Chen; Yu-Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Yu-Feng.The latest application filed is for "fingerprint sensor device and method".

Company Profile

41.101.109

Chen; Yu-Feng - Hsinchu TW
CHEN; YU-FENG - Hsinchu County TW
Chen; Yu-Feng - Plano TX
Chen; Yu-Feng - Hsinchu City TW
Chen; Yu-Feng - Hsin-Chu TW
Chen; Yu-Feng - Hsin-Chu City TW
Chen, Yu-Feng - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device package including embedded conductive elements Grant 11,282,817 - Chen , et al. March 22, 2	2022-03-22
Fingerprint Sensor Device And Method App 20220067334 - Huang; Yu-Chih ; et al.	2022-03-03
Fingerprint sensor device and method Grant 11,194,990 - Huang , et al. December 7, 2	2021-12-07
Semiconductor Device and Method of Forming Same App 20210351139 - Tseng; Chih-Hsiang ; et al.	2021-11-11
Semiconductor package and manufacturing process thereof Grant 11,171,016 - Chen , et al. November 9, 2	2021-11-09
Metal Bumps and Method Forming Same App 20210288009 - Cheng; Ming-Da ; et al.	2021-09-16
Bluetooth Communication System, Electronic Device And Bluetooth Chip Having Low Power Consumption App 20210281991 - CHEN; YU-FENG ; et al.	2021-09-09
Fingerprint Sensor In Info Structure And Formation Method App 20210271842 - Chen; Chih-Hua ; et al.	2021-09-02
Systems and methods for plate voltage regulation during memory array access Grant 11,087,820 - Chen , et al. August 10, 2	2021-08-10
Semiconductor device and method of forming same Grant 11,075,173 - Tseng , et al. July 27, 2	2021-07-27
Package Structures and Method of Forming the Same App 20210183745 - Yu; Chen-Hua ; et al.	2021-06-17
Metal bumps and method forming same Grant 11,024,593 - Cheng , et al. June 1, 2	2021-06-01
Fingerprint sensor in InFO structure and formation method Grant 11,010,580 - Chen , et al. May 18, 2	2021-05-18
Scheme for connector site spacing and resulting structures Grant 10,985,114 - Chen , et al. April 20, 2	2021-04-20
Fingerprint Sensor Device and Method App 20210081636 - Yu; Chen-Hua ; et al.	2021-03-18
Package structures and method of forming the same Grant 10,937,718 - Yu , et al. March 2, 2	2021-03-02
Fingerprint sensor pixel array and methods of forming same Grant 10,878,073 - Huang , et al. December 29, 2	2020-12-29
Fingerprint sensor device and method Grant 10,853,616 - Yu , et al. December 1, 2	2020-12-01
Wireless Charging Devices Having Wireless Charging Coils and Methods of Manufacture Thereof App 20200350782 - Yu; Chen-Hua ; et al.	2020-11-05
Fingerprint Sensor Pixel Array and Methods of Forming Same App 20200327214 - Huang; Yu-Chih ; et al.	2020-10-15
Semiconductor Package And Manufacturing Process Thereof App 20200303211 - Chen; Yu-Feng ; et al.	2020-09-24
Methods for Making Multi-Die Package With Bridge Layer App 20200266074 - Chang; Wei Sen ; et al.	2020-08-20
Wireless charging devices having wireless charging coils and methods of manufacture thereof Grant 10,720,788 - Yu , et al.	2020-07-21
Semiconductor package and manufacturing process thereof Grant 10,707,094 - Chen , et al.	2020-07-07
Fingerprint sensor pixel array and methods of forming same Grant 10,698,994 - Huang , et al.	2020-06-30
Electronic device with a fuse array mechanism Grant 10,672,489 - Riley , et al.	2020-06-02
Semiconductor Device Package Including Embedded Conductive Elements App 20200168583 - CHEN; Yu-Feng ; et al.	2020-05-28
Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die Grant 10,658,334 - Cheng , et al.	2020-05-19
Methods for making multi-die package with bridge layer Grant 10,643,861 - Chang , et al.	2020-05-05
Semiconductor Device And Method Of Forming Same App 20200135664 - Tseng; Chih-Hsiang ; et al.	2020-04-30
