Cheng; Kezia

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Kezia.The latest application filed is for "packaging structures with improved adhesion and strength".

Company Profile

6.15.19

Cheng; Kezia - Lowell MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods to improve front-side process uniformity by back-side metallization Grant 10,982,322 - Cheng April 20, 2	2021-04-20
Packaging structures with improved adhesion and strength Grant 10,971,418 - Barber , et al. April 6, 2	2021-04-06
Rapid thermal anneal apparatus and method Grant 10,840,114 - Cheng , et al. November 17, 2	2020-11-17
Method for controlling the amount of radiation having a predetermined wavelength to be absorbed by a structure disposed on a semiconductor Grant 10,541,148 - Cheng , et al. Ja	2020-01-21
Packaging Structures With Improved Adhesion And Strength App 20200013689 - Barber; Bradley Paul ; et al.	2020-01-09
Packaging structures with improved adhesion and strength Grant 10,453,763 - Barber , et al. Oc	2019-10-22
Methods To Improve Front-side Process Uniformity By Back-side Metallization App 20190316250 - Cheng; Kezia	2019-10-17
Schottky contact structure for semiconductor devices and method for forming such Schottky contact structure Grant 10,439,035 - Tabatabaie-Alavi , et al. O	2019-10-08
Method For Controlling The Amount Of Radiation Having A Predetermined Wavelength To Be Absorbed By A Structure Disposed On A Sem App 20190198346 - Cheng; Kezia ; et al.	2019-06-27
Schottky Contact Structure For Semiconductor Devices And Method For Forming Such Schottky Contact Structure App 20180323274 - Tabatabaie-Alavi; Kamal ; et al.	2018-11-08
Schottky contact structure for semiconductor devices and method for forming such schottky contact structure Grant 10,026,823 - Tabatabaie-Alavi , et al. July 17, 2	2018-07-17
Packaging Structures With Improved Adhesion And Strength App 20180047650 - Barber; Bradley Paul ; et al.	2018-02-15
Polymer Bonding With Improved Step Coverage App 20170365554 - Barber; Bradley Paul ; et al.	2017-12-21
Wafer Level Packaging Using A Transferable Structure App 20170345676 - Cheng; Kezia	2017-11-30
Electron radiation monitoring electrode system to prevent gold spitting and resist cross-linking during evaporation Grant 9,768,081 - Cheng September 19, 2	2017-09-19
3d Micromold And Pattern Transfer App 20170243739 - Barber; Bradley Paul ; et al.	2017-08-24
Devices And Methods Related To A Sputtered Titanium Tungsten Layer Formed Over A Copper Interconnect Stack Structure App 20170186694 - Cheng; Kezia	2017-06-29
Methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure Grant 9,576,906 - Cheng February 21, 2	2017-02-21
Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor Grant 9,553,049 - Cheng January 24, 2	2017-01-24
Methods Related To A Sputtered Titanium Tungsten Layer Formed Over A Copper Interconnect Stack Structure App 20160343667 - Cheng; Kezia	2016-11-24
Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure Grant 9,443,803 - Cheng September 13, 2	2016-09-13
Electron Radiation Monitoring Electrode System To Prevent Gold Spitting And Resist Cross-linking During Evaporation App 20150243567 - Cheng; Kezia	2015-08-27
Systems, Devices And Methods Related To Source Level Compensation For Electron-beam Evaporators App 20150203959 - CHENG; Kezia	2015-07-23
Systems To Improve Front-side Process Uniformity By Back-side Metallization App 20150129130 - Cheng; Kezia	2015-05-14
Systems and methods for improving front-side process uniformity by back-side metallization Grant 8,956,979 - Cheng February 17, 2	2015-02-17
Copper interconnects having a titanium--titanium nitride assembly between copper and compound semiconductor Grant 8,878,362 - Cheng November 4, 2	2014-11-04
Copper Interconnects Having A Titanium-titanium Nitride Assembly Between Copper And Compound Semiconductor App 20130234333 - Cheng; Kezia	2013-09-12
Copper Interconnects Having A Titanium-platinum-titanium Assembly Between Copper And Compound Semiconductor App 20130228924 - Cheng; Kezia	2013-09-05
Devices And Methods Related To A Sputtered Titanium Tungsten Layer Formed Over A Copper Interconnect Stack Structure App 20130221528 - Cheng; Kezia	2013-08-29
Systems And Methods For Improving Front-side Process Uniformity By Back-side Metallization App 20130143411 - Cheng; Kezia	2013-06-06
Electron Radiation Monitoring System To Prevent Gold Spitting And Resist Cross-linking During Evaporation App 20130069622 - Cheng; Kezia	2013-03-21
Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation Grant 8,373,427 - Cheng February 12, 2	2013-02-12
Electron Radiation Monitoring System To Prevent Gold Spitting And Resist Cross-linking During Evaporation App 20110193576 - Cheng; Kezia	2011-08-11

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