Cheng; Kenneth C. K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Kenneth C. K..The latest application filed is for "encapsulated top via interconnects".
- Cheng; Kenneth C. K. - Albany NY
- Cheng; Kenneth C. K. - Shatin HK
| Patent | Date |
|---|---|
| Fully-aligned top-via structures with top-via trim Grant 11,282,768 - Cheng , et al. March 22, 2 | 2022-03-22 |
| Encapsulated Top Via Interconnects App 20220044967 - van der Straten; Oscar ; et al. | 2022-02-10 |
| Encapsulated top via interconnects Grant 11,177,171 - van der Straten , et al. November 16, 2 | 2021-11-16 |
| Fully aligned top vias with replacement metal lines Grant 11,139,202 - Park , et al. October 5, 2 | 2021-10-05 |
| Fully-aligned Top-via Structures With Top-via Trim App 20210143085 - Cheng; Kenneth C. K. ; et al. | 2021-05-13 |
| Encapsulated Top Via Interconnects App 20210098293 - van der Straten; Oscar ; et al. | 2021-04-01 |
| Fully Aligned Top Vias With Replacement Metal Lines App 20210098284 - Park; Chanro ; et al. | 2021-04-01 |
| Air-Gap Containing Metal Interconnects App 20200273743 - Cheng; Kenneth C. K. ; et al. | 2020-08-27 |
| Air-gap containing metal interconnects Grant 10,748,812 - Cheng , et al. A | 2020-08-18 |
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