| Patent | Date |
|---|
Mems Microphone And Mems Accelerometer On A Single Substrate
App 20220289556 - Cheng; Chun-Wen ; et al. | 2022-09-15 |
Semiconductor structure and method for fabricating the same
Grant 11,434,129 - Cheng , et al. September 6, 2 | 2022-09-06 |
Manufacturing method of sensor in an internet-of-things
Grant 11,414,763 - Lei , et al. August 16, 2 | 2022-08-16 |
MEMS device with enhanced membrane structure and method of forming the same
Grant 11,418,887 - Cheng , et al. August 16, 2 | 2022-08-16 |
Semiconductor Device Structure With Movable Membrane And Method For Manufacturing The Same
App 20220227618 - TENG; Yi-Chuan ; et al. | 2022-07-21 |
Micro-electro Mechanical System Device Containing A Bump Stopper And Methods For Forming The Same
App 20220212917 - CHENG; Chun-wen ; et al. | 2022-07-07 |
Wire-bond Damper For Shock Absorption
App 20220162058 - Hsieh; Tsung-Lin ; et al. | 2022-05-26 |
Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
Grant 11,342,266 - Cheng , et al. May 24, 2 | 2022-05-24 |
Semiconductor structure for MEMS device
Grant 11,312,623 - Liu , et al. April 26, 2 | 2022-04-26 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220112074 - MAO; WEI-JHIH ; et al. | 2022-04-14 |
Method of forming semiconductor device structure
Grant 11,292,712 - Teng , et al. April 5, 2 | 2022-04-05 |
Method for forming biochips and biochips with non-organic landings for improved thermal budget
Grant 11,280,786 - Chu , et al. March 22, 2 | 2022-03-22 |
Micro-electro mechanical system device containing a bump stopper and methods for forming the same
Grant 11,279,611 - Cheng , et al. March 22, 2 | 2022-03-22 |
Mems Device With Dummy-area Utilization For Pressure Enhancement
App 20220063994 - Cheng; Chun-Wen ; et al. | 2022-03-03 |
Vacuum Wafer Chuck For Manufacturing Semiconductor Devices
App 20220059393 - LEE; Chien-Fa ; et al. | 2022-02-24 |
Semiconductor manufacturing method and structure thereof
Grant 11,254,564 - Cheng , et al. February 22, 2 | 2022-02-22 |
CMOS-MEMS integration with through-chip via process
Grant 11,235,969 - Cheng , et al. February 1, 2 | 2022-02-01 |
Outgassing Material Coated Cavity For A Micro-electro Mechanical System Device And Methods For Forming The Same
App 20220024756 - CHANG; Kuei-Sung ; et al. | 2022-01-27 |
Sensor device and manufacturing method thereof
Grant 11,206,493 - Yang , et al. December 21, 2 | 2021-12-21 |
Sensor device and manufacturing method thereof
Grant 11,186,481 - Yang , et al. November 30, 2 | 2021-11-30 |
Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
Grant 11,180,363 - Chang , et al. November 23, 2 | 2021-11-23 |
Integrated microphone device and manufacturing method thereof
Grant 11,184,694 - Cheng , et al. November 23, 2 | 2021-11-23 |
MEMS device with dummy-area utilization for pressure enhancement
Grant 11,174,158 - Cheng , et al. November 16, 2 | 2021-11-16 |
Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure
App 20210309508 - Chang; Kuei-Sung ; et al. | 2021-10-07 |
Dual Back-plate And Diaphragm Microphone
App 20210314707 - Cheng; Chun-Wen ; et al. | 2021-10-07 |
Biochip Having A Channel
App 20210302367 - LIU; Yi-Shao ; et al. | 2021-09-30 |
MEMS devices including MEMS dies and connectors thereto
Grant 11,117,796 - Cheng , et al. September 14, 2 | 2021-09-14 |
Backside CMOS compatible BioFET with no plasma induced damage
Grant 11,099,152 - Liu , et al. August 24, 2 | 2021-08-24 |
Outgassing Material Coated Cavity For A Micro-electro Mechanical System Device And Methods For Forming The Same
App 20210246014 - Chang; Kuei-Sung ; et al. | 2021-08-12 |
MEMS microphone having diaphragm
Grant 11,089,408 - Cheng , et al. August 10, 2 | 2021-08-10 |
Support Structure For Mems Device With Particle Filter
App 20210238030 - Cheng; Chun-Wen ; et al. | 2021-08-05 |
Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices
Grant 11,078,074 - Cheng , et al. August 3, 2 | 2021-08-03 |
Dual back-plate and diaphragm microphone
Grant 11,051,109 - Cheng , et al. June 29, 2 | 2021-06-29 |
Particle Filter For Mems Device
App 20210188627 - Chu; Chia-Hua ; et al. | 2021-06-24 |
Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure
Grant 11,040,870 - Chang , et al. June 22, 2 | 2021-06-22 |
Micro-electro Mechanical System Device Containing A Bump Stopper And Methods For Forming The Same
App 20210179419 - CHENG; Chun-wen ; et al. | 2021-06-17 |
Fluid deposition apparatus and method
Grant 11,027,310 - Cheng , et al. June 8, 2 | 2021-06-08 |
Method of forming semiconductor package and semiconductor package
Grant 11,014,805 - Cheng , et al. May 25, 2 | 2021-05-25 |
Method of using biochip with biosensors
Grant 10,989,685 - Liu , et al. April 27, 2 | 2021-04-27 |
Support structure for MEMS device with particle filter
Grant 10,968,097 - Cheng , et al. April 6, 2 | 2021-04-06 |
Semiconductor Structure And Method For Manufacturing Thereof
App 20210098681 - CHENG; CHUN-WEN ; et al. | 2021-04-01 |
Method For Forming Semiconductor Device
App 20210087052 - YANG; CHEN HSIUNG ; et al. | 2021-03-25 |
Mems Structure And Manufacturing Method Thereof
App 20210087056 - HUANG; KANG-CHE ; et al. | 2021-03-25 |
Biofet With Increased Sensing Area
App 20210072181 - CHENG; Chun-Wen ; et al. | 2021-03-11 |
Particle filter for MEMS device
Grant 10,941,034 - Chu , et al. March 9, 2 | 2021-03-09 |
Mems Device With Enhanced Membrane Structure And Method Of Forming The Same
App 20210067880 - CHENG; CHUN-WEN ; et al. | 2021-03-04 |
Particle Filter For Mems Device
App 20210047175 - Chu; Chia-Hua ; et al. | 2021-02-18 |
Support Structure For Mems Device With Particle Filter
