Chen; Yu-Huei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Yu-Huei.The latest application filed is for "heat- and ethylene-inducible fruit specific promoter".

Company Profile

0.6.7

Chen; Yu-Huei - Taipei City TW
Chen; Yu-Huei - Hsin-Chu TW
Chen; Yu-Huei - Taipei TW
Chen, Yu-Huei - Hsin-Che TW
Chen, Yu-Huei - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat- And Ethylene-inducible Fruit Specific Promoter App 20100170014 - Jeng; Shih-Tong ; et al.	2010-07-01
EBR shape of spin-on low-k material providing good film stacking Grant 7,176,135 - Chen , et al. February 13, 2	2007-02-13
Novel EBR shape of spin-on low-k material providing good film stacking App 20050151227 - Chen, Yu-Huei ; et al.	2005-07-14
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry Grant 6,884,149 - Tsai , et al. April 26, 2	2005-04-26
Method for improving adhesion between dielectric material layers Grant 6,812,167 - Chen , et al. November 2, 2	2004-11-02
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry App 20040203322 - Tsai, Shang-Ting ; et al.	2004-10-14
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant Grant 6,756,321 - Ko , et al. June 29, 2	2004-06-29
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry Grant 6,729,935 - Tsai , et al. May 4, 2	2004-05-04
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant App 20040067658 - Ko, Chung-Chi ; et al.	2004-04-08
Dual damascene aperture formation method absent intermediate etch stop layer Grant 6,706,637 - Chen , et al. March 16, 2	2004-03-16
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry App 20030232575 - Tsai, Shang-Ting ; et al.	2003-12-18
Method for improving adhesion between dielectric material layers App 20030228769 - Chen, Yu-Huei ; et al.	2003-12-11
Dual damascene aperture formation method absent intermediate etch stop layer App 20030211746 - Chen, Yu-Huei ; et al.	2003-11-13

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