Cheng; Chi Wah

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheng; Chi Wah.The latest application filed is for "die ejector height adjustment".

Company Profile

10.64.61

Cheng; Chi Wah - Hong Kong HK
Cheng; Chi Wah - Tsing Yi HK
Cheng; Chi Wah - Ysing Yi N/A HK
CHENG; Chi Wah - New Territories HK
Cheng; Chi Wah - Kwai Chung HK
Cheng, Chi Wah - Honk Kong CN
Cheng; Chi Wah - Kowloon HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for dispensing a viscous adhesive Grant 11,343,949 - Cheng , et al. May 24, 2	2022-05-24
Die bonder incorporating rotatable adhesive dispenser head Grant 11,289,445 - Yau , et al. March 29, 2	2022-03-29
Die Ejector Height Adjustment App 20210354355 - CHENG; Chi Wah ; et al.	2021-11-18
Apparatus and method for authentication of electronic device test stations Grant 10,996,308 - Cheng , et al. May 4, 2	2021-05-04
Test Handler Having Multiple Testing Sectors App 20200341056 - CHENG; Chi Wah ; et al.	2020-10-29
Apparatus for packing ultra-small electronic devices Grant 10,741,434 - Lau , et al. A	2020-08-11
Die Bonder Incorporating Rotatable Adhesive Dispenser Head App 20200203305 - YAU; Wan Yin ; et al.	2020-06-25
Apparatus For Packing Ultra-small Electronic Devices App 20200098614 - LAU; Kai Fung ; et al.	2020-03-26
Method and apparatus for aligning electronic components Grant 10,473,714 - Cheng , et al. Nov	2019-11-12
Apparatus And Method For Authentication Of Electronic Device Test Stations App 20190317174 - CHENG; Chi Wah ; et al.	2019-10-17
Apparatus And Method For Dispensing A Viscous Adhesive App 20190289760 - CHENG; Chi Wah ; et al.	2019-09-19
System And Method For Detecting Defects In An Electronic Device App 20190257876 - LAU; Chung Yan ; et al.	2019-08-22
Method and apparatus for aligning and inspecting electronic components Grant 10,338,006 - Cheng , et al.	2019-07-02
Radiative Wafer Cutting Using Selective Focusing Depths App 20190067049 - CHENG; Chi Wah ; et al.	2019-02-28
Method And Apparatus For Aligning And Inspecting Electronic Components App 20180364180 - CHENG; Chi Wah ; et al.	2018-12-20
Apparatus and method for adjustment of a handling device for handling electronic components Grant 10,115,620 - Cheung , et al. October 30, 2	2018-10-30
Method And Apparatus For Aligning Electronic Components App 20180252766 - CHENG; Chi Wah ; et al.	2018-09-06
Apparatus and method for transferring electronic devices Grant 10,056,278 - Cheng , et al. August 21, 2	2018-08-21
Dual-feed Test Handling System App 20180188318 - CHEUNG; Cho Tao ; et al.	2018-07-05
Apparatus And Method For Transferring Electronic Devices App 20180053671 - CHENG; Chi Wah ; et al.	2018-02-22
Electronic device separator for a feeding apparatus Grant 9,850,074 - Yip , et al. December 26, 2	2017-12-26
Electronic Device Separator For A Feeding Apparatus App 20170283178 - YIP; Shing Kai ; et al.	2017-10-05
Test handler that picks up electronic devices for testing and an orientation-changing apparatus for use in a test handler Grant 9,618,573 - Yip , et al. April 11, 2	2017-04-11
Apparatus And Method For Adjustment Of A Handling Device For Handling Electronic Components App 20170062256 - CHEUNG; Yu Sze ; et al.	2017-03-02
Apparatus and method for transferring electronic devices Grant 9,561,914 - Yip , et al. February 7, 2	2017-02-07
Handling system for testing electronic components Grant 9,519,007 - Cheng , et al. December 13, 2	2016-12-13
Singulation apparatus and method Grant 9,508,570 - Cheng , et al. November 29, 2	2016-11-29
Wire spool system for a wire bonding apparatus Grant 9,461,013 - Cheng , et al. October 4, 2	2016-10-04
Wire Spool System For A Wire Bonding Apparatus App 20160148898 - CHENG; Chi Wah ; et al.	2016-05-26