App 20210047176 - Cheng; Chun-Wen ; et al. | 2021-02-18 |
Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure
App 20210024348 - Chang; Kuei-Sung ; et al. | 2021-01-28 |
Structure and Method for Integrated Microphone
App 20200413210 - Peng; Jung-Huei ; et al. | 2020-12-31 |
MEMS device and method for forming the same
Grant 10,865,099 - Yang , et al. December 15, 2 | 2020-12-15 |
Biosensor calibration system and related method
Grant 10,845,450 - Wen , et al. November 24, 2 | 2020-11-24 |
Semiconductor Structure For Mems Device
App 20200361767 - Liu; Yu-Chia ; et al. | 2020-11-19 |
Method For Integrating Complementary Metal-oxide-semiconductor (cmos) Devices With Microelectromechanical Systems (mems) Devices Using A Flat Surface Above A Sacrificial Layer
App 20200346925 - Cheng; Chun-Wen ; et al. | 2020-11-05 |
Method of fabricating a biological field-effect transistor (BioFET) with increased sensing area
Grant 10,823,696 - Cheng , et al. November 3, 2 | 2020-11-03 |
Mems Devices Including Mems Dies And Connectors Thereto
App 20200339412 - Cheng; Chun-Wen ; et al. | 2020-10-29 |
Method and Structure for CMOS-MEMS Thin Film Encapsulation
App 20200317506 - Liu; Yu-Chia ; et al. | 2020-10-08 |
Mems Microphone Having Diaphragm
App 20200322733 - Cheng; Chun-Wen ; et al. | 2020-10-08 |
Method for manufacturing a microphone
Grant 10,779,100 - Peng , et al. Sept | 2020-09-15 |
Semiconductor structure for MEMS device
Grant 10,752,497 - Liu , et al. A | 2020-08-25 |
Biosensor device and related method
Grant 10,746,693 - Huang , et al. A | 2020-08-18 |
Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
Grant 10,745,271 - Cheng , et al. A | 2020-08-18 |
Semiconductor Manufacturing Method And Structure Thereof
App 20200231431 - Cheng; Chun-Wen ; et al. | 2020-07-23 |
MEMS devices including MEMS dies and connectors thereto
Grant 10,710,871 - Cheng , et al. | 2020-07-14 |
MEMS microphone having diaphragm
Grant 10,715,924 - Cheng , et al. | 2020-07-14 |
Integrated Microphone Device And Manufacturing Method Thereof
App 20200213701 - CHENG; Chun-Wen ; et al. | 2020-07-02 |
Method and structure for CMOS-MEMS thin film encapsulation
Grant 10,689,247 - Liu , et al. | 2020-06-23 |
Cmos Compatible Biofet
App 20200150080 - KALNITSKY; Alexander ; et al. | 2020-05-14 |
Method Of Forming Semiconductor Device Structure
App 20200140259 - Teng; Yi-Chuan ; et al. | 2020-05-07 |
Cmos-mems Integration With Through-chip Via Process
App 20200131028 - Cheng; Chun-Wen ; et al. | 2020-04-30 |
Mems Device With Dummy-area Utilization For Pressure Enhancement
App 20200131032 - Cheng; Chun-Wen ; et al. | 2020-04-30 |
Integration Scheme For Microelectromechanical Systems (mems) Devices And Complementary Metal-oxide-semiconductor (cmos) Devices
App 20200115222 - Cheng; Chun-Wen ; et al. | 2020-04-16 |
Manufacturing method of semiconductor structure including heater
Grant 10,618,804 - Cheng , et al. | 2020-04-14 |
Manufacturing Method Of Sensor In An Internet-of-things
App 20200109476 - LEI; MING-TA ; et al. | 2020-04-09 |
Dual Back-plate And Diaphragm Microphone
App 20200107130 - Cheng; Chun-Wen ; et al. | 2020-04-02 |
Integrated microphone device and manufacturing method thereof
Grant 10,609,463 - Cheng , et al. | 2020-03-31 |
Mems Device And Method For Forming The Same
App 20200071157 - YANG; CHEN HSIUNG ; et al. | 2020-03-05 |
Backside CMOS Compatible BioFET with No Plasma Induced Damage
App 20200072789 - LIU; Yi-Shao ; et al. | 2020-03-05 |
Method Of Using Integrated Electro-microfluidic Probe Card
App 20200025713 - LIU; Yi-Shao ; et al. | 2020-01-23 |
Method For Integrating Complementary Metal-oxide-semiconductor (cmos) Devices With Microelectromechanical Systems (mems) Devices
App 20200024135 - Cheng; Chun-Wen ; et al. | 2020-01-23 |
MEMS Devices Including MEMS Dies and Connectors Thereto
App 20200024129 - Cheng; Chun-Wen ; et al. | 2020-01-23 |
Structure and formation method of semiconductor device structure
Grant 10,526,196 - Teng , et al. J | 2020-01-07 |
Method Of Forming Semiconductor Package And Semiconductor Package
App 20200002161 - CHENG; Chun-wen ; et al. | 2020-01-02 |
CMOS compatible BioFET
Grant 10,520,467 - Kalnitsky , et al. Dec | 2019-12-31 |
MEMS pressure sensor and microphone devices having through-vias and methods of forming same
Grant 10,519,032 - Cheng , et al. Dec | 2019-12-31 |
Mems Microphone Having Diaphragm
App 20190394573 - Cheng; Chun-Wen ; et al. | 2019-12-26 |
Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices
Grant 10,513,429 - Cheng , et al. Dec | 2019-12-24 |
MEMS devices including MEMS dies and connectors thereto
Grant 10,508,023 - Cheng , et al. Dec | 2019-12-17 |
Sensor in an internet-of-things and manufacturing method of the same
Grant 10,508,345 - Lei , et al. Dec | 2019-12-17 |
MEMS integrated pressure sensor devices and methods of forming same
Grant 10,508,029 - Chu , et al. Dec | 2019-12-17 |
MEMS devices and methods of manufacturing the same
Grant 10,494,252 - Liu , et al. De | 2019-12-03 |
Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer
Grant 10,486,964 - Chu , et al. Nov | 2019-11-26 |
Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
Grant 10,472,233 - Cheng , et al. Nov | 2019-11-12 |
Backside CMOS compatible BioFET with no plasma induced damage
Grant 10,473,616 - Liu , et al. Nov | 2019-11-12 |
Sensor Device And Manufacturing Method Thereof
App 20190306633 - YANG; Chen Hsiung ; et al. | 2019-10-03 |
Method of using integrated electro-microfluidic probe card
Grant 10,429,341 - Liu , et al. October 1, 2 | 2019-10-01 |
Method of forming micro electromechanical system sensor
Grant 10,384,933 - Cheng , et al. A | 2019-08-20 |
