Chen; Zhenwen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Zhenwen.The latest application filed is for "thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board".

Company Profile

3.5.5

Chen; Zhenwen - Guangdong CN
Chen; Zhenwen - Hangzhou CN
CHEN; Zhenwen - Guangzhou Guangdong
Chen; Zhenwen - Hanzhou CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Automobile chassis integration control method and system Grant 11,305,646 - Wang , et al. April 19, 2	2022-04-19
Fluid heat exchange assembly, and heat management system of vehicle Grant 11,285,781 - Chen , et al. March 29, 2	2022-03-29
Thermosetting Resin Composition, Prepreg Containing Same, Metal Foil-clad Laminate And Printed Circuit Board App 20220056225 - CHEN; Zhenwen	2022-02-24
Automobile Chassis Integration Control Method and System App 20210370767 - WANG; Fuwen ; et al.	2021-12-02
Gear shift linkage mechanism and gear shift apparatus Grant 11,162,583 - Liu , et al. November 2, 2	2021-11-02
Gear Shift Linkage Mechanism And Gear Shift Apparatus App 20210246981 - Liu; Zhigang ; et al.	2021-08-12
Vehicle, Electronic Parking Brake System and Control Method Thereof App 20200317181 - SUN; Jiantao ; et al.	2020-10-08
Fluid Heat Exchange Assembly, and Heat Management System of Vehicle App 20200031198 - CHEN; Zhenwen ; et al.	2020-01-30
Thermal expansion valve Grant D765,226 - Yin , et al. August 30, 2	2016-08-30
Thermal expansion valve Grant D764,027 - Yin , et al. August 16, 2	2016-08-16

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