Singulation apparatus comprising an imaging device Grant 9,263,352 - Cheng , et al. February 16, 2	2016-02-16
Test contactor for electrical testing of electronic components Grant 9,261,536 - Siu , et al. February 16, 2	2016-02-16
Apparatus And Method Of Using An Imaging Device For Adjustment Of At Least One Handling Device For Handling Semiconductor Components App 20150370244 - SIU; Hing Suen ; et al.	2015-12-24
Transfer apparatus for transferring electronic devices and changing their orientations Grant 9,218,995 - Cheng , et al. December 22, 2	2015-12-22
Test Handler That Picks Up Electronic Devices For Testing And An Orientation-changing Apparatus For Use In A Test Handler App 20150204943 - YIP; Shing Kai ; et al.	2015-07-23
Singulation Apparatus Comprising An Imaging Device App 20150194354 - CHENG; Chi Wah ; et al.	2015-07-09
Apparatus and method for supporting a workpiece during processing Grant 9,016,675 - Cheng , et al. April 28, 2	2015-04-28
Singulation Apparatus And Method App 20150111366 - CHENG; Chi Wah ; et al.	2015-04-23
Megasonic cleaning system Grant 8,978,673 - Cheng , et al. March 17, 2	2015-03-17
Apparatus for processing electronic devices Grant 8,967,368 - Cheng , et al. March 3, 2	2015-03-03
Transfer Apparatus For Transferring Electronic Devices And Changing Their Orientations App 20140328652 - CHENG; Chi Wah ; et al.	2014-11-06
Laser apparatus for singulation, and a method of singulation Grant 8,742,288 - Kwok , et al. June 3, 2	2014-06-03
Laser processing method and apparatus Grant 8,709,916 - Kwok , et al. April 29, 2	2014-04-29
Nozzle device employing high frequency wave energy Grant 8,702,017 - Chow , et al. April 22, 2	2014-04-22
Apparatus For Processing Electronic Devices App 20140102850 - CHENG; Chi Wah ; et al.	2014-04-17
Wedge bonder and a method of cleaning a wedge bonder Grant 8,657,181 - Cheng , et al. February 25, 2	2014-02-25
Test Contactor For Electrical Testing Of Electronic Components App 20140049279 - SIU; Hing Suen ; et al.	2014-02-20
Laser Processing Method And Apparatus App 20140011336 - KWOK; Chi Hang ; et al.	2014-01-09
Apparatus And Method For Supporting A Workpiece During Processing App 20140008855 - CHENG; Chi Wah ; et al.	2014-01-09
Wedge Bonder And A Method Of Cleaning A Wedge Bonder App 20130341377 - CHENG; Chi Wah ; et al.	2013-12-26
Method of configuring a dicing device, and a dicing apparatus for dicing a workpiece Grant 8,538,576 - Cheng , et al. September 17, 2	2013-09-17
Handling System For Testing Electronic Components App 20130207679 - CHENG; Chi Wah ; et al.	2013-08-15
Universal bond head for wire bonders Grant 8,434,669 - Cheng , et al. May 7, 2	2013-05-07
Laser processing apparatus Grant 8,354,612 - Cheng , et al. January 15, 2	2013-01-15
Laser Apparatus For Singulation, And A Method Of Singulation App 20120318777 - KWOK; Chi Hang ; et al.	2012-12-20
Alignment method for singulation system Grant 8,289,388 - Cheng , et al. October 16, 2	2012-10-16
Method Of Configuring A Dicing Device, And A Dicing Apparatus For Dicing A Workpiece App 20120259444 - CHENG; Chi Wah ; et al.	2012-10-11
Apparatus for transferring electronic components in stages Grant 8,251,422 - Cheng , et al. August 28, 2	2012-08-28
Handling system for inspecting and sorting electronic components Grant 8,167,524 - Cheng , et al. May 1, 2	2012-05-01
Singulation handler comprising vision system Grant 8,167,523 - Cheng , et al. May 1, 2	2012-05-01
Wedge bonding method incorporating remote pattern recognition system Grant 8,091,762 - Cheng , et al. January 10, 2	2012-01-10