MEMS device with viewer window and manufacturing method thereof
Grant 10,351,417 - Cheng , et al. July 16, 2 | 2019-07-16 |
Virtual Reality Device, Image Processing Method, And Non-transitory Computer Readable Storage Medium
App 20190164329 - WU; Yu-Ting ; et al. | 2019-05-30 |
Sensor Device And Manufacturing Method Thereof
App 20190162753 - YANG; Chen Hsiung ; et al. | 2019-05-30 |
Structure And Formation Method Of Semiconductor Device Structure
App 20190135610 - Teng; Yi-Chuan ; et al. | 2019-05-09 |
Integrated Microphone Device And Manufacturing Method Thereof
App 20190132662 - CHENG; Chun-Wen ; et al. | 2019-05-02 |
Micro-electro-mechanical system and manufacturing method thereof
Grant 10,273,148 - Cheng , et al. | 2019-04-30 |
Multi-pressure MEMS package
Grant 10,273,144 - Liu , et al. | 2019-04-30 |
MEMS device with enhanced sensing structure and manufacturing method thereof
Grant 10,266,396 - Shen , et al. | 2019-04-23 |
Semiconductor Structure For Mems Device
App 20190112183 - Liu; Yu-Chia ; et al. | 2019-04-18 |
Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget
App 20190101531 - Chu; Chia-Hua ; et al. | 2019-04-04 |
Mems Device With Viewer Window And Manufacturing Method Thereof
App 20190062151 - CHENG; CHUN-WEN ; et al. | 2019-02-28 |
Method For Integrating Complementary Metal-oxide-semiconductor (cmos) Devices With Microelectromechanical Systems (mems) Devices Using A Flat Surface Above A Sacrificial Layer
App 20190055120 - Cheng; Chun-Wen ; et al. | 2019-02-21 |
Semiconductor structure with cavity spacing monitoring functions
Grant 10,202,278 - Peng , et al. Feb | 2019-02-12 |
Backside sensing BioFET with enhanced performance
Grant 10,184,912 - Cheng , et al. Ja | 2019-01-22 |
MEMS devices and fabrication methods thereof
Grant 10,160,633 - Chu , et al. Dec | 2018-12-25 |
Semiconductor structure for MEMS Device
Grant 10,160,639 - Liu , et al. Dec | 2018-12-25 |
Mechanisms for forming micro-electro mechanical system device
Grant 10,160,640 - Cheng , et al. Dec | 2018-12-25 |
Method and apparatus for a semiconductor structure
Grant 10,160,638 - Chu , et al. Dec | 2018-12-25 |
Getter, MEMS device and method of forming the same
Grant 10,155,214 - Liang , et al. Dec | 2018-12-18 |
Fluid deposition appartus and method
Grant 10,155,244 - Cheng , et al. Dec | 2018-12-18 |
Vacuum sealed MEMS and CMOS package
Grant 10,155,659 - Cheng , et al. Dec | 2018-12-18 |
MEMS devices and fabrication methods thereof
Grant 10,155,655 - Chu , et al. Dec | 2018-12-18 |
Semiconductor Manufacturing Method
App 20180346319 - CHENG; CHUN-WEN ; et al. | 2018-12-06 |
Method for forming biochips and biochips with non-organic landings for improved thermal budget
Grant 10,145,847 - Chu , et al. De | 2018-12-04 |
Mems Device With Enhanced Sensing Structure And Manufacturing Method Thereof
App 20180339899 - SHEN; CHING-KAI ; et al. | 2018-11-29 |
Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
Grant 10,138,116 - Cheng , et al. Nov | 2018-11-27 |
Method for fabricating MEMS switch with reduced dielectric charging effect
Grant 10,134,552 - Chu , et al. November 20, 2 | 2018-11-20 |
MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same
App 20180327254 - Cheng; Chun-Wen ; et al. | 2018-11-15 |
BioFET With Increased Sensing Area
App 20180313783 - CHENG; Chun-Wen ; et al. | 2018-11-01 |
MEMS Integrated Pressure Sensor Devices and Methods of Forming Same
App 20180305201 - Chu; Chia-Hua ; et al. | 2018-10-25 |
MEMS humidity sensor and method of manufacturing the same
Grant 10,101,292 - Chen , et al. October 16, 2 | 2018-10-16 |
Amplified dual-gate bio field effect transistor
Grant 10,094,801 - Liu , et al. October 9, 2 | 2018-10-09 |
Structure and Method for Integrated Microphone
App 20180288549 - Peng; Jung-Huei ; et al. | 2018-10-04 |
Stacked Semiconductor Structure and Method of Forming the Same
App 20180265351 - Chu; Chia-Hua ; et al. | 2018-09-20 |
MEMS device and manufacturing method thereof
Grant 10,065,852 - Cheng , et al. September 4, 2 | 2018-09-04 |
Backside Sensing BioFET with Enhanced Performance
App 20180238827 - CHENG; Chun-Wen ; et al. | 2018-08-23 |
Semiconductor structure and manufacturing method thereof
Grant 10,035,700 - Cheng , et al. July 31, 2 | 2018-07-31 |
MEMS Devices Including MEMS Dies and Connectors Thereto
App 20180194613 - Cheng; Chun-Wen ; et al. | 2018-07-12 |
Cmos Compatible Biofet
App 20180195998 - Kalnitsky; Alexander ; et al. | 2018-07-12 |
Method Of Using Biochip With Biosensors
App 20180195999 - LIU; Yi-Shao ; et al. | 2018-07-12 |
MEMS pressure sensor and microphone devices having through-vias and methods of forming same
Grant 10,017,378 - Cheng , et al. July 10, 2 | 2018-07-10 |
MEMS integrated pressure sensor devices and methods of forming same
Grant 10,017,382 - Chu , et al. July 10, 2 | 2018-07-10 |
Method for manufacturing a microphone
Grant 9,998,843 - Peng , et al. June 12, 2 | 2018-06-12 |
Method For Integrating Complementary Metal-oxide-semiconductor (cmos) Devices With Microelectromechanical Systems (mems) Devices Using A Flat Surface Above A Sacrificial Layer
App 20180148326 - Cheng; Chun-Wen ; et al. | 2018-05-31 |
MEMS integrated pressure sensor and microphone devices and methods of forming same
Grant 9,981,841 - Chu , et al. May 29, 2 | 2018-05-29 |
Stacked semiconductor structure and method of forming the same
Grant 9,975,762 - Chu , et al. May 22, 2 | 2018-05-22 |
Backside sensing BioFET with enhanced performance
Grant 9,976,982 - Cheng , et al. May 22, 2 | 2018-05-22 |
Method and Structure for CMOS-MEMS Thin Film Encapsulation
App 20180118560 - Liu; Yu-Chia ; et al. | 2018-05-03 |
