Cheng; Kaun-I

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Kaun-I.The latest application filed is for "method for fabricating electronic package".

Company Profile

3.6.8

Cheng; Kaun-I - Taichung City TW
Cheng; Kaun-I - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Fabricating Electronic Package App 20210143021 - Chang; Shu-Chi ; et al.	2021-05-13
Electronic package, method for fabricating the same, and heat dissipator Grant 10,950,520 - Huang , et al. March 16, 2	2021-03-16
Electronic package and method for fabricating the same Grant 10,903,088 - Chang , et al. January 26, 2	2021-01-26
Electronic Package, Method For Fabricating The Same, And Heat Dissipator App 20200168523 - Huang; Yu-Lung ; et al.	2020-05-28
Method for fabricating electronic package having a protruding barrier frame Grant 10,396,040 - Jian , et al. A	2019-08-27
Electronic Package And Method For Fabricating The Same App 20180286701 - Chang; Shu-Chi ; et al.	2018-10-04
Method For Fabricating Electronic Package Having A Protruding Barrier Frame App 20180261552 - Jian; Yue-Ying ; et al.	2018-09-13
Electronic package having a protruding barrier frame Grant 9,997,469 - Jian , et al. June 12, 2	2018-06-12
Electronic Package And Method For Fabricating The Same App 20180040568 - Jian; Yue-Ying ; et al.	2018-02-08
Packaging substrate and fabrication method thereof Grant 9,171,741 - Wang , et al. October 27, 2	2015-10-27
Packaging Substrate And Fabrication Method Thereof App 20130115738 - Wang; Wei-Ping ; et al.	2013-05-09
Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same App 20040238923 - Lee, Te-Haw ; et al.	2004-12-02

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