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Patent applications and USPTO patent grants for Cheng; Chih-Min.The latest application filed is for "photocurable (meth)acrylate compositions".
Patent | Date |
---|---|
Photocurable (meth)acrylate Compositions App 20220204660 - Jin; Shuhua ;   et al. | 2022-06-30 |
Photocurable (meth)acrylate Compositions App 20220204809 - Jin; Shuhua ;   et al. | 2022-06-30 |
Hydrogenated Natural Oils To Thicken The Polyol Component Of A Two-component Polyurethane Adhesive For Bonding Membranes App 20210197126 - Jin; Shuhua ;   et al. | 2021-07-01 |
Use Of Polyvinylacetate Polymers Or Copolymers To Increase The Viscosity Of The Isocyanate Component Of A Two-component Curable Polymeric System App 20210198471 - Cheng; Chih-Min ;   et al. | 2021-07-01 |
Adhesive compositions Grant 9,657,203 - Murray , et al. May 23, 2 | 2017-05-23 |
Adhesive compositions Grant 9,574,118 - Cheng , et al. February 21, 2 | 2017-02-21 |
Adhesive Compositions App 20150225626 - Murray; James ;   et al. | 2015-08-13 |
Composite film for board level EMI shielding Grant 8,847,184 - Cheng , et al. September 30, 2 | 2014-09-30 |
Composite Film For Board Level Emi Shielding App 20130207005 - Cheng; Chih-Min ;   et al. | 2013-08-15 |
Method Of Changing Rheology In Filled Resin Systems Using Cavitation App 20100076120 - Emmerson; Gordon T. ;   et al. | 2010-03-25 |
Corrosion-Preventive Adhesive Compositions App 20080292801 - Shah; Jayesh P. ;   et al. | 2008-11-27 |
RFID antenna with pre-applied adhesives Grant 7,456,748 - Cheng , et al. November 25, 2 | 2008-11-25 |
Compositions For Use In Electronics Devices App 20080054227 - McCormick; Demetrius ;   et al. | 2008-03-06 |
Low stress conductive adhesive Grant 7,326,369 - Cheng , et al. February 5, 2 | 2008-02-05 |
Anisotropic conductive adhesive App 20070213429 - Cheng; Chih-Min ;   et al. | 2007-09-13 |
Thermal Interface Material App 20070179232 - Collins; Andrew ;   et al. | 2007-08-02 |
RFID antenna with pre-applied adhesives App 20070089286 - Cheng; Chih-Min ;   et al. | 2007-04-26 |
Conductive materials with electrical stability and good impact resistance for use in electronics devices Grant 7,108,806 - Xiao , et al. September 19, 2 | 2006-09-19 |
Low stress conductive adhesive App 20060197066 - Cheng; Chih-Min ;   et al. | 2006-09-07 |
Compositions for use in electronics devices App 20050247916 - McCormick, Demetrius ;   et al. | 2005-11-10 |
Thermal interface material App 20050250910 - Cheng, Chih-Min ;   et al. | 2005-11-10 |
Thermal interface material Grant 6,874,573 - Collins , et al. April 5, 2 | 2005-04-05 |
Thermal interface material App 20050022971 - Collins, Andrew ;   et al. | 2005-02-03 |
Thermal interface material App 20040180209 - Cheng, Chih-Min ;   et al. | 2004-09-16 |
Conductive materials with electrical stability and good impact resistance for use in electronics devices App 20040169162 - Xiao, Yue ;   et al. | 2004-09-02 |
Electronic device containing thermal interface material Grant 6,776,226 - Cheng , et al. August 17, 2 | 2004-08-17 |
Conductive materials with electrical stability for use in electronics devices App 20020193467 - Cheng, Chih-Min ;   et al. | 2002-12-19 |
Conductive and resistive materials with electrical stability for use in electronics devices Grant 6,344,157 - Cheng , et al. February 5, 2 | 2002-02-05 |
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