MEMS device structure with a capping structure
Grant 9,938,138 - Cheng , et al. April 10, 2 | 2018-04-10 |
Integrated biosensor
Grant 9,933,388 - Cheng , et al. April 3, 2 | 2018-04-03 |
Mems Device And Manufacturing Method Thereof
App 20180086624 - CHENG; CHUN-WEN ; et al. | 2018-03-29 |
MEMS devices including MEMS dies and connectors thereto
Grant 9,919,914 - Cheng , et al. March 20, 2 | 2018-03-20 |
Biochip with biosensors and fluidic devices
Grant 9,915,630 - Liu , et al. March 13, 2 | 2018-03-13 |
Semiconductor Structure With Cavity Spacing Monitoring Functions
App 20180065841 - PENG; JUNG-HUEI ; et al. | 2018-03-08 |
CMOS compatible BioFET
Grant 9,910,009 - Kalnitsky , et al. March 6, 2 | 2018-03-06 |
Vacuum Sealed MEMS and CMOS Package
App 20180029881 - Cheng; Chun-Wen ; et al. | 2018-02-01 |
Integration Scheme For Microelectromechanical Systems (mems) Devices And Complementary Metal-oxide-semiconductor (cmos) Devices
App 20180029882 - Cheng; Chun-Wen ; et al. | 2018-02-01 |
Multiple bonding in wafer level packaging
Grant 9,873,610 - Lin , et al. January 23, 2 | 2018-01-23 |
Method and structure for CMOS-MEMS thin film encapsulation
Grant 9,868,628 - Liu , et al. January 16, 2 | 2018-01-16 |
Semiconductor Structure For Mems Device
App 20170369308 - Liu; Yu-Chia ; et al. | 2017-12-28 |
MEMS integrated pressure sensor devices having isotropic cavitites and methods of forming same
Grant 9,850,125 - Chu , et al. December 26, 2 | 2017-12-26 |
Biosensor Calibration System And Related Method
App 20170363704 - WEN; Chin-Hua ; et al. | 2017-12-21 |
MEMS and CMOS integration with low-temperature bonding
Grant 9,822,000 - Cheng , et al. November 21, 2 | 2017-11-21 |
Semiconductor sensing structure and manufacturing method thereof
Grant 9,815,685 - Chang , et al. November 14, 2 | 2017-11-14 |
CMOS Compatible BioFET
App 20170322177 - Kalnitsky; Alexander ; et al. | 2017-11-09 |
Backside CMOS Compatible BioFET With No Plasma Induced Damage
App 20170315085 - LIU; Yi-Shao ; et al. | 2017-11-02 |
Method Of Forming Micro Electromechanical System Sensor
App 20170313581 - CHENG; Chun-wen ; et al. | 2017-11-02 |
Biosensor Device and Related Method
App 20170315084 - Huang; Jui-Cheng ; et al. | 2017-11-02 |
Biosensor calibration system and related method
Grant 9,797,976 - Wen , et al. October 24, 2 | 2017-10-24 |
Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
Grant 9,796,582 - Cheng , et al. October 24, 2 | 2017-10-24 |
CMOS compatible BioFET
Grant 9,791,406 - Kalnitsky , et al. October 17, 2 | 2017-10-17 |
Multi-pressure Mems Package
App 20170283250 - Liu; Yu-Chia ; et al. | 2017-10-05 |
Vacuum sealed MEMS and CMOS package
Grant 9,776,856 - Cheng , et al. October 3, 2 | 2017-10-03 |
Method and Structure for CMOS-MEMS Thin Film Encapsulation
App 20170260042 - Liu; Yu-Chia ; et al. | 2017-09-14 |
Mems Humidity Sensor And Method Of Manufacturing The Same
App 20170248536 - CHEN; Tung-Tsun ; et al. | 2017-08-31 |
MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same
App 20170247251 - Chu; Chia-Hua ; et al. | 2017-08-31 |
Structures and formation methods of micro-electro mechanical system device
Grant 9,725,301 - Chu , et al. August 8, 2 | 2017-08-08 |
MEMS device and multi-layered structure
Grant 9,725,299 - Cheng , et al. August 8, 2 | 2017-08-08 |
Micro electromechanical system sensor and method of forming the same
Grant 9,725,310 - Cheng , et al. August 8, 2 | 2017-08-08 |
Mems Device And Multi-layered Structure
App 20170210614 - CHENG; CHUN-WEN ; et al. | 2017-07-27 |
Amplified Dual-Gate Bio Field Effect Transistor
App 20170205371 - LIU; Yi-Shao ; et al. | 2017-07-20 |
Backside CMOS compatible BioFET with no plasma induced damage
Grant 9,709,525 - Liu , et al. July 18, 2 | 2017-07-18 |
Mechanisms For Forming Micro-electro Mechanical System Device
App 20170197821 - CHU; Chia-Hua ; et al. | 2017-07-13 |
Biosensor device and related method
Grant 9,702,846 - Huang , et al. July 11, 2 | 2017-07-11 |
Multi-pressure MEMS package
Grant 9,695,039 - Liu , et al. July 4, 2 | 2017-07-04 |
Amplified dual-gate bio field effect transistor
Grant 9,689,835 - Liu , et al. June 27, 2 | 2017-06-27 |
Integrated semiconductor device and wafer level method of fabricating the same
Grant 9,691,725 - Chang , et al. June 27, 2 | 2017-06-27 |
MEMS Device Structure with a Capping Structure
App 20170158494 - Cheng; Chun-Wen ; et al. | 2017-06-08 |
CMOS-MEMS device structure, bonding mesa structure and associated method
Grant 9,656,852 - Cheng , et al. May 23, 2 | 2017-05-23 |
MEMS integrated pressure sensor and microphone devices and methods of forming same
Grant 9,650,239 - Chu , et al. May 16, 2 | 2017-05-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170129771 - CHENG; CHUN-WEN ; et al. | 2017-05-11 |
Semiconductor Device And Method For Fabricating The Same
App 20170129772 - CHENG; CHUN-WEN ; et al. | 2017-05-11 |
MEMS structure and manufacturing method thereof
Grant 9,630,837 - Chu , et al. April 25, 2 | 2017-04-25 |
Process control monitoring for biochips
Grant 9,625,493 - Liu , et al. April 18, 2 | 2017-04-18 |
Sensor In An Internet-of-things And Manufacturing Method Of The Same
App 20170102353 - LEI; MING-TA ; et al. | 2017-04-13 |
Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate
Grant 9,617,150 - Chu , et al. April 11, 2 | 2017-04-11 |
Semiconductor device
Grant 9,617,143 - Cheng , et al. April 11, 2 | 2017-04-11 |
Dual layer microelectromechanical systems device and method of manufacturing same
Grant 9,617,147 - Chu , et al. April 11, 2 | 2017-04-11 |
Self-removal anti-stiction coating for bonding process
