Cheng; Chia-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheng; Chia-Hao.The latest application filed is for "integrated circuit package with integrated voltage regulator".
- Cheng; Chia-Hao - Hsinchu TW
- CHENG; CHIA-HAO - HSINCHU CITY TW
| Patent | Date |
|---|---|
| Semiconductor chip with solder cap probe test pads Grant 11,309,222 - Fu , et al. April 19, 2 | 2022-04-19 |
| Integrated Circuit Package With Integrated Voltage Regulator App 20210313269 - BHAGAVAT; MILIND S. ; et al. | 2021-10-07 |
| Molded Semiconductor Chip Package With Stair-step Molding Layer App 20210296194 - Shah; Priyal ; et al. | 2021-09-23 |
| Integrated circuit package with integrated voltage regulator Grant 11,011,466 - Bhagavat , et al. May 18, 2 | 2021-05-18 |
| Semiconductor Chip With Solder Cap Probe Test Pads App 20210066144 - Fu; Lei ; et al. | 2021-03-04 |
| Fan-out Package With Reinforcing Rivets App 20210057352 - Agarwal; Rahul ; et al. | 2021-02-25 |
| Integrated Circuit Package With Integrated Voltage Regulator App 20200312766 - Bhagavat; Milind S. ; et al. | 2020-10-01 |
| Fan-out Packages With Warpage Resistance App 20200294914 - Agarwal; Rahul ; et al. | 2020-09-17 |
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