Power Noise Reduction Technique For High Density Memory With Gating App 20200126599 - Venkata; Harish N. ; et al.	2020-04-23
Fingerprint Sensor Device and Method App 20200117874 - Yu; Chen-Hua ; et al.	2020-04-16
Power noise reduction technique for high density memory with gating Grant 10,622,031 - Venkata , et al.	2020-04-14
Metal Bumps and Method Forming Same App 20200105696 - Cheng; Ming-Da ; et al.	2020-04-02
Design Scheme for Connector Site Spacing and Resulting Structures App 20200058601 - Chen; Yu-Feng ; et al.	2020-02-20
Mechanisms of forming connectors for package on package Grant 10,553,561 - Chen , et al. Fe	2020-02-04
Systems And Methods For Plate Voltage Regulation During Memory Array Access App 20190392887 - Chen; Yu-Feng ; et al.	2019-12-26
Fingerprint sensor device and method Grant 10,509,938 - Yu , et al. Dec	2019-12-17
Scheme for connector site spacing and resulting structures Grant 10,504,856 - Chen , et al. Dec	2019-12-10
Systems and methods for plate voltage regulation during memory array access Grant 10,497,424 - Chen , et al. De	2019-12-03
Fingerprint Sensor in InFO Structure and Formation Method App 20190340405 - Chen; Chih-Hua ; et al.	2019-11-07
Electronic Device With A Fuse Array Mechanism App 20190333594 - Riley; John E. ; et al.	2019-10-31
Power noise reduction technique for high density memory with frequency adjustments Grant 10,418,073 - Venkata , et al. Sept	2019-09-17
Power noise reduction technique for high density memory with gating Grant 10,403,330 - Venkata , et al. Sep	2019-09-03
Semiconductor Package And Manufacturing Process Thereof App 20190252209 - Chen; Yu-Feng ; et al.	2019-08-15
Fingerprint Sensor Device and Method App 20190251321 - Yu; Chen-Hua ; et al.	2019-08-15
Fingerprint Sensor Device and Method App 20190244004 - Huang; Yu-Chih ; et al.	2019-08-08
Electronic device with a fuse array mechanism Grant 10,373,698 - Riley , et al.	2019-08-06
Pre-applying supporting materials between bonded package components Grant 10,366,971 - Hsu , et al. July 30, 2	2019-07-30
Electronic device with a fuse-read trigger mechanism Grant 10,360,989 - Sreeramaneni , et al.	2019-07-23
Fingerprint sensor in InFO structure and formation method Grant 10,354,114 - Chen , et al. July 16, 2	2019-07-16
Systems And Methods For Improving Fuse Systems In Memory Devices App 20190198127 - Riley; John E. ; et al.	2019-06-27
Systems and methods for improving fuse systems in memory devices Grant 10,332,609 - Riley , et al.	2019-06-25
Systems And Methods For Plate Voltage Regulation During Memory Array Access App 20190172518 - Chen; Yu-Feng ; et al.	2019-06-06
Electronic Device With A Fuse-read Trigger Mechanism App 20190172546 - Sreeramaneni; Raghukiran ; et al.	2019-06-06
Semiconductor package and manufacturing process thereof Grant 10,276,402 - Chen , et al.	2019-04-30
Fingerprint Sensor Pixel Array and Methods of Forming Same App 20190121952 - Huang; Yu-Chih ; et al.	2019-04-25
Fingerprint sensor device and method Grant 10,268,872 - Huang , et al.	2019-04-23
Fingerprint sensor device and method Grant 10,268,868 - Yu , et al.	2019-04-23
Contact area design for solder bonding Grant 10,157,874 - Tsai , et al. Dec	2018-12-18
Fingerprint sensor pixel array and methods of forming same Grant 10,157,274 - Huang , et al. Dec	2018-12-18
Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 10,128,208 - Hou , et al. November 13, 2	2018-11-13
Integrated circuit package and method of forming same Grant 10,125,014 - Pan , et al. November 13, 2	2018-11-13