Grant 9,611,141 - Liu , et al. April 4, 2 | 2017-04-04 |
MEMS device
Grant 9,604,840 - Cheng , et al. March 28, 2 | 2017-03-28 |
MEMS devices and methods for forming same
Grant 9,604,843 - Cheng , et al. March 28, 2 | 2017-03-28 |
Mems Devices And Methods Of Manufacturing The Same
App 20170081173 - LIU; YU-CHIA ; et al. | 2017-03-23 |
Fluid Deposition Apparatus and Method
App 20170065958 - Cheng; Chun-Wen ; et al. | 2017-03-09 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170066646 - CHENG; CHUN-WEN ; et al. | 2017-03-09 |
Method Of Using Integrated Electro-microfluidic Probe Card
App 20170059515 - LIU; Yi-Shao ; et al. | 2017-03-02 |
Mems And Cmos Integration With Low-temperature Bonding
App 20170057814 - Cheng; Chun-Wen ; et al. | 2017-03-02 |
MEMS device structure with a capping structure
Grant 9,573,806 - Cheng , et al. February 21, 2 | 2017-02-21 |
Micro-electro-mechanical System And Manufacturing Method Thereof
App 20170044004 - CHENG; CHUN-WEN ; et al. | 2017-02-16 |
Semiconductor device and method for fabricating the same
Grant 9,567,208 - Cheng , et al. February 14, 2 | 2017-02-14 |
Structures and formation methods of micro-electro mechanical system device
Grant 9,567,206 - Chu , et al. February 14, 2 | 2017-02-14 |
Semiconductor structure and manufacturing method thereof
Grant 9,567,209 - Cheng , et al. February 14, 2 | 2017-02-14 |
Multi-pressure MEMS package
Grant 9,567,210 - Cheng , et al. February 14, 2 | 2017-02-14 |
Mechanisms For Forming Micro-electro Mechanical System Device
App 20170036909 - CHENG; Chun-Wen ; et al. | 2017-02-09 |
Cmos Compatible Biofet
App 20170023521 - KALNITSKY; Alexander ; et al. | 2017-01-26 |
MEMS device with release aperture
Grant 9,550,666 - Lin , et al. January 24, 2 | 2017-01-24 |
Integrated Biosensor
App 20170016851 - Cheng; Chun-Wen ; et al. | 2017-01-19 |
Cmos-mems Device Structure, Bonding Mesa Structure And Associated Method
App 20170008757 - CHENG; CHUN-WEN ; et al. | 2017-01-12 |
MEMS Devices and Fabrication Methods Thereof
App 20170008758 - Chu; Chia-Hua ; et al. | 2017-01-12 |
MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same
App 20170001859 - Cheng; Chun-Wen ; et al. | 2017-01-05 |
MEMS Devices and Fabrication Methods Thereof
App 20170001860 - Chu; Chia-Hua ; et al. | 2017-01-05 |
MEMS structures and methods for forming the same
Grant 9,533,876 - Liu , et al. January 3, 2 | 2017-01-03 |
MEMS Devices and Methods for Forming Same
App 20160368762 - Cheng; Chun-Wen ; et al. | 2016-12-22 |
Sensor integration with an outgassing barrier and a stable electrical signal path
Grant 9,522,822 - Cheng , et al. December 20, 2 | 2016-12-20 |
Integrated electro-microfluidic probe card, system and method for using the same
Grant 9,523,642 - Liu , et al. December 20, 2 | 2016-12-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160362292 - CHANG; YI-HSIEN ; et al. | 2016-12-15 |
MEMS device with a capping substrate
Grant 9,511,997 - Cheng , et al. December 6, 2 | 2016-12-06 |
Methods and apparatus for MEMS devices with increased sensitivity
Grant 9,505,605 - Chu , et al. November 29, 2 | 2016-11-29 |
Capacitor with planarized bonding for CMOS-MEMS integration
Grant 9,493,346 - Shen , et al. November 15, 2 | 2016-11-15 |
Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate
Grant 9,487,391 - Cheng , et al. November 8, 2 | 2016-11-08 |
Biosensor with a sensing surface on an interlayer dielectric
Grant 9,488,615 - Cheng , et al. November 8, 2 | 2016-11-08 |
Backside Sensing BioFET with Enhanced Performance
App 20160320337 - Cheng; Chun-Wen ; et al. | 2016-11-03 |
Semiconductor device with through molding vias and method of making the same
Grant 9,469,524 - Cheng , et al. October 18, 2 | 2016-10-18 |
MEMS pressure sensor and microphone devices having through-vias and methods of forming same
Grant 9,469,527 - Cheng , et al. October 18, 2 | 2016-10-18 |
CMOS compatible BioFET
Grant 9,459,234 - Kalnitsky , et al. October 4, 2 | 2016-10-04 |
Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone
Grant 9,462,402 - Cho , et al. October 4, 2 | 2016-10-04 |
Gas sensor, integrated circuit device using the same, and manufacturing method thereof
Grant 9,459,224 - Cheng , et al. October 4, 2 | 2016-10-04 |
MEMS devices and fabrication methods thereof
Grant 9,452,924 - Chu , et al. September 27, 2 | 2016-09-27 |
MEMS devices and fabrication methods thereof
Grant 9,450,109 - Chu , et al. September 20, 2 | 2016-09-20 |
Isolation structure for MEMS 3D IC integration
Grant 9,446,945 - Tsai , et al. September 20, 2 | 2016-09-20 |
VHF etch barrier for semiconductor integrated microsystem
Grant 9,449,867 - Wu , et al. September 20, 2 | 2016-09-20 |
Multi-pressure Mems Package
App 20160244325 - Cheng; Chun-Wen ; et al. | 2016-08-25 |
Monolithic Complementary Metal-oxide Semiconductor (cmos) - Integrated Silicon Microphone
App 20160241979 - Cho; Chin-Yi ; et al. | 2016-08-18 |
Self-removal Anti-stiction Coating For Bonding Process
App 20160229693 - Liu; Ping-Yin ; et al. | 2016-08-11 |
Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs)
Grant 9,403,674 - Cheng , et al. August 2, 2 | 2016-08-02 |
Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop
Grant 9,403,673 - Liu , et al. August 2, 2 | 2016-08-02 |
Getter, Mems Device And Method Of Forming The Same
App 20160214077 - LIANG; CHIN-WEI ; et al. | 2016-07-28 |
FET sensing cell and method of improving sensitivity of the same
Grant 9,395,326 - Chen , et al. July 19, 2 | 2016-07-19 |
MEMS and CMOS integration with low-temperature bonding
Grant 9,394,161 - Cheng , et al. July 19, 2 | 2016-07-19 |
Integrated Semiconductor Device And Wafer Level Method Of Fabricating The Same
