Cheng; Jen-Hau
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Jen-Hau.The latest application filed is for "thermal ground plane".
- Cheng; Jen-Hau - Boulder CO
- Cheng; Jen-Hau - Hsinchu City TW
- Cheng; Jen-Hau - New Providence NJ US
- Cheng; Jen-Hau - Taipei TW
- Cheng; Jen-Hau - Hsinchu TW
- Cheng; Jen-Hau - Taipei City TW
| Patent | Date |
|---|---|
| Thermal ground plane Grant 11,353,269 - Yang , et al. June 7, 2 | 2022-06-07 |
| Thermal Ground Plane App 20200191495 - Yang; Ronggui ; et al. | 2020-06-18 |
| Thermal ground plane Grant 10,571,200 - Yang , et al. Feb | 2020-02-25 |
| Thermal ground plane Grant 10,527,358 - Yang , et al. J | 2020-01-07 |
| Flexible thermal ground plane and manufacturing the same Grant 9,909,814 - Yang , et al. March 6, 2 | 2018-03-06 |
| Thermal Ground Plane App 20170299277 - Yang; Ronggui ; et al. | 2017-10-19 |
| Flexible thermal ground plane and manufacturing the same Grant 9,651,312 - Yang , et al. May 16, 2 | 2017-05-16 |
| Thermal Ground Plane App 20170030654 - Yang; Ronggui ; et al. | 2017-02-02 |
| Flexible Thermal Ground Plane And Manufacturing The Same App 20160187070 - Yang; Ronggui ; et al. | 2016-06-30 |
| Flexible thermal ground plane and manufacturing the same Grant 9,163,883 - Yang , et al. October 20, 2 | 2015-10-20 |
| Flexible Thermal Ground Plane And Manufacturing The Same App 20150226493 - Yang; Ronggui ; et al. | 2015-08-13 |
| Cooling Technique App 20140209288 - Simon; Maria Elina ; et al. | 2014-07-31 |
| Mechanically-reattachable liquid-cooled cooling apparatus Grant 8,542,489 - Arney , et al. September 24, 2 | 2013-09-24 |
| Micro thermoelectric device and manufacturing method thereof Grant 8,426,720 - Liu , et al. April 23, 2 | 2013-04-23 |
| Mechanically-reattachable Liquid-cooled Cooling Apparatus App 20120281359 - Arney; Susanne ; et al. | 2012-11-08 |
| Cooling Apparatus For Communications Platforms App 20120279683 - Arney; Susanne ; et al. | 2012-11-08 |
| Flexible Thermal Ground Plane And Manufacturing The Same App 20110017431 - Yang; Ronggui ; et al. | 2011-01-27 |
| Method of fabricating an entegral device of a biochip intergrated with micro thermo-electric elements and the apparatus thereof Grant 7,550,289 - Cheng , et al. June 23, 2 | 2009-06-23 |
| Light-emitting-diode packaging structure having thermal-electric element App 20070012938 - Yu; Chih-Kuang ; et al. | 2007-01-18 |
| Oxidation resistane strcuture for metal insulatormetal capacitor App 20060216815 - Cheng; Jen-Hau ; et al. | 2006-09-28 |
| Cooling structure of solid state and formation thereof with integrated package App 20060156737 - Liu; Chun-Kai ; et al. | 2006-07-20 |
| Micro thermoelectric device and manufacturing method thereof App 20050150538 - Liu, Chun-Kai ; et al. | 2005-07-14 |
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