Patent applications and USPTO patent grants for CHENG; CHAO-CHEN.The latest application filed is for "semiconductor laser and fabrication method therefor".
Patent | Date |
---|---|
Semiconductor Laser And Fabrication Method Therefor App 20220247147 - CHENG; CHAO-CHEN ;   et al. | 2022-08-04 |
Manufacturing Method For Laser Chip And Laser Chip App 20220136125 - TRAN; ANH CHUONG ;   et al. | 2022-05-05 |
Semiconductor Laser Chip And Preperation Method Therefor App 20220059986 - CHENG; CHAO-CHEN ;   et al. | 2022-02-24 |
Method for fabricating a light emitting diode (LED) die having protective substrate Grant 9,343,620 - Chu , et al. May 17, 2 | 2016-05-17 |
Light emitting diode Grant 9,231,152 - Doan , et al. January 5, 2 | 2016-01-05 |
Light emitting diode Grant 9,190,589 - Doan , et al. November 17, 2 | 2015-11-17 |
Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication Grant 9,130,114 - Chu , et al. September 8, 2 | 2015-09-08 |
Vertical Light Emitting Diode (VLED) Dice Having Confinement Layers With Roughened Surfaces And Methods Of Fabrication App 20140339496 - Chu; Chen-FU ;   et al. | 2014-11-20 |
Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrate Grant 8,871,547 - Chu , et al. October 28, 2 | 2014-10-28 |
Method For Fabricating Vertical Light Emitting Diode (vled) Structure Using A Laser Pulse To Remove A Carrier Substrate App 20140154821 - CHU; CHEN-FU ;   et al. | 2014-06-05 |
Protection For The Epitaxial Structure Of Metal Devices App 20140151630 - Fan; Feng-Hsu ;   et al. | 2014-06-05 |
Method For Fabricating A Light Emitting Diode (led) Die Having Protective Substrate App 20140151635 - CHU; JIUNN-YI ;   et al. | 2014-06-05 |
Method for guiding current in a light emitting diode (LED) device Grant 8,703,515 - Liu , et al. April 22, 2 | 2014-04-22 |
Method to make low resistance contact Grant 8,685,764 - Chu , et al. April 1, 2 | 2014-04-01 |
Light emitting diode (LED) die having stepped substrates and method of fabrication Grant 8,686,461 - Chu , et al. April 1, 2 | 2014-04-01 |
Light Emitting Diode App 20140070164 - DOAN; TRUNG-TRI ;   et al. | 2014-03-13 |
Light Emitting Diode App 20140061585 - DOAN; TRUNG-TRI ;   et al. | 2014-03-06 |
Method For Fabricating A Vertical Light Emitting Diode (vled) Die Having Epitaxial Structure With Protective Layer App 20140051197 - FAN; FENG-HSU ;   et al. | 2014-02-20 |
Protection for the epitaxial structure of metal devices Grant 8,614,449 - Fan , et al. December 24, 2 | 2013-12-24 |
Method For Guiding Current In A Light Emitting Diode (led) Device App 20130334982 - LIU; WEN-HUANG ;   et al. | 2013-12-19 |
LED chip Grant D693,779 - Chu , et al. November 19, 2 | 2013-11-19 |
Vertical LED with current-guiding structure Grant 8,546,818 - Liu , et al. October 1, 2 | 2013-10-01 |
LED chip Grant D690,670 - Chu , et al. October 1, 2 | 2013-10-01 |
LED chip Grant D689,834 - Chu , et al. September 17, 2 | 2013-09-17 |
LED chip Grant D685,334 - Chu , et al. July 2, 2 | 2013-07-02 |
LED chip Grant D684,940 - Chu , et al. June 25, 2 | 2013-06-25 |
LED chip Grant D684,549 - Chu , et al. June 18, 2 | 2013-06-18 |
Light emitting diodes (LEDs) with improved light extraction by roughening Grant 8,466,479 - Chu , et al. June 18, 2 | 2013-06-18 |
Light Emitting Diode (LED) Die Having Stepped Substrates And Method Of Fabrication App 20120168716 - Chu; Jiunn-Yi ;   et al. | 2012-07-05 |
Vertical Light Emitting Diode (vled) Die And Method Of Fabrication App 20120168714 - Chu; Jiunn-Yi ;   et al. | 2012-07-05 |
Vertical Led With Current-guiding Structure App 20120146083 - LIU; Wen-Huang ;   et al. | 2012-06-14 |
Vertical LED with current guiding structure Grant 8,148,733 - Liu , et al. April 3, 2 | 2012-04-03 |
Protection For The Epitaxial Structure Of Metal Devices App 20120074384 - FAN; FENG-HSU ;   et al. | 2012-03-29 |
Method for removing semiconductor street material Grant 8,143,112 - Doan , et al. March 27, 2 | 2012-03-27 |
Die separation Grant 8,124,454 - Chu , et al. February 28, 2 | 2012-02-28 |
Vertical Led With Current Guiding Structure App 20110316039 - LIU; WEN-HUANG ;   et al. | 2011-12-29 |
Vertical LED with current guiding structure Grant 8,003,994 - Liu , et al. August 23, 2 | 2011-08-23 |
Light Emitting Diodes (leds) With Improved Light Extraction By Roughening App 20110101400 - CHU; CHEN-FU ;   et al. | 2011-05-05 |
Light emitting diodes (LEDs) with improved light extraction by roughening Grant 7,897,420 - Chu , et al. March 1, 2 | 2011-03-01 |
Die separation Grant 7,892,891 - Chu , et al. February 22, 2 | 2011-02-22 |
Light emitting diode device Grant D627,747 - Chu , et al. November 23, 2 | 2010-11-23 |
Method of separating semiconductor dies Grant 7,829,440 - Chu , et al. November 9, 2 | 2010-11-09 |
Vertical Led With Current Guiding Structure App 20100258834 - LIU; WEN-HUANG ;   et al. | 2010-10-14 |
Vertical LED with current guiding structure Grant 7,759,670 - Liu , et al. July 20, 2 | 2010-07-20 |
Epitaxial structure for metal devices Grant 7,723,718 - Doan , et al. May 25, 2 | 2010-05-25 |
Method for removing semiconductor street material Grant 7,687,322 - Doan , et al. March 30, 2 | 2010-03-30 |
Method of making light emitting diodes (LEDs) with improved light extraction by roughening Grant 7,524,686 - Chu , et al. April 28, 2 | 2009-04-28 |
Vertical Led With Current Guiding Structure App 20080308829 - LIU; WEN-HUANG ;   et al. | 2008-12-18 |
Die Separation App 20080194051 - CHU; CHEN-FU ;   et al. | 2008-08-14 |
Light Emitting Diodes (leds) With Improved Light Extraction By Roughening App 20080142814 - CHU; CHEN-FU ;   et al. | 2008-06-19 |
Protection For The Epitaxial Structure Of Metal Devices App 20080087875 - Fan; Feng-Hsu ;   et al. | 2008-04-17 |
Method To Make Low Resistance Contact App 20080035950 - CHU; CHEN-FU ;   et al. | 2008-02-14 |
Method Of Separating Semiconductor Dies App 20080032488 - CHU; JIUNN-YI ;   et al. | 2008-02-07 |
Light Emitting Diodes (leds) With Improved Light Extraction By Roughening App 20070190676 - Chu; Chen-Fu ;   et al. | 2007-08-16 |
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