App 20160204083 - Chang; Kuei-Sung ; et al. | 2016-07-14 |
Stacked semiconductor device and method of forming the same related cases
Grant 9,388,040 - Chu , et al. July 12, 2 | 2016-07-12 |
Backside sensing bioFET with enhanced performance
Grant 9,389,199 - Cheng , et al. July 12, 2 | 2016-07-12 |
Method for the integration of a microelectromechanical systems (MEMS) microphone device with a complementary metal-oxide-semiconductor (CMOS) device
Grant 9,386,380 - Chu , et al. July 5, 2 | 2016-07-05 |
Integrated Biosensor
App 20160178568 - Cheng; Chun-Wen ; et al. | 2016-06-23 |
MEMS Integrated Pressure Sensor Devices Having Isotropic Cavitites and Methods of Forming Same
App 20160159643 - Chu; Chia-Hua ; et al. | 2016-06-09 |
MEMS Integrated Pressure Sensor Devices and Methods of Forming Same
App 20160159644 - Chu; Chia-Hua ; et al. | 2016-06-09 |
MEMS devices, packaged MEMS devices, and methods of manufacture thereof
Grant 9,359,194 - Liang , et al. June 7, 2 | 2016-06-07 |
Structure and Method for Integrated Microphone
App 20160157038 - Peng; Jung-Huei ; et al. | 2016-06-02 |
Package systems
Grant 9,355,896 - Shu , et al. May 31, 2 | 2016-05-31 |
MEMS devices and methods for forming same
Grant 9,352,956 - Cheng , et al. May 31, 2 | 2016-05-31 |
Isolation Structure For Mems 3d Ic Integration
App 20160145095 - Tsai; Yi-Heng ; et al. | 2016-05-26 |
Mems And Cmos Integration With Low-temperature Bonding
App 20160137492 - Cheng; Chun-Wen ; et al. | 2016-05-19 |
Hermetic wafer level packaging
Grant 9,337,168 - Chu , et al. May 10, 2 | 2016-05-10 |
Method to integrate different function devices fabricated by different process technologies
Grant 9,337,182 - Chang , et al. May 10, 2 | 2016-05-10 |
Mems Device With A Capping Substrate
App 20160122182 - Cheng; Chun-Wen ; et al. | 2016-05-05 |
Method For The Integration Of A Microelectromechanical Systems (mems) Microphone Device With A Complementary Metal-oxide-semiconductor (cmos) Device
App 20160119722 - Chu; Chia-Hua ; et al. | 2016-04-28 |
Magnetic sensor and forming method
Grant 9,316,704 - Chang , et al. April 19, 2 | 2016-04-19 |
Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding
Grant 9,315,378 - Cheng , et al. April 19, 2 | 2016-04-19 |
MEMS-CMOS integrated devices, and methods of integration at wafer level
Grant 9,309,109 - Chu , et al. April 12, 2 | 2016-04-12 |
MEMS packaging techniques
Grant 9,290,376 - Cheng , et al. March 22, 2 | 2016-03-22 |
Integrated semiconductor device and wafer level method of fabricating the same
Grant 9,293,431 - Chang , et al. March 22, 2 | 2016-03-22 |
Wafer level packaging bond
Grant 9,293,445 - Liu , et al. March 22, 2 | 2016-03-22 |
MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same
App 20160060104 - Chu; Chia-Hua ; et al. | 2016-03-03 |
Magnetic Sensor And Forming Method
App 20160054401 - Chang; Kuei-Sung ; et al. | 2016-02-25 |
Methods For Packaging A Microelectromechanical System (mems) Wafer And Application-specific Integrated Circuit (asic) Dies Using Wire Bonding
App 20160046484 - Cheng; Chun-Wen ; et al. | 2016-02-18 |
Methods For Packaging A Microelectromechanical System (mems) Wafer And Application-specific Integrated Circuit (asic) Dies Using Through Mold Vias (tmvs)
App 20160046483 - Cheng; Chun-Wen ; et al. | 2016-02-18 |
Structure and method for integrated microphone
Grant 9,264,833 - Peng , et al. February 16, 2 | 2016-02-16 |
MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same
Grant 9,260,295 - Chu , et al. February 16, 2 | 2016-02-16 |
MEMS integrated pressure sensor devices and methods of forming same
Grant 9,260,296 - Chu , et al. February 16, 2 | 2016-02-16 |
Systems and methods for an integrated bio-entity manipulation and processing semiconductor device
Grant 9,254,487 - Chang , et al. February 9, 2 | 2016-02-09 |
CMOS-MEMS integrated flow for making a pressure sensitive transducer
Grant 9,254,997 - Cheng , et al. February 9, 2 | 2016-02-09 |
MEMS device with a capping substrate
Grant 9,254,998 - Cheng , et al. February 9, 2 | 2016-02-09 |
Capacitor With Planarized Bonding For Cmos-mems Integration
App 20160031704 - Shen; Wei-Cheng ; et al. | 2016-02-04 |
Method For Manufacturing A Microelectromechanical Systems (mems) Device With Different Electrical Potentials And An Etch Stop
App 20160031703 - Liu; Yu-Chia ; et al. | 2016-02-04 |
Semiconductor arrangement with stress release and thermal insulation
Grant 9,238,578 - Cheng , et al. January 19, 2 | 2016-01-19 |
Backside CMOS Compatible BioFET With No Plasma Induced Damage
App 20160011144 - Liu; Yi-Shao ; et al. | 2016-01-14 |
MEMS device and method of forming the same
Grant 9,233,839 - Liu , et al. January 12, 2 | 2016-01-12 |
Semiconductor Device With Through Molding Vias And Method Of Making The Same
App 20160002027 - CHENG; Chun-wen ; et al. | 2016-01-07 |
Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop
Grant 9,221,674 - Liu , et al. December 29, 2 | 2015-12-29 |
Vhf Etch Barrier For Semiconductor Integrated Microsystem
App 20150364363 - Wu; Tzu-Heng ; et al. | 2015-12-17 |
Methods and Apparatus for MEMS Devices with Increased Sensitivity
App 20150338435 - Chu; Chia-Hua ; et al. | 2015-11-26 |
Package Systems
App 20150340341 - SHU; Chia-Pao ; et al. | 2015-11-26 |
Sensor Integration With An Outgassing Barrier And A Stable Electrical Signal Path
App 20150329353 - Cheng; Chun-Wen ; et al. | 2015-11-19 |
Vacuum Sealed MEMS and CMOS Package
App 20150329351 - Cheng; Chun-Wen ; et al. | 2015-11-19 |
MEMS integrated pressure sensor and microphone devices and methods of forming same
