Cheng; Hsu-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Hsu-Ming.The latest application filed is for "aqueous coating material for synthetic papers and synthetic paper using the same".

Company Profile

1.10.10

Cheng; Hsu-Ming - TAIPEI TW
Cheng; Hsu Ming - Hsin-chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Aqueous Coating Material For Synthetic Papers And Synthetic Paper Using The Same App 20210087750 - LIAO; TE-CHAO ; et al.	2021-03-25
Preparation of hollow polymer microspheres Grant 8,940,363 - Fung , et al. January 27, 2	2015-01-27
Preparation Of Hollow Polymer Microspheres App 20140050845 - Fung; Dein Run ; et al.	2014-02-20
Universal array type probe card design for semiconductor device testing Grant 8,248,091 - Cheng , et al. August 21, 2	2012-08-21
Chip-probing and bumping solutions for stacked dies having through-silicon vias Grant 7,781,235 - Luo , et al. August 24, 2	2010-08-24
Space transformer having multi-layer pad structures Grant 7,759,776 - Cheng July 20, 2	2010-07-20
Ultra-fine area array pitch probe card Grant 7,733,102 - Cheng June 8, 2	2010-06-08
Ultra-fine pitch probe card structure Grant 7,696,766 - Cheng , et al. April 13, 2	2010-04-13
Ultra-fine pitch probe card structure Grant 7,642,793 - Cheng , et al. January 5, 2	2010-01-05
Test structures for stacking dies having through-silicon vias Grant 7,598,523 - Luo , et al. October 6, 2	2009-10-06
Ultra-Fine Area Array Pitch Probe Card App 20090015275 - Cheng; Hsu Ming	2009-01-15
Test structures for stacking dies having through-silicon vias App 20080272372 - Luo; Wen-Liang ; et al.	2008-11-06
Ultra-fine pitch probe card structure App 20080180123 - Cheng; Hsu Ming ; et al.	2008-07-31
Chip-probing and bumping solutions for stacked dies having through-silicon vias App 20080153187 - Luo; Wen-Liang ; et al.	2008-06-26
Ultra-Fine Pitch Probe Card Structure App 20080116923 - Cheng; Hsu Ming ; et al.	2008-05-22
Pad structures and methods for forming pad structures App 20070235873 - Cheng; Hsu Ming	2007-10-11
Method and apparatus for providing PCB layout for probe card Grant 7,154,285 - Cheng December 26, 2	2006-12-26
Method and apparatus for providing PCB layout for probe card App 20060066329 - Cheng; Hsu Ming	2006-03-30

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