Transfer apparatus for handling electronic components Grant 8,037,996 - Cheng , et al. October 18, 2	2011-10-18
Apparatus For Transferring Electronic Components In Stages App 20110236161 - CHENG; Chi Wah ; et al.	2011-09-29
Laser Processing Apparatus App 20110233178 - CHENG; Chi Wah ; et al.	2011-09-29
Singulation handler system for electronic packages Grant 8,011,058 - Cheng , et al. September 6, 2	2011-09-06
Drainage apparatus for a singulation system Grant 7,849,847 - Cheng , et al. December 14, 2	2010-12-14
Alignment Method For Singulation System App 20100289889 - CHENG; Chi Wah ; et al.	2010-11-18
Bond head for heavy wire bonder Grant 7,762,449 - Cheng , et al. July 27, 2	2010-07-27
Transfer Apparatus For Handling Electronic Components App 20100172734 - CHENG; Chi Wah ; et al.	2010-07-08
Nozzle Device Employing High Frequency Wave Energy App 20100150756 - CHOW; Lap Kei Eric ; et al.	2010-06-17
Apparatus and method for arranging devices for processing Grant 7,726,540 - Cheng , et al. June 1, 2	2010-06-01
Bond Head For Heavy Wire Bonder App 20100127045 - CHENG; Chi Wah ; et al.	2010-05-27
Pick And Place Apparatus Incorporating Debris Removal Device App 20090148258 - CHENG; Chi Wah ; et al.	2009-06-11
Handling System For Inspecting And Sorting Electronic Components App 20090129899 - CHENG; Chi Wah ; et al.	2009-05-21
Drainage Apparatus For A Singulation System App 20090064834 - CHENG; Chi Wah ; et al.	2009-03-12
Damage and wear detection for rotary cutting blades Grant 7,495,759 - Cheng , et al. February 24, 2	2009-02-24
Megasonic Cleaning System App 20090038638 - CHENG; Chi Wah ; et al.	2009-02-12
Singulation Handler Comprising Vision System App 20090016868 - CHENG; Chi Wah ; et al.	2009-01-15
Workholder For Supporting Electronic Devices App 20080164646 - Cheng; Chi Wah ; et al.	2008-07-10
Singulation Handler System For Electronic Packages App 20080101894 - Cheng; Chi Wah ; et al.	2008-05-01
Apparatus and method for aligning devices on carriers Grant 7,258,703 - Cheng , et al. August 21, 2	2007-08-21
Apparatus and method for arranging devices for processing App 20070131733 - Cheng; Chi Wah ; et al.	2007-06-14
System for processing electronic devices Grant 7,190,446 - Cheng , et al. March 13, 2	2007-03-13
Apparatus and method for cleaning electronic packages Grant 7,147,721 - Cheng , et al. December 12, 2	2006-12-12
Apparatus and method for aligning devices on carriers App 20060154386 - Cheng; Chi Wah ; et al.	2006-07-13
Substrate alignment method and apparatus Grant 6,983,872 - Cheng , et al. January 10, 2	2006-01-10
System for processing electronic devices App 20050134256 - Cheng, Chi Wah ; et al.	2005-06-23
Substrate alignment method and apparatus App 20040245319 - Cheng, Chi Wah ; et al.	2004-12-09
Apparatus and method of placing solder balls onto a substrate Grant 6,766,938 - Cheng , et al. July 27, 2	2004-07-27
Apparatus and method for cleaning electronic packages App 20040123878 - Cheng, Chi Wah ; et al.	2004-07-01
Apparatus and method for application of adhesive substances to objects App 20040003891 - Cheng, Chi Wah ; et al.	2004-01-08
Apparatus and method for ball release Grant 6,607,118 - Cheng , et al. August 19, 2	2003-08-19
Apparatus and method of placing solder balls onto a substrate App 20030127501 - Cheng, Chi Wah ; et al.	2003-07-10
Apparatus and method for ball release App 20020158108 - Cheng, Chi Wah ; et al.	2002-10-31
Solder reflow oven Grant 6,386,422 - Cheng , et al. May 14, 2	2002-05-14
Radial wire bonder and selectable side view inspection system Grant 6,109,501 - Cheng , et al. August 29, 2	2000-08-29
Radial wire bonder and selectable side view inspection system Grant 5,897,048 - Cheng , et al. April 27, 1	1999-04-27