Grant 9,187,317 - Cheng , et al. November 17, 2 | 2015-11-17 |
Stacked Semiconductor Device and Method of Forming the Same Related Cases
App 20150315015 - Chu; Chia-Hua ; et al. | 2015-11-05 |
MEMS Devices and Methods for Forming Same
App 20150307346 - Cheng; Chun-Wen ; et al. | 2015-10-29 |
Structures And Formation Methods Of Micro-electro Mechanical System Device
App 20150284240 - CHU; Chia-Hua ; et al. | 2015-10-08 |
Semiconductor device with through molding vias
Grant 9,150,404 - Cheng , et al. October 6, 2 | 2015-10-06 |
Semiconductor Arrangement With Thermal Insulation Configuration
App 20150274513 - Cheng; Chun-wen ; et al. | 2015-10-01 |
MEMS Structures and Methods for Forming the Same
App 20150266722 - Liu; Ping-Yin ; et al. | 2015-09-24 |
Semiconductor Arrangement With Stress Release Configuration
App 20150251900 - Cheng; Chun-Wen ; et al. | 2015-09-10 |
Semiconductor Arrangement With Stress Release And Thermal Insulation
App 20150251901 - Cheng; Chun-Wen ; et al. | 2015-09-10 |
Stacked Semiconductor Structure And Method Of Forming The Same
App 20150251895 - Chu; Chia-Hua ; et al. | 2015-09-10 |
Semiconductor arrangement with thermal insulation configuration
Grant 9,130,531 - Cheng , et al. September 8, 2 | 2015-09-08 |
MEMS Integrated Pressure Sensor Devices and Methods of Forming Same
App 20150246807 - Chu; Chia-Hua ; et al. | 2015-09-03 |
Stacked semiconductor device and method of forming the same
Grant 9,123,547 - Chu , et al. September 1, 2 | 2015-09-01 |
Top-down fabrication method for forming a nanowire transistor device
Grant 9,121,820 - Liu , et al. September 1, 2 | 2015-09-01 |
Semiconductor arrangement with stress release configuration
Grant 9,114,976 - Cheng , et al. August 25, 2 | 2015-08-25 |
Package systems and manufacturing methods thereof
Grant 9,112,001 - Shu , et al. August 18, 2 | 2015-08-18 |
Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same
App 20150217996 - Chu; Chia-Hua ; et al. | 2015-08-06 |
Methods and apparatus for MEMS devices with increased sensitivity
Grant 9,096,420 - Chu , et al. August 4, 2 | 2015-08-04 |
MEMS devices and methods for forming same
Grant 9,085,455 - Cheng , et al. July 21, 2 | 2015-07-21 |
Mems Devices And Methods For Forming Same
App 20150197419 - Cheng; Chun-Wen ; et al. | 2015-07-16 |
Stacked semiconductor device and method of forming the same related cases
Grant 9,079,761 - Chu , et al. July 14, 2 | 2015-07-14 |
Backside CMOS compatible BioFET with no plasma induced damage
Grant 9,080,969 - Liu , et al. July 14, 2 | 2015-07-14 |
Micro Electromechanical System Sensor And Method Of Forming The Same
App 20150175407 - CHENG; Chun-wen ; et al. | 2015-06-25 |
Semiconductor Device With Through Molding Vias
App 20150166329 - CHENG; Chun-wen ; et al. | 2015-06-18 |
MEMS Device with Release Aperture
App 20150166334 - Lin; Chung-Hsien ; et al. | 2015-06-18 |
Semiconductor Device
App 20150166331 - CHENG; Chun-wen ; et al. | 2015-06-18 |
Method of forming a bond ring for a first and second substrate
Grant 9,056,766 - Cheng , et al. June 16, 2 | 2015-06-16 |
Biosensor Calibration System and Related Method
App 20150160323 - Wen; Chin-Hua ; et al. | 2015-06-11 |
MEMS structures and methods for forming the same
Grant 9,054,121 - Liu , et al. June 9, 2 | 2015-06-09 |
MEMS integrated pressure sensor devices and methods of forming same
Grant 9,040,334 - Chu , et al. May 26, 2 | 2015-05-26 |
Mechanisms For Forming Micro-electro Mechanical System Device
App 20150137276 - CHENG; Chun-Wen ; et al. | 2015-05-21 |
Structures And Formation Methods Of Micro-electro Mechanical System Device
App 20150137280 - CHU; Chia-Hua ; et al. | 2015-05-21 |
Biochip With Biosensors And Fluidic Devices
App 20150139857 - LIU; Yi-Shao ; et al. | 2015-05-21 |
MEMS Devices, Packaged MEMS Devices, and Methods of Manufacture Thereof
App 20150137283 - Liang; Kai-Chih ; et al. | 2015-05-21 |
Wafer level sealing methods with different vacuum levels for MEMS sensors
Grant 9,035,451 - Liu , et al. May 19, 2 | 2015-05-19 |
Biosensor Device and Related Method
App 20150129936 - Huang; Jui-Cheng ; et al. | 2015-05-14 |
Fet Sensing Cell And Method Of Improving Sensitivity Of The Same
App 20150125872 - Chen; Tung-Tsun ; et al. | 2015-05-07 |
Dual layer microelectromechanical systems device and method of manufacturing same
Grant 9,006,015 - Chu , et al. April 14, 2 | 2015-04-14 |
Mechanisms For Forming Micro-electro Mechanical System Device
App 20150097215 - CHU; Chia-Hua ; et al. | 2015-04-09 |
Package systems having an opening in a substrate thereof and manufacturing methods thereof
Grant 9,000,578 - Shu , et al. April 7, 2 | 2015-04-07 |
Wafer Level Sealing Methods With Different Vacuum Levels For Mems Sensors
App 20150091153 - Liu; Yu-Chia ; et al. | 2015-04-02 |
Fluid Deposition Appartus And Method
App 20150079704 - Cheng; Chun-Wen ; et al. | 2015-03-19 |
Integrated Semiconductor Device And Wafer Level Method Of Fabricating The Same
App 20150076710 - Chang; Kuei-Sung ; et al. | 2015-03-19 |
CMOS-MEMS Integrated Flow for Making a Pressure Sensitive Transducer
App 20150060954 - Cheng; Chun-Wen ; et al. | 2015-03-05 |
Top-Down Fabrication Method for Forming a Nanowire Transistor Device
App 20150053925 - Liu; Yi-Shao ; et al. | 2015-02-26 |
MEMS device with release aperture
Grant 8,962,367 - Lin , et al. February 24, 2 | 2015-02-24 |
MEMS devices, packaged MEMS devices, and methods of manufacture thereof
Grant 8,952,465 - Liang , et al. February 10, 2 | 2015-02-10 |
Surface modification, functionalization and integration of microfluidics and biosensor to form a biochip
Grant 8,951,716 - Liu , et al. February 10, 2 | 2015-02-10 |
