Cheng; Chia-Shen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Chia-Shen.The latest application filed is for "reflow method and system".
- Cheng; Chia-Shen - Hsinchu County TW
- Cheng; Chia-Shen - Hsinchu TW
- - Hsinchu TW
- Cheng; Chia-Shen - Hsin-Chu TW
- Cheng; Chia-Shen - Taichung TW
- CHENG; CHIA-SHEN - TAICHUNG CITY TW
| Patent | Date |
|---|---|
| Reflow Method And System App 20220130795 - Wong; Cheng-Shiuan ; et al. | 2022-04-28 |
| Package Structure And Method Of Fabricating The Same App 20220122926 - Pei; Hao-Jan ; et al. | 2022-04-21 |
| Semiconductor Structure and Method App 20220028823 - Cheng; Chia-Shen ; et al. | 2022-01-27 |
| Package structure and method of fabrcating the same Grant 11,211,341 - Pei , et al. December 28, 2 | 2021-12-28 |
| Semiconductor Package and Method App 20210351172 - Pei; Hao-Jan ; et al. | 2021-11-11 |
| Package Structure App 20210263243 - Chang; Chia-Lun ; et al. | 2021-08-26 |
| Iintegrated Fan-out Packages With Embedded Heat Dissipation Structure App 20210233829 - Pei; Hao-Jan ; et al. | 2021-07-29 |
| Workpiece Holder, Wafer Chuck, Wafer Holding Method App 20210225684 - Wong; Cheng-Shiuan ; et al. | 2021-07-22 |
| Semiconductor package and method Grant 11,069,671 - Pei , et al. July 20, 2 | 2021-07-20 |
| Package Structure And Method Of Fabrcating The Same App 20210193589 - Pei; Hao-Jan ; et al. | 2021-06-24 |
| Package structure Grant 11,002,927 - Chang , et al. May 11, 2 | 2021-05-11 |
| Integrated fan-out packages with embedded heat dissipation structure Grant 10,978,370 - Pei , et al. April 13, 2 | 2021-04-13 |
| Method of singulate a package structure using a light transmitting film on a polymer layer Grant 10,903,090 - Chen , et al. January 26, 2 | 2021-01-26 |
| Bonding Through Multi-Shot Laser Reflow App 20210013173 - Chen; Wei-Yu ; et al. | 2021-01-14 |
| Electronic device and manufacturing method thereof Grant 10,868,353 - Lu , et al. December 15, 2 | 2020-12-15 |
| Method Of Singulate A Package Structure Using A Light Transmitting Film On A Polymer Layer App 20200365420 - Chen; Cheng-Ting ; et al. | 2020-11-19 |
| Bonding through multi-shot laser reflow Grant 10,790,261 - Chen , et al. September 29, 2 | 2020-09-29 |
| Package Structure App 20200271873 - Chang; Chia-Lun ; et al. | 2020-08-27 |
| Electronic Device And Manufacturing Method Thereof App 20200106156 - Lu; Chun-Lin ; et al. | 2020-04-02 |
| Integrated fan-out packages with embedded heat dissipation structure Grant 10,566,261 - Pei , et al. Feb | 2020-02-18 |
| Integrated Fan-out Packages With Embedded Heat Dissipation Structure App 20200006191 - Pei; Hao-Jan ; et al. | 2020-01-02 |
| Integrated fan-out packages with embedded heat dissipation structure Grant 10504815 - | 2019-12-10 |
| Semiconductor Package and Method App 20190296002 - Pei; Hao-Jan ; et al. | 2019-09-26 |
| Bonding Through Multi-Shot Laser Reflow App 20190279958 - Chen; Wei-Yu ; et al. | 2019-09-12 |
| Integrated Fan-Out Packages and Methods of Forming the Same App 20190148262 - Pei; Hao-Jan ; et al. | 2019-05-16 |
| Package Structure And Manufacturing Method Thereof App 20190139886 - Chen; Wei-Yu ; et al. | 2019-05-09 |
| Dicing in wafer level package Grant 9,929,071 - Cheng , et al. March 27, 2 | 2018-03-27 |
| Dicing in Wafer Level Package App 20170062300 - Cheng; Chia-Shen ; et al. | 2017-03-02 |
| Dicing in wafer level package Grant 9,484,227 - Cheng , et al. November 1, 2 | 2016-11-01 |
| Illumination structure and assembly method of light base and cover Grant 8,807,800 - Lin , et al. August 19, 2 | 2014-08-19 |
| Light Module And Light Guide Device Thereof App 20130279198 - LIN; YU-MIN ; et al. | 2013-10-24 |
| Led Package App 20130134466 - Lin; Yu-Min ; et al. | 2013-05-30 |
| Illumination Structure And Assembly Method Of Light Base And Cover App 20130107541 - Lin; Yu-Min ; et al. | 2013-05-02 |
| Lighting Device And Component App 20130088877 - Hsu; Han-Chung ; et al. | 2013-04-11 |
| Lens for light emitting diode (LED) Grant D679,857 - Hsu , et al. April 9, 2 | 2013-04-09 |
| Lamp Grant D671,237 - Chen , et al. November 20, 2 | 2012-11-20 |
| Multi-stack Package Led App 20110156071 - Cheng; Chia Shen ; et al. | 2011-06-30 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 