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Bonding to Alignment marks with Dummy Alignment Marks
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Integrated Circuit Package and Method of Forming Thereof
App 20220301890 - Chen; Hsien-Wei ; et al. | 2022-09-22 |
Structure and Method of Forming a Joint Assembly
App 20220302069 - Chen; Ying-Ju ; et al. | 2022-09-22 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220271014 - Chen; Ying-Ju ; et al. | 2022-08-25 |
Semiconductor Package With Shared Barrier Layer In Redistribution And Via And Method Of Manufacturing The Same
App 20220262772 - Chen; Hsien-Wei ; et al. | 2022-08-18 |
Package Structure With Photonic Die And Method
App 20220246502 - Chen; Hsien-Wei ; et al. | 2022-08-04 |
Die Stack Structure And Manufacturing Method Thereof
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Recombinant Baculoviruses And Their Uses In Detecting Arthropod-borne Virus
App 20220196673 - WU; Tzong-Yuan ; et al. | 2022-06-23 |
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
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Semiconductor structure and manufacturing method thereof
Grant 11,362,066 - Chen , et al. June 14, 2 | 2022-06-14 |
Semiconductor package with shared barrier layer in redistribution and via
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Structure and method of forming a joint assembly
Grant 11,355,468 - Chen , et al. June 7, 2 | 2022-06-07 |
Package structure with photonic die and method
Grant 11,315,855 - Chen , et al. April 26, 2 | 2022-04-26 |
Die stack structure and manufacturing method thereof
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Die Stack Structure And Manufacturing Method Thereof
App 20220093564 - Chen; Hsien-Wei ; et al. | 2022-03-24 |
Manufacturing Method Of Semiconductor Structure
App 20220077097 - Chen; Jie ; et al. | 2022-03-10 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 11,270,989 - Chen , et al. March 8, 2 | 2022-03-08 |
Mechanisms for forming post-passivation interconnect structure
Grant 11,257,775 - Chen , et al. February 22, 2 | 2022-02-22 |
Method For Fabricating A Chip Package
App 20210391168 - Chen; Jie ; et al. | 2021-12-16 |
Chimeric Signal Peptides For Protein Production
App 20210388046 - TENG; Chao-Yi ; et al. | 2021-12-16 |
Structure And Method For Forming Integrated High Density Mim Capacitor
App 20210391413 - Chen; Hsien-Wei ; et al. | 2021-12-16 |
Semiconductor structure
Grant 11,195,804 - Chen , et al. December 7, 2 | 2021-12-07 |
Wafer Level Dicing Method And Semiconductor Device
App 20210366773 - Chen; Ying-Ju ; et al. | 2021-11-25 |
Semiconductor structure
Grant 11,183,475 - Chen , et al. November 23, 2 | 2021-11-23 |
Semiconductor packages including routing dies and methods of forming same
Grant 11,177,201 - Chen , et al. November 16, 2 | 2021-11-16 |
Redistribution Layer Structures For Integrated Circuit Package
App 20210351130 - CHEN; Jie ; et al. | 2021-11-11 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 11,164,857 - Chen , et al. November 2, 2 | 2021-11-02 |
Integrated Circuits
App 20210335735 - Chen; Hsien-Wei ; et al. | 2021-10-28 |
Passivation Scheme Design For Wafer Singulation
App 20210335722 - Chen; Hsien-Wei ; et al. | 2021-10-28 |
Package Structure With Photonic Die And Method
App 20210313254 - Chen; Hsien-Wei ; et al. | 2021-10-07 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210305209 - Chen; Ying-Ju ; et al. | 2021-09-30 |
Packaging scheme involving metal-insulator-metal capacitor
Grant 11,133,304 - Shen , et al. September 28, 2 | 2021-09-28 |
Mask assembly and method for fabricating a chip package
Grant 11,107,680 - Chen , et al. August 31, 2 | 2021-08-31 |
Wafer level dicing method and semiconductor device
Grant 11,081,391 - Chen , et al. August 3, 2 | 2021-08-03 |
Redistribution layer structures for integrated circuit package
Grant 11,056,433 - Chen , et al. July 6, 2 | 2021-07-06 |
Packaging Scheme Involving Metal-Insulator-Metal Capacitor
App 20210159224 - Shen; Hsiang-Ku ; et al. | 2021-05-27 |
Underfill control structures and method
Grant 11,018,069 - Chen , et al. May 25, 2 | 2021-05-25 |
Supporting InFO Packages to Reduce Warpage
App 20210151389 - Chen; Jie ; et al. | 2021-05-20 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210134685 - Chen; Hsien-Wei ; et al. | 2021-05-06 |
Package Structure And Method Of Manufacturing The Same
App 20210098423 - Chen; Hsien-Wei ; et al. | 2021-04-01 |
Semiconductor device
Grant 10,964,659 - Chen , et al. March 30, 2 | 2021-03-30 |
Semiconductor device and method of manufacture
Grant 10,943,889 - Chen , et al. March 9, 2 | 2021-03-09 |
Package structure and method of manufacturing the same
Grant 10,923,421 - Chen , et al. February 16, 2 | 2021-02-16 |
Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same
App 20210035953 - Yu; Chen-Hua ; et al. | 2021-02-04 |
Supporting InFO packages to reduce warpage
Grant 10,886,238 - Chen , et al. January 5, 2 | 2021-01-05 |
Semiconductor Structure
App 20200381374 - CHEN; YING-JU ; et al. | 2020-12-03 |
Semiconductor Structure
App 20200350245 - Chen; Ying-Ju ; et al. | 2020-11-05 |
Package Structure And Method Of Manufacturing The Same
App 20200343183 - Chen; Ying-Ju ; et al. | 2020-10-29 |
Semiconductor structure
Grant 10,818,615 - Chen , et al. October 27, 2 | 2020-10-27 |
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 10,811,394 - Yu , et al. October 20, 2 | 2020-10-20 |
Three-dimensional integrated circuit structures
Grant 10,797,001 - Chen , et al. October 6, 2 | 2020-10-06 |
Recombinant Baculoviruses And Their Uses In Detecting Arthropod-borne Virus
App 20200300856 - WU; Tzong-Yuan ; et al. | 2020-09-24 |
Redistribution Layer Structures For Integrated Circuit Package
App 20200286830 - CHEN; Jie ; et al. | 2020-09-10 |
Semiconductor Device and Method of Manufacture
App 20200279833 - Chen; Hsien-Wei ; et al. | 2020-09-03 |
Semiconductor structure
Grant 10763224 - | 2020-09-01 |
Semiconductor Structure
App 20200251439 - Kind Code | 2020-08-06 |
Semiconductor structure
Grant 10,720,385 - Chen , et al. | 2020-07-21 |
Recombinant baculoviruses and their uses in detecting arthropod-borne virus
Grant 10,718,771 - Wu , et al. | 2020-07-21 |
Redistribution layer structures for integrated circuit package
Grant 10,665,540 - Chen , et al. | 2020-05-26 |
Semiconductor device and method of manufacture
Grant 10,658,339 - Chen , et al. | 2020-05-