Mems Device And Method Of Forming The Same
App 20150035089 - LIU; YU-CHIA ; et al. | 2015-02-05 |
Semiconductor device
Grant 8,941,152 - Cheng , et al. January 27, 2 | 2015-01-27 |
Mems-cmos Integrated Devices, And Methods Of Integration At Wafer Level
App 20150008540 - CHU; Chia-Hua ; et al. | 2015-01-08 |
Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget
App 20150011021 - Chu; Chia-Hua ; et al. | 2015-01-08 |
Self-removal anti-stiction coating for bonding process
Grant 8,905,293 - Liu , et al. December 9, 2 | 2014-12-09 |
Method Of Forming A Bond Ring For A First And Second Substrate
App 20140357007 - Cheng; Chun-Wen ; et al. | 2014-12-04 |
MEMS device and method of forming the same
Grant 8,900,905 - Liu , et al. December 2, 2 | 2014-12-02 |
Integrated semiconductor device and wafer level method of fabricating the same
Grant 8,895,360 - Chang , et al. November 25, 2 | 2014-11-25 |
MEMS Switch with Reduced Dielectric Charging Effect
App 20140331484 - Chu; Chia-Hua ; et al. | 2014-11-13 |
MEMS Integrated Pressure Sensor Devices having Isotropic Cavities and Methods of Forming Same
App 20140319631 - Chu; Chia-Hua ; et al. | 2014-10-30 |
Systems and Methods for an Integrated Bio-Entity Manipulation and Processing Semiconductor Device
App 20140299472 - Chang; Yi-Hsien ; et al. | 2014-10-09 |
Method for forming biochips and biochips with non-organic landings for improved thermal budget
Grant 8,846,416 - Chu , et al. September 30, 2 | 2014-09-30 |
MEMS Device with Release Aperture
App 20140287548 - Lin; Chung-Hsien ; et al. | 2014-09-25 |
Backside Sensing Biofet With Enhanced Performance
App 20140264467 - Cheng; Chun-Wen ; et al. | 2014-09-18 |
MEMS Devices and Methods for Forming Same
App 20140264661 - Cheng; Chun-Wen ; et al. | 2014-09-18 |
Biofet With Increased Sensing Area
App 20140264468 - Cheng; Chun-Wen ; et al. | 2014-09-18 |
Stacked Semiconductor Device And Method Of Forming The Same Related Cases
App 20140264474 - Chu; Chia-Hua ; et al. | 2014-09-18 |
Stacked Semiconductor Device And Method Of Forming The Same
App 20140264744 - Chu; Chia-Hua ; et al. | 2014-09-18 |
Structure and Method for Integrated Microphone
App 20140270272 - Peng; Jung-Huei ; et al. | 2014-09-18 |
MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same
App 20140264662 - Cheng; Chun-Wen ; et al. | 2014-09-18 |
MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same
App 20140264653 - Cheng; Chun-Wen ; et al. | 2014-09-18 |
MEMS Integrated Pressure Sensor Devices and Methods of Forming Same
App 20140264648 - Chu; Chia-Hua ; et al. | 2014-09-18 |
Surface Modification, Functionalization And Integration Of Microfluidics And Biosensor To Form A Biochip
App 20140272719 - LIU; Yi-Shao ; et al. | 2014-09-18 |
Method For Forming Biochips And Biochips With Non-organic Landings For Improved Thermal Budget
App 20140273281 - Chu; Chia-Hua ; et al. | 2014-09-18 |
Methods and Apparatus for MEMS Devices with Increased Sensitivity
App 20140252358 - Chu; Chia-Hua ; et al. | 2014-09-11 |
Backside CMOS Compatible BioFET with No Plasma Induced Damage
App 20140252421 - Liu; Yi-Shao ; et al. | 2014-09-11 |
MEMS Device with a Capping Substrate
App 20140252508 - Cheng; Chun-Wen ; et al. | 2014-09-11 |
Process Control Monitoring For Biochips
App 20140239986 - Liu; Yi-Shao ; et al. | 2014-08-28 |
Bond ring for a first and second substrate
Grant 8,810,027 - Cheng , et al. August 19, 2 | 2014-08-19 |
MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same
Grant 8,802,473 - Chu , et al. August 12, 2 | 2014-08-12 |
MEMS switch with reduced dielectric charging effect
Grant 8,797,127 - Chu , et al. August 5, 2 | 2014-08-05 |
Methods of bonding caps for MEMS devices
Grant 8,790,946 - Huang , et al. July 29, 2 | 2014-07-29 |
Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same
App 20140206123 - Chu; Chia-Hua ; et al. | 2014-07-24 |
Method and Apparatus for a Semiconductor Structure
App 20140191341 - Chu; Li-Cheng ; et al. | 2014-07-10 |
Method To Integrate Different Function Devices Fabricated By Different Process Technologies
App 20140183611 - Chang; Kuei-Sung ; et al. | 2014-07-03 |
Package Systems And Manufacturing Methods Thereof
App 20140170849 - SHU; Chia-Pao ; et al. | 2014-06-19 |
Backside Cmos Compatible Biofet With No Plasma Induced Damage
App 20140151755 - Liu; Yi-Shao ; et al. | 2014-06-05 |
Hermetic Wafer Level Packaging
App 20140154841 - Chu; Richard ; et al. | 2014-06-05 |
Wafer Level Packaging Bond
App 20140138853 - Liu; Martin ; et al. | 2014-05-22 |
Backside CMOS compatible bioFET with no plasma induced damage
Grant 8,728,844 - Liu , et al. May 20, 2 | 2014-05-20 |
MEMS devices and methods for forming the same
Grant 8,729,646 - Chu , et al. May 20, 2 | 2014-05-20 |
Integrated Electro-microfluidic Probe Card, System And Method For Using The Same
App 20140134748 - LIU; Yi-Shao ; et al. | 2014-05-15 |
MEMS Devices and Fabrication Methods Thereof
App 20140103461 - Chu; Chia-Hua ; et al. | 2014-04-17 |
Light Detector With Ge Film
App 20140054461 - Kalnitsky; Alexander ; et al. | 2014-02-27 |
MEMS Devices and Methods for Forming the Same
App 20140042562 - Chu; Chia-Hua ; et al. | 2014-02-13 |
Integrated Semiconductor Device and Wafer Level Method of Fabricating the Same
App 20140035158 - Chang; Kuei-Sung ; et al. | 2014-02-06 |
MEMS Devices, Packaged MEMS Devices, and Methods of Manufacture Thereof
App 20140015069 - Liang; Kai-Chih ; et al. | 2014-01-16 |
MEMS Devices and Fabrication Methods Thereof
App 20130334620 - Chu; Chia-Hua ; et al. | 2013-12-19 |
Multiple Bonding In Wafer Level Packaging
App 20130285170 - Lin; Chung-Hsien ; et al. | 2013-10-31 |
| 