Package Substrates, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20180204815 - Hou; Hao-Cheng ; et al.	2018-07-19
Protrusion bump pads for bond-on-trace processing Grant 10,020,276 - Chen , et al. July 10, 2	2018-07-10
Fingerprint Sensor Pixel Array and Methods of Forming Same App 20180181738 - Huang; Yu-Chih ; et al.	2018-06-28
Fingerprint Sensor Device and Method App 20180173932 - Huang; Yu-Chih ; et al.	2018-06-21
Package Structures and Method of Forming the Same App 20180166364 - Yu; Chen-Hua ; et al.	2018-06-14
Method of forming a semiconductor device including strain reduced structure Grant 9,997,480 - Chen , et al. June 12, 2	2018-06-12
Fingerprint Sensor Device and Method App 20180150667 - Yu; Chen-Hua ; et al.	2018-05-31
Integrated Circuit Package and Method of Forming Same App 20180111827 - Pan; Kuo Lung ; et al.	2018-04-26
Optical sensing system and associated electronic device Grant 9,943,239 - Kuo , et al. April 17, 2	2018-04-17
Semiconductor devices and methods of manufacture thereof Grant 9,941,140 - Chen , et al. April 10, 2	2018-04-10
Hybrid interconnect for chip stacking Grant 9,935,081 - Pan , et al. April 3, 2	2018-04-03
Semiconductor structure and manufacturing method of the same Grant 9,935,073 - Lin , et al. April 3, 2	2018-04-03
Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 9,917,068 - Hou , et al. March 13, 2	2018-03-13
Multi-chip package system and methods of forming the same Grant 9,911,724 - Chen , et al. March 6, 2	2018-03-06
Fingerprint sensor pixel array and methods of forming same Grant 9,904,776 - Huang , et al. February 27, 2	2018-02-27
Method For Forming A Package Structure Including Forming A Molding Compound On First Larger Bumps Surrounding A Semiconductor Die And Second Smaller Bumps Formed Under The Semiconductor Die App 20180053745 - CHENG; Yu-Jen ; et al.	2018-02-22
Fingerprint sensor device and method Grant 9,898,645 - Huang , et al. February 20, 2	2018-02-20
Method Of Forming A Semiconductor Device Including Strain Reduced Structure App 20180047686 - CHEN; Hsien-Wei ; et al.	2018-02-15
Package structures and method of forming the same Grant 9,881,850 - Yu , et al. January 30, 2	2018-01-30
Fingerprint sensor device and method Grant 9,875,388 - Yu , et al. January 23, 2	2018-01-23
Contact area design for solder bonding Grant 9,871,013 - Tsai , et al. January 16, 2	2018-01-16
Integrated circuit package and method of forming same Grant 9,850,126 - Pan , et al. December 26, 2	2017-12-26
Fingerprint Sensor in InFO Structure and Formation Method App 20170357838 - Chen; Chih-Hua ; et al.	2017-12-14
Packaging device having plural microstructures disposed proximate to die mounting region Grant 9,837,346 - Pan , et al. December 5, 2	2017-12-05
Contact Area Design for Solder Bonding App 20170345785 - Tsai; Pei-Chun ; et al.	2017-11-30
Strain reduced structure for IC packaging Grant 9,806,042 - Chen , et al. October 31, 2	2017-10-31
Semicondcutor Package And Manufacturing Process Thereof App 20170271248 - Chen; Yu-Feng ; et al.	2017-09-21
Optical Sensing System And Associated Electronic Device App 20170251937 - KUO; HUNG-YI ; et al.	2017-09-07
Fingerprint Sensor Device and Method App 20170249493 - Yu; Chen-Hua ; et al.	2017-08-31
Methods For Making Multi-die Package With Bridge Layer App 20170236724 - Chang; Wei Sen ; et al.	2017-08-17
Chip packages and methods of manufacture thereof Grant 9,735,130 - Pan , et al. August 15, 2	2017-08-15
Fingerprint Sensor Pixel Array And Methods Of Forming Same App 20170228529 - Huang; Yu-Chih ; et al.	2017-08-10
Semiconductor Structure And Manufacturing Method Of The Same App 20170213804 - LIN; YEN-LIANG ; et al.	2017-07-27
