor Packaging Device Comprising A Shield Structure
App 20210050303 - Chien; Wei-Yu ;   et al.
2021-02-18
Ion through-substrate via
Grant 10,867,891 - Shen , et al. December 15, 2
2020-12-15
Ion Through-substrate Via
App 20200135617 - Shen; Yu-Yang ;   et al.
2020-04-30
Image sensor with low step height between back-side metal and pixel array
Grant 10,074,680 - Tseng , et al. September 11, 2
2018-09-11
Image Sensor with Low Step Height between Back-side Metal and Pixel Array
App 20160190190 - Tseng; Chien-Hsien ;   et al.
2016-06-30
Methods of stress engineering to reduce dark current of CMOS image sensors
Grant 9,299,734 - Hsiao , et al. March 29, 2
2016-03-29
Image sensor with low step height between back-side metal and pixel array
Grant 9,299,740 - Tseng , et al. March 29, 2
2016-03-29
Local oxidation of silicon processes with reduced lateral oxidation
Grant 8,778,717 - Hsiao , et al. July 15, 2
2014-07-15
Stress Engineering To Reduce Dark Current Of Cmos Image Sensors
App 20140001523 - HSIAO; Ru-Shang ;   et al.
2014-01-02
Image Sensor with Low Step Height between Back-side Metal and Pixel Array
App 20130320469 - Tseng; Chien-Hsien ;   et al.
2013-12-05
Stress engineering to reduce dark current of CMOS image sensors
Grant 8,546,860 - Hsiao , et al. October 1, 2
2013-10-01
Sensor element isolation in a backside illuminated image sensor
Grant 8,389,377 - Hsiao , et al. March 5, 2
2013-03-05
Stress Engineering To Reduce Dark Current Of Cmos Image Sensors
App 20120248515 - HSIAO; Ru-Shang ;   et al.
2012-10-04
Stress engineering to reduce dark current of CMOS image sensors
Grant 8,216,905 - Hsiao , et al. July 10, 2
2012-07-10
Image processing method and system
Grant 8,139,086 - Tu , et al. March 20, 2
2012-03-20
Stress Engineering To Reduce Dark Current Of Cmos Image Sensors
App 20110260223 - HSIAO; Ru-Shang ;   et al.
2011-10-27
Sensor Element Isolation In A Backside Illuminated Image Sensor
App 20110241152 - Hsiao; Ru-Shang ;   et al.
2011-10-06
Local Oxidation of Silicon Processes with Reduced Lateral Oxidation
App 20110230002 - Hsiao; Ru-Shang ;   et al.
2011-09-22
Soft magnetism thin film inductor and magnetic multi-element alloy film
Grant 7,570,145 - Yeh , et al. August 4, 2
2009-08-04
Image Processing Method And System
App 20090079760 - TU; Chieh-Sheng ;   et al.
2009-03-26
Soft Magnetism Thin Film Inductor And Magnetic Multi-element Alloy Film
App 20080150663 - Yeh; Jien-Wei ;   et al.
2008-06-26

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