loadpatents
name:-0.02708101272583
name:-0.011823177337646
name:-0.00051307678222656
Cheng; Chih-Min Patent Filings

Cheng; Chih-Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Chih-Min.The latest application filed is for "photocurable (meth)acrylate compositions".

Company Profile
0.9.19
  • Cheng; Chih-Min - Westford MA
  • Cheng, Chih-Min - Lowell MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Photocurable (meth)acrylate Compositions
App 20220204660 - Jin; Shuhua ;   et al.
2022-06-30
Photocurable (meth)acrylate Compositions
App 20220204809 - Jin; Shuhua ;   et al.
2022-06-30
Hydrogenated Natural Oils To Thicken The Polyol Component Of A Two-component Polyurethane Adhesive For Bonding Membranes
App 20210197126 - Jin; Shuhua ;   et al.
2021-07-01
Use Of Polyvinylacetate Polymers Or Copolymers To Increase The Viscosity Of The Isocyanate Component Of A Two-component Curable Polymeric System
App 20210198471 - Cheng; Chih-Min ;   et al.
2021-07-01
Adhesive compositions
Grant 9,657,203 - Murray , et al. May 23, 2
2017-05-23
Adhesive compositions
Grant 9,574,118 - Cheng , et al. February 21, 2
2017-02-21
Adhesive Compositions
App 20150225626 - Murray; James ;   et al.
2015-08-13
Composite film for board level EMI shielding
Grant 8,847,184 - Cheng , et al. September 30, 2
2014-09-30
Composite Film For Board Level Emi Shielding
App 20130207005 - Cheng; Chih-Min ;   et al.
2013-08-15
Method Of Changing Rheology In Filled Resin Systems Using Cavitation
App 20100076120 - Emmerson; Gordon T. ;   et al.
2010-03-25
Corrosion-Preventive Adhesive Compositions
App 20080292801 - Shah; Jayesh P. ;   et al.
2008-11-27
RFID antenna with pre-applied adhesives
Grant 7,456,748 - Cheng , et al. November 25, 2
2008-11-25
Compositions For Use In Electronics Devices
App 20080054227 - McCormick; Demetrius ;   et al.
2008-03-06
Low stress conductive adhesive
Grant 7,326,369 - Cheng , et al. February 5, 2
2008-02-05
Anisotropic conductive adhesive
App 20070213429 - Cheng; Chih-Min ;   et al.
2007-09-13
Thermal Interface Material
App 20070179232 - Collins; Andrew ;   et al.
2007-08-02
RFID antenna with pre-applied adhesives
App 20070089286 - Cheng; Chih-Min ;   et al.
2007-04-26
Conductive materials with electrical stability and good impact resistance for use in electronics devices
Grant 7,108,806 - Xiao , et al. September 19, 2
2006-09-19
Low stress conductive adhesive
App 20060197066 - Cheng; Chih-Min ;   et al.
2006-09-07
Compositions for use in electronics devices
App 20050247916 - McCormick, Demetrius ;   et al.
2005-11-10
Thermal interface material
App 20050250910 - Cheng, Chih-Min ;   et al.
2005-11-10
Thermal interface material
Grant 6,874,573 - Collins , et al. April 5, 2
2005-04-05
Thermal interface material
App 20050022971 - Collins, Andrew ;   et al.
2005-02-03
Thermal interface material
App 20040180209 - Cheng, Chih-Min ;   et al.
2004-09-16
Conductive materials with electrical stability and good impact resistance for use in electronics devices
App 20040169162 - Xiao, Yue ;   et al.
2004-09-02
Electronic device containing thermal interface material
Grant 6,776,226 - Cheng , et al. August 17, 2
2004-08-17
Conductive materials with electrical stability for use in electronics devices
App 20020193467 - Cheng, Chih-Min ;   et al.
2002-12-19
Conductive and resistive materials with electrical stability for use in electronics devices
Grant 6,344,157 - Cheng , et al. February 5, 2
2002-02-05

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