loadpatents
Patent applications and USPTO patent grants for Cheng; Kai-Fang.The latest application filed is for "semiconductor structure and method making the same".
Patent | Date |
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Semiconductor device and manufacturing method thereof Grant 11,450,566 - Huang , et al. September 20, 2 | 2022-09-20 |
Semiconductor Structure and Method Making the Same App 20220262726 - Huang; Hsin-Yen ;   et al. | 2022-08-18 |
Metal Oxide Composite As Etch Stop Layer App 20220246468 - Cheng; Kai-Fang ;   et al. | 2022-08-04 |
Semiconductor Device Structure And Methods Of Forming The Same App 20220231012 - CHENG; Kai-Fang ;   et al. | 2022-07-21 |
Thermal Interconnect Structure For Thermal Management Of Electrical Interconnect Structure App 20220157690 - Lee; Shao-Kuan ;   et al. | 2022-05-19 |
Semiconductor structure and method making the same Grant 11,328,991 - Huang , et al. May 10, 2 | 2022-05-10 |
Metal oxide composite as etch stop layer Grant 11,315,828 - Cheng , et al. April 26, 2 | 2022-04-26 |
Forming interlayer dielectric material by spin-on metal oxide deposition Grant 11,049,811 - Teng , et al. June 29, 2 | 2021-06-29 |
Semiconductor Device And Manufacturing Method Thereof App 20210134666 - HUANG; Hsin-Yen ;   et al. | 2021-05-06 |
Adhesion promoter apparatus and method Grant 10,983,278 - Tseng , et al. April 20, 2 | 2021-04-20 |
Semiconductor device and manufacturing method thereof Grant 10,867,847 - Huang , et al. December 15, 2 | 2020-12-15 |
Semiconductor Structure and Method Making the Same App 20200328152 - Huang; Hsin-Yen ;   et al. | 2020-10-15 |
Semiconductor structure and method making the same Grant 10,700,000 - Huang , et al. | 2020-06-30 |
Metal Oxide Composite as Etch Stop Layer App 20200058546 - Cheng; Kai-Fang ;   et al. | 2020-02-20 |
Overlaying multi-source media in VRAM Grant 10,521,879 - Yeh , et al. Dec | 2019-12-31 |
Overlaying Multi-source Media In Vram App 20190259130 - Yeh; Chung-Chou ;   et al. | 2019-08-22 |
Overlaying multi-source media in VRAM Grant 10,332,296 - Yeh , et al. | 2019-06-25 |
Forming Interlayer Dielectric Material by Spin-On Metal Oxide Deposition App 20190131240 - Teng; Chi-Lin ;   et al. | 2019-05-02 |
Semiconductor device and manufacturing method thereof Grant 10,211,097 - Huang , et al. Feb | 2019-02-19 |
Adhesion Promoter Apparatus and Method App 20190025514 - Tseng; Chun-Hao ;   et al. | 2019-01-24 |
Forming interlayer dielectric material by spin-on metal oxide deposition Grant 10,163,797 - Teng , et al. Dec | 2018-12-25 |
Semiconductor Device And Manufacturing Method Thereof App 20180350669 - HUANG; Hsin-Yen ;   et al. | 2018-12-06 |
Semiconductor device structure Grant 10,090,245 - Cheng , et al. October 2, 2 | 2018-10-02 |
Adhesion promoter apparatus and method Grant 10,082,626 - Tseng , et al. September 25, 2 | 2018-09-25 |
Overlaying Multi-source Media In Vram App 20180253880 - Yeh; Chung-Chou ;   et al. | 2018-09-06 |
Self-Aligned Interconnection Structure and Method App 20180076132 - Tsai; Jung-Hsun ;   et al. | 2018-03-15 |
Processing apparatus and method Grant 9,892,946 - Cheng , et al. February 13, 2 | 2018-02-13 |
Semiconductor Device Structure App 20180033730 - CHENG; Kai-Fang ;   et al. | 2018-02-01 |
Processing Apparatus And Method App 20180033653 - Cheng; Kai-Fang ;   et al. | 2018-02-01 |
Self-aligned interconnection structure and method Grant 9,818,690 - Tsai , et al. November 14, 2 | 2017-11-14 |
Semiconductor device structure and method for forming the same Grant 9,799,603 - Cheng , et al. October 24, 2 | 2017-10-24 |
Semiconductor Structure And Method Making The Same App 20170256491 - Huang; Hsin-Yen ;   et al. | 2017-09-07 |
Semiconductor Device Structure And Method For Forming The Same App 20170213791 - CHENG; Kai-Fang ;   et al. | 2017-07-27 |
Semiconductor Device And Manufacturing Method Thereof App 20170194242 - HUANG; Hsin-Yen ;   et al. | 2017-07-06 |
Semiconductor structure and method making the same Grant 9,659,857 - Huang , et al. May 23, 2 | 2017-05-23 |
Self-Aligned Interconnection Structure and Method App 20170125340 - Tsai; Jung-Hsun ;   et al. | 2017-05-04 |
Forming Interlayer Dielectric Material By Spin-on Metal Oxide Deposition App 20170103949 - Teng; Chi-Lin ;   et al. | 2017-04-13 |
Adhesion Promoter Apparatus and Method App 20170075065 - Tseng; Chun-Hao ;   et al. | 2017-03-16 |
Semiconductor Structure and Method Making the Same App 20150171007 - HUANG; Hsin-Yen ;   et al. | 2015-06-18 |
Data correction apparatus, data correction method and tangible machine-readable medium thereof Grant 8,073,825 - Sheu , et al. December 6, 2 | 2011-12-06 |
Data Correction Apparatus, Data Correction Method And Tangible Machine-readable Medium Thereof App 20100153817 - SHEU; Shiann-Tsong ;   et al. | 2010-06-17 |
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