Cheng; Man Hon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Man Hon.The latest application filed is for "method of attaching a die to a substrate".
- Cheng; Man Hon - N.T. HK
- Cheng; Man Hon - Tsuen Wan HK
- Cheng; Man Hon - Hong Kong HK
- Cheng, Man Hon - New Territories HK
| Patent | Date |
|---|---|
| Optical sensor package Grant 6,958,261 - Chow , et al. October 25, 2 | 2005-10-25 |
| Method of attaching a die to a substrate Grant 6,875,635 - Cheng , et al. April 5, 2 | 2005-04-05 |
| Multi-row leadframe Grant 6,838,751 - Cheng , et al. January 4, 2 | 2005-01-04 |
| Method of attaching a die to a substrate Grant 6,798,074 - Cheng , et al. September 28, 2 | 2004-09-28 |
| Method of attaching a die to a substrate App 20040178511 - Cheng, Man Hon ; et al. | 2004-09-16 |
| Optical sensor package App 20040080029 - Chow, Wai Wong ; et al. | 2004-04-29 |
| Optical sensor package Grant 6,667,543 - Chow , et al. December 23, 2 | 2003-12-23 |
| Multi-row leadframe App 20030168719 - Cheng, Man Hon ; et al. | 2003-09-11 |
| Method of attaching a die to a substrate App 20030164553 - Cheng, Man Hon ; et al. | 2003-09-04 |
| Semiconductor package and method for making the same App 20020177254 - Chow, Wai Wong ; et al. | 2002-11-28 |
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