CHEN; Yu-Huan

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHEN; Yu-Huan.The latest application filed is for "radiation source apparatus and method for using the same".

Company Profile

2.5.7

CHEN; Yu-Huan - Hsinchu City TW
Chen; Yu-Huan - Hsinchu TW
CHEN; Yu-Huan - Taoyuan City TW
Chen; Yu-Huan - Taoyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Radiation Source Apparatus And Method For Using The Same App 20220304131 - CHENG; Chiao-Hua ; et al.	2022-09-22
EUV photolithography system and methods of operating the same Grant 11,442,365 - Sun , et al. September 13, 2	2022-09-13
Substrate Stage, Substrate Processing System Using The Same, And Method For Processing Substrate App 20220283517 - CHEN; Yu-Huan ; et al.	2022-09-08
Droplet Generator And Method Of Servicing A Photolithographic Tool App 20220276572 - CHEN; Yu-Huan ; et al.	2022-09-01
Chip Package Structure With Metal-containing Layer App 20220270963 - CHEN; Yu-Huan ; et al.	2022-08-25
Chip Package Structure With Conductive Adhesive Layer App 20220238352 - HSU; Kuo-Ching ; et al.	2022-07-28
Chip package structure and method for forming the same Grant 11,335,634 - Chen , et al. May 17, 2	2022-05-17
Chip package structure with conductive adhesive layer and method for forming the same Grant 11,302,537 - Hsu , et al. April 12, 2	2022-04-12
Droplet generator and method of servicing a photolithographic tool Grant 11,275,317 - Chen , et al. March 15, 2	2022-03-15
Chip Package Structure With Conductive Adhesive Layer And Method For Forming The Same App 20210313195 - HSU; Kuo-Ching ; et al.	2021-10-07
Chip Package Structure And Method For Forming The Same App 20210066181 - CHEN; Yu-Huan ; et al.	2021-03-04
Semiconductor package assembly, semiconductor package and forming method thereof Grant 9,748,156 - Yeh , et al. August 29, 2	2017-08-29

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