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name:-0.0032939910888672
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CHENG; Chih-Kai Patent Filings

CHENG; Chih-Kai

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHENG; Chih-Kai.The latest application filed is for "package structure".

Company Profile
2.3.6
  • CHENG; Chih-Kai - Chu-dong Villiage TW
  • Cheng; Chih-Kai - Hsinchu County TW
  • CHENG; Chih-Kai - Chu-dong Village TW
  • Cheng; Chih-Kai - Zhunan TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Package Structure
App 20210375769 - CHENG; Chih-Kai ;   et al.
2021-12-02
Integrated Circuit Package and Method
App 20210272875 - Chiu; Yuan Sheng ;   et al.
2021-09-02
Package structure having line connected via portions
Grant 11,088,079 - Cheng , et al. August 10, 2
2021-08-10
Integrated circuit package and method
Grant 11,011,451 - Chiu , et al. May 18, 2
2021-05-18
Package Structure And Method For Forming The Same
App 20200411440 - CHENG; Chih-Kai ;   et al.
2020-12-31
Integrated Circuit Package And Method
App 20200185304 - Chiu; Yuan Sheng ;   et al.
2020-06-11
Fuel Cell System And Startup And Shutdown Method Therefor
App 20180166715 - Yang; Jefferson YS ;   et al.
2018-06-14
Semiconductor device with an anti-pad peeling structure and associated method
Grant 9,711,478 - Cheng , et al. July 18, 2
2017-07-18
Semiconductor Device With An Anti-pad Peeling Structure And Associated Method
App 20170110429 - CHENG; CHIH-KAI ;   et al.
2017-04-20

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