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High-efficiency desiccant wheel
Grant 11,260,345 - Li , et al. March 1, 2 | 2022-03-01 |
High-Efficiency Desiccant Wheel
App 20210178319 - Li; Heng Yi ; et al. | 2021-06-17 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,790,252 - Lei , et al. September 29, 2 | 2020-09-29 |
Apparatus of heat pipe quality detection using infrared thermal imager and method thereof
Grant 10,302,379 - Li , et al. | 2019-05-28 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,269,747 - Lei , et al. | 2019-04-23 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20180337155 - Lei; Yi-Yang ; et al. | 2018-11-22 |
Voltage level shift circuit for multiple voltage integrated circuits
Grant 9,866,217 - Li , et al. January 9, 2 | 2018-01-09 |
Common well bias design for a driving circuit and method of using same
Grant 9,395,739 - Chen , et al. July 19, 2 | 2016-07-19 |
Controlling voltage at pad
Grant 9,172,376 - Chen , et al. October 27, 2 | 2015-10-27 |
Multiple device voltage electrostatic discharge clamp
Grant 9,013,843 - Chen , et al. April 21, 2 | 2015-04-21 |
Common Well Bias Design For A Driving Circuit And Method Of Using Same
App 20150097597 - CHEN; Chia-Hui ; et al. | 2015-04-09 |
Brake disk assembly
Grant 8,973,723 - Chen , et al. March 10, 2 | 2015-03-10 |
In-phase grouping for voltage-dependent design rule
Grant 8,943,454 - Hsiao , et al. January 27, 2 | 2015-01-27 |
Common well bias design for a driving circuit and method of using
Grant 8,928,361 - Chen , et al. January 6, 2 | 2015-01-06 |
Voltage Level Shift Circuit For Multiple Voltage Integrated Circuits
App 20150002207 - LI; Bright ; et al. | 2015-01-01 |
Semiconductor devices, packaging methods and structures
Grant 8,916,969 - Chen , et al. December 23, 2 | 2014-12-23 |
Voltage level shift circuit for multiple voltage integrated circuits
Grant 8,860,489 - Li , et al. October 14, 2 | 2014-10-14 |
Systems and method for level shifters
Grant 8,847,659 - Lan , et al. September 30, 2 | 2014-09-30 |
Systems And Method For Level Shifters
App 20140266384 - Lan; Po-Hsiang ; et al. | 2014-09-18 |
Input/output Interface
App 20140266387 - Chen; Yu-Ren ; et al. | 2014-09-18 |
Voltage Level Shift Circuit For Multiple Voltage Integrated Circuits
App 20140132329 - LI; Bright ; et al. | 2014-05-15 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20140117533 - Lei; Yi-Yang ; et al. | 2014-05-01 |
Brake Disk Assembly
App 20140116822 - CHEN; CHUNG-CHENG ; et al. | 2014-05-01 |
Multiple Device Voltage Electrostatic Discharge Clamp
App 20140063665 - Chen; Yu-Ren ; et al. | 2014-03-06 |
Packaging method involving rearrangement of dice
Grant 8,431,437 - Chen , et al. April 30, 2 | 2013-04-30 |
Packaging method involving rearrangement of dice
Grant 8,426,245 - Chen , et al. April 23, 2 | 2013-04-23 |
Semiconductor Devices, Packaging Methods and Structures
App 20130026623 - Chen; Yu-Ren ; et al. | 2013-01-31 |
Layout Scheme For An Input Output Cell
App 20120241972 - CHEN; Yu-Ren ; et al. | 2012-09-27 |
Packaging Method Involving Rearrangement Of Dice
App 20110183467 - CHEN; Yu-Ren ; et al. | 2011-07-28 |
Packaging Method Involving Rearrangement Of Dice
App 20110183466 - CHEN; Yu-Ren ; et al. | 2011-07-28 |
Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration
App 20110163426 - SHEN; GENG-SHIN ; et al. | 2011-07-07 |
Chip package
Grant 7,932,531 - Lin , et al. April 26, 2 | 2011-04-26 |
Dice rearrangement package structure using layout process to form a compliant configuration
Grant 7,927,922 - Shen , et al. April 19, 2 | 2011-04-19 |
Method for fabricating multi-chip stacked package
Grant 7,919,358 - Shen , et al. April 5, 2 | 2011-04-05 |
Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers
Grant 7,888,783 - Shen , et al. February 15, 2 | 2011-02-15 |
Antenna and wireless network device having the same
Grant 7,839,335 - Chen November 23, 2 | 2010-11-23 |
Power on reset generating circuit and method thereof
Grant 7,816,957 - Chen October 19, 2 | 2010-10-19 |
Zigzag-stacked package structure
Grant 7,781,878 - Chen , et al. August 24, 2 | 2010-08-24 |
Chip Package Structure And The Method Thereof With Adhering The Chips To A Frame And Forming Ubm Layers
App 20100155916 - SHEN; Geng-Shin ; et al. | 2010-06-24 |
Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers
Grant 7,700,412 - Shen , et al. April 20, 2 | 2010-04-20 |
Power On Reset Generating Circuit And Method Thereof
App 20100060330 - CHEN; YU-REN | 2010-03-11 |
Stacked chip packaging with heat sink structure
Grant 7,663,246 - Chen , et al. February 16, 2 | 2010-02-16 |
Fuse option circuit
Grant 7,663,425 - Chen , et al. February 16, 2 | 2010-02-16 |
Manufacturing method of chip package
Grant 7,642,137 - Lin , et al. January 5, 2 | 2010-01-05 |
Chip Package
App 20090321918 - Lin; Chun-Ying ; et al. | 2009-12-31 |
Die Rearrangement Package Structure and the Forming Method Thereof
App 20090309209 - CHEN; Yu-Ren | 2009-12-17 |
Chip package structure and the method thereof
App 20090236703 - SHEN; Geng-Shin ; et al. | 2009-09-24 |
Flip Chip Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof And Chip Package Structure
App 20090189296 - Wu; Cheng-Ting ; et al. | 2009-07-30 |
Printed antenna and a wireless network device having the antenna
Grant 7,561,110 - Chen July 14, 2 | 2009-07-14 |
Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration
App 20090160043 - SHEN; GENG-SHIN ; et al. | 2009-06-25 |
Fuse option circuit
App 20090128226 - Chen; Yu-Ren ; et al. | 2009-05-21 |
Fuse option circuit
Grant 7,532,058 - Chen , et al. May 12, 2 | 2009-05-12 |
Multi-Chip Stacked Package Structure
App 20090072361 - SHEN; Geng-Shin ; et al. | 2009-03-19 |
Method for Fabricating Multi-Chip Stacked Package
App 20090075426 - SHEN; Geng-Shin ; et al. | 2009-03-19 |
Packaging Method Involving Rearrangement Of Dice
App 20090047754 - Chen; Yu-Ren ; et al. | 2009-02-19 |
Adhesion Structure For A Package Apparatus
App 20090039533 - Lin; Hung-Tsun ; et al. | 2009-02-12 |
Multi-chips Stacked package structure
App 20090001574 - FANG; Chun-fu ; et al. | 2009-01-01 |
Lead-frame Array Package Structure And Method
App 20080290478 - CHEN; Yu-Ren | 2008-11-27 |
Chip package structure and fabricating method thereof
Grant 7,446,400 - Chen , et al. November 4, 2 | 2008-11-04 |
Antenna and wireless network device having the same
App 20080268908 - Chen; Yu Ren | 2008-10-30 |
Zigzag-stacked package structure
App 20080174000 - CHEN; Yu-Ren ; et al. | 2008-07-24 |
Chip Package And Manufacturing Method Thereof
App 20080157333 - Lin; Chun-Ying ; et al. | 2008-07-03 |
Stacked chip packaging with heat sink structure
App 20080099892 - Chen; Yu-Ren ; et al. | 2008-05-01 |
Circuit and method for generating circuit power on reset signal
Grant 7,348,817 - Laio , et al. March 25, 2 | 2008-03-25 |
Fuse option circuit
App 20080061866 - Chen; Yu-Ren ; et al. | 2008-03-13 |
Chip Package Structure And Fabricating Method Threrof
App 20080006917 - Chen; Ya-Chi ; et al. | 2008-01-10 |
Integrated circuit package and multi-layer lead frame utilized
App 20070267756 - Mao; I-Hsin ; et al. | 2007-11-22 |
Circuit and method for generating circuit power on reset signal
App 20070170961 - Liao; Chun-Yao ; et al. | 2007-07-26 |
Printed antenna and a wireless network device having the antenna
App 20070164920 - Chen; Yu Ren | 2007-07-19 |
Disposable diaper with longitudinal anti-leakage means
Grant 5,399,176 - Chen March 21, 1 | 1995-03-21 |
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