Cheng; Kuang-Chih

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Kuang-Chih.The latest application filed is for "package of a semiconductor device with a flexible wiring substrate and method for the same".

Company Profile

0.7.9

Cheng; Kuang-Chih - Linnei Township Yunlin County TW
Cheng; Kuang-Chih - Yun-Lin TW
Cheng; Kuang-Chih - Yunlin County TW
Cheng; Kuang-Chih - Yunlin TW
Cheng; Kuang-Chih - Linnei TW
Cheng; Kuang-Chih - Yun-Lin Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Camera module Grant 7,663,693 - Sun , et al. February 16, 2	2010-02-16
Package of a semiconductor device with a flexible wiring substrate and method for the same Grant 7,663,234 - Sun , et al. February 16, 2	2010-02-16
Camera module and method for packaging the same Grant 7,359,002 - Cheng , et al. April 15, 2	2008-04-15
Package of a semiconductor device with a flexible wiring substrate and method for the same Grant 7,303,400 - Sun , et al. December 4, 2	2007-12-04
Package Of A Semiconductor Device With A Flexible Wiring Substrate And Method For The Same App 20060202333 - SUN; JOSEPH ; et al.	2006-09-14
Image Sensor App 20060180860 - Pan; Jui-Hsiang ; et al.	2006-08-17
Image sensor and fabricating method thereof Grant 7,060,592 - Pan , et al. June 13, 2	2006-06-13
Package of a semiconductor device with a flexible wiring substrate and method for the same App 20060113654 - Sun; Joseph ; et al.	2006-06-01
Image Sensor And Fabricating Method Thereof App 20060057764 - Pan; Jui-Hsiang ; et al.	2006-03-16
Chip on photosensitive device package structure and electrical connection thereof Grant 7,009,287 - Sun , et al. March 7, 2	2006-03-07
Camera module App 20050190290 - Sun, Cheng-Kuang ; et al.	2005-09-01
Chip on photosensitive device package structure and electrical connection thereof App 20050189624 - Sun, Cheng-Kuang ; et al.	2005-09-01
Package structure for optical image sensing integrated circuits Grant 6,930,398 - Sun , et al. August 16, 2	2005-08-16
Package of a semiconductor device with a flexible wiring substrate and method for the same App 20050161815 - Sun, Joseph ; et al.	2005-07-28
Package of a semiconductor device with a flexible wiring substrate and method for the same App 20050161756 - Sun, Joseph ; et al.	2005-07-28
Camera module and method for packaging the same App 20050117051 - Cheng, Kuang-Chih ; et al.	2005-06-02

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