Multi-chip Package System And Methods Of Forming The Same App 20170207208 - Chen; Chih-Hua ; et al.	2017-07-20
Integrated Circuit Package and Method of Forming Same App 20170190572 - Pan; Kuo Lung ; et al.	2017-07-06
Packaging Device Having Plural Microstructures Disposed Proximate to Die Mounting Region App 20170186681 - Pan; Kuo Lung ; et al.	2017-06-29
Semiconductor package and manufacturing method thereof Grant 9,691,708 - Huang , et al. June 27, 2	2017-06-27
Semiconductor Devices and Methods of Manufacture Thereof App 20170162541 - Chen; Yu-Feng ; et al.	2017-06-08
Packages with molding material forming steps Grant 9,673,184 - Hsu , et al. June 6, 2	2017-06-06
Semiconductor device Grant 9,666,530 - Chen , et al. May 30, 2	2017-05-30
Fingerprint Sensor Device and Method App 20170140202 - Huang; Yu-Chih ; et al.	2017-05-18
Time Information Based Authentication Method, Integrated Circuit Film, Sim Card Or Sd Card App 20170126670 - Lin; Yvette E-Wen ; et al.	2017-05-04
Multi-die package with bridge layer and method for making the same Grant 9,640,521 - Chang , et al. May 2, 2	2017-05-02
Semiconductor structure and manufacturing method of the same Grant 9,633,965 - Lin , et al. April 25, 2	2017-04-25
Wireless Charging Devices, Methods of Manufacture Thereof, and Charging Methods App 20170104356 - Yu; Chen-Hua ; et al.	2017-04-13
Packaging device having plural microstructures disposed proximate to die mounting region Grant 9,607,959 - Pan , et al. March 28, 2	2017-03-28
Package Structures and Method of Forming the Same App 20170084590 - Yu; Chen-Hua ; et al.	2017-03-23
Multi-chip package system and methods of forming the same Grant 9,589,941 - Chen , et al. March 7, 2	2017-03-07
Semiconductor packaging having warpage control and methods of forming same Grant 9,589,861 - Huang , et al. March 7, 2	2017-03-07
Protrusion Bump Pads for Bond-on-Trace Processing App 20170053885 - Chen; Chen-Shien ; et al.	2017-02-23
Semiconductor devices and methods of manufacture thereof Grant 9,576,874 - Chen , et al. February 21, 2	2017-02-21
Design Scheme for Connector Site Spacing and Resulting Structures App 20170047298 - Chen; Yu-Feng ; et al.	2017-02-16
Package having substrate with embedded metal trace overlapped by landing pad Grant 9,559,076 - Lii , et al. January 31, 2	2017-01-31
Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof Grant 9,559,069 - Chen , et al. January 31, 2	2017-01-31
Bumps for chip scale packaging including under bump metal structures with different diameters Grant 9,553,065 - Lin , et al. January 24, 2	2017-01-24
Protrusion bump pads for bond-on-trace processing Grant 9,508,637 - Chen , et al. November 29, 2	2016-11-29
Mechanisms Of Forming Connectors For Package On Package App 20160343691 - CHEN; Yu-Feng ; et al.	2016-11-24
Stress compensation layer for 3D packaging Grant 9,502,360 - Lin , et al. November 22, 2	2016-11-22
Scheme for connector site spacing and resulting structures Grant 9,484,317 - Chen , et al. November 1, 2	2016-11-01
Semiconductor Packaging Having Warpage Control and Methods of Forming Same App 20160307815 - Huang; Yu-Chih ; et al.	2016-10-20
Copper-containing layer on under-bump metallization layer Grant 9,472,524 - Chen , et al. October 18, 2	2016-10-18
Zero stand-off bonding system and method Grant 9,418,956 - Lin , et al. August 16, 2	2016-08-16
Mechanisms for forming connectors with a molding compound for package on package Grant 9,418,947 - Chen , et al. August 16, 2	2016-08-16
Semiconductor Device, Integrated Circuit Structure Using The Same, And Manufacturing Method Thereof App 20160225729 - CHEN; Yu-Feng ; et al.	2016-08-04
Package structure and method of forming the same Grant 9,406,634 - Shieh , et al. August 2, 2	2016-08-02
Package Having Substrate With Embedded Metal Trace Overlapped by Landing Pad App 20160211239 - Lii; Mirng-Ji ; et al.	2016-07-21
Package on package devices and methods of packaging semiconductor dies Grant 9,397,080 - Hsu , et al. July 19, 2	2016-07-19
Methods and apparatus for package with interposers Grant 9,391,012 - Wu , et al. July 12, 2	2016-07-12
Contact Area Design For Solder Bonding App 20160190082 - Tsai; Pei-Chun ; et al.	2016-06-30
Semiconductor packaging having warpage control and methods of forming same Grant 9,379,032 - Huang , et al. June 28, 2	2016-06-28
Pre-Applying Supporting Materials Between Bonded Package Components App 20160172348 - Hsu; Yu-Chen ; et al.	2016-06-16
Package-on-package structure Grant 9,355,928 - Chen , et al. May 31, 2	2016-05-31
Package having substrate with embedded metal trace overlapped by landing pad Grant 9,305,890 - Lii , et al. April 5, 2	2016-04-05
Package and Method for Making the Same App 20160093597 - Chang; Wei Sen ; et al.	2016-03-31
Semiconductor Devices and Methods of Manufacture Thereof App 20160086900 - Chen; Yu-Feng ; et al.	2016-03-24
Pre-applying supporting materials between bonded package components Grant 9,293,404 - Hsu , et al. March 22, 2	2016-03-22
Semiconductor Packaging Having Warpage Control And Methods Of Forming Same App 20160079135 - Huang; Yu-Chih ; et al.	2016-03-17
Design Scheme for Connector Site Spacing and Resulting Structures App 20160071812 - Chen; Yu-Feng ; et al.	2016-03-10
Packaging Devices, Packaged Semiconductor Devices, and Packaging Methods App 20160064348 - Pan; Kuo Lung ; et al.	2016-03-03
Chip Packages And Methods Of Manufacture Thereof App 20160064355 - Pan; Kuo Lung ; et al.	2016-03-03
Hybrid Interconnect for Chip Stacking App 20160056125 - Pan; Kuo Lung ; et al.	2016-02-25
Transaction Device, Transaction System Using The Same And Transaction Method Using The Same App 20160055473 - Lin; Yvette E-Wen ; et al.	2016-02-25
Semiconductor Structure And Manufacturing Method Of The Same App 20160043051 - LIN; Yen-Liang ; et al.	2016-02-11
Copper-containing Layer On Under-bump Metallization Layer App 20160020186 - CHEN; Yu-Feng ; et al.	2016-01-21
Semiconductor devices and methods of manufacture thereof Grant 9,209,140 - Chen , et al. December 8, 2	2015-12-08
Scheme for connector site spacing and resulting structures Grant 9,190,348 - Chen , et al. November 17, 2	2015-11-17
Zero Stand-Off Bonding System and Method App 20150303161 - Lin; Chun-Hung ; et al.	2015-10-22
Crack stopper on under-bump metallization layer Grant 9,159,686 - Chen , et al. October 13, 2	2015-10-13
Package Substrates, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20150262956 - Hou; Hao-Cheng ; et al.	2015-09-17
Package Structure And Method Of Forming The Same App 20150243622 - SHIEH; Yuh Chern ; et al.	2015-08-27
Elongated bump structure for semiconductor devices Grant 9,093,332 - Kuo , et al. July 28, 2	2015-07-28
Package Having Substrate With Embedded Metal TraceOverlapped by Landing Pad App 20150200172 - Lii; Mirng-Ji ; et al.	2015-07-16
Protrusion Bump Pads for Bond-on-Trace Processing App 20150194379 - Chen; Chen-Shien ; et al.	2015-07-09
Package on Package Devices and Methods of Packaging Semiconductor Dies App 20150187746 - Hsu; Chun-Lei ; et al.	2015-07-02
Methods and Apparatus for Package with Interposers App 20150179561 - Wu; Kai-Chiang ; et al.	2015-06-25
Zero stand-off bonding system and method Grant 9,064,880 - Lin , et al. June 23, 2	2015-06-23
Packages with Molding Material Forming Steps App 20150147847 - Hsu; Yu-Chen ; et al.	2015-05-28
Bump-on-trace (BOT) structures Grant 9,041,223 - Shieh , et al. May 26, 2	2015-05-26
Illumination Control System and Illumination Control Method App 20150138433 - Wang; Chi-Jung ; et al.	2015-05-21
Light Control System and Light Control Method Thereof App 20150137708 - Wang; Chi-Jung ; et al.	2015-05-21
Methods and apparatus for package with interposers Grant 8,994,176 - Wu , et al. March 31, 2	2015-03-31
Package on package devices and methods of packaging semiconductor dies Grant 8,981,559 - Hsu , et al. March 17, 2	2015-03-17
Semiconductor Devices and Methods of Manufacture Thereof App 20150061127 - Chen; Yu-Feng ; et al.	2015-03-05
Extending metal traces in bump-on-trace structures Grant 8,970,033 - Chen , et al. March 3, 2	2015-03-03
Packages with molding material forming steps Grant 8,970,024 - Hsu , et al. March 3, 2	2015-03-03
Design Scheme for Connector Site Spacing and Resulting Structures App 20140291838 - Chen; Yu-Feng ; et al.	2014-10-02
Package-on-Package Structure App 20140264849 - Chen; Yu-Feng ; et al.	2014-09-18
Packages with Molding Material Forming Steps App 20140264810 - Hsu; Yu-Chen ; et al.	2014-09-18
Pre-Applying Supporting Materials between Bonded Package Components App 20140203456 - Hsu; Yu-Chen ; et al.	2014-07-24
Bumps for Chip Scale Packaging App 20140191394 - Lin; Chun-Hung ; et al.	2014-07-10
Zero Stand-Off Bonding System and Method App 20140183746 - Lin; Chun-Hung ; et al.	2014-07-03
Methods and Apparatus for Package with Interposers App 20140167263 - Wu; Kai-Chiang ; et al.	2014-06-19
Methods and apparatus for package on package devices with reduced strain Grant 8,680,663 - Chen , et al. March 25, 2	2014-03-25
Package on Package Devices and Methods of Packaging Semiconductor Dies App 20130341786 - Hsu; Chun-Lei ; et al.	2013-12-26
Strain Reduced Structure For Ic Packaging App 20130270698 - CHEN; Hsien-Wei ; et al.	2013-10-17
Mechanisms Of Forming Connectors For Package On Package App 20130221522 - CHEN; Yu-Feng ; et al.	2013-08-29
Crack Stopper On Under-bump Metallization Layer App 20130187277 - Chen; Yu-Feng ; et al.	2013-07-25
Stress Compensation Layer for 3D Packaging App 20130175705 - Lin; Chun-Hung ; et al.	2013-07-11
Methods and Apparatus for Package On Package Devices with Reduced Strain App 20130168855 - Chen; Yu-Feng ; et al.	2013-07-04
Bumps for Chip Scale Packaging App 20130119532 - Lin; Chun-Hung ; et al.	2013-05-16
Wafer level chip scale package with reduced stress on solder balls Grant 8,373,282 - Chen , et al. February 12, 2	2013-02-12
Bump-on-trace (bot) Structures App 20130001778 - SHIEH; Yuh Chern ; et al.	2013-01-03
Wafer Level Chip Scale Package with Reduced Stress on Solder Balls App 20120319270 - Chen; Yu-Feng ; et al.	2012-12-20
Reduced-stress Bump-on-trace (bot) Structures App 20120273934 - SHIEH; Yuh Chern ; et al.	2012-11-01
Reduced-stress bump-on-trace (BOT) structures Grant 8,288,871 - Shieh , et al. October 16, 2	2012-10-16
Extending Metal Traces in Bump-on-Trace Structures App 20120217632 - Chen; Yu-Feng ; et al.	2012-08-30
Elongated Bump Structure for Semiconductor Devices App 20120199966 - Kuo; Tin-Hao ; et al.	2012-08-09
Method For Modifying Surface Of Aluminum Oxide And Electroosmosis Pump And Electric Power Generator Using Modified Aluminum Oxide Membrane App 20100147689 - Chen; Yu-Feng ; et al.	2010-06-17
Apparatus and method for simulating a mold cooling process for injection molding App 20080077369 - Chang; Rong-Yeu ; et al.	2008-03-27
Cart bag App 20040036240 - Chen, Yu-Feng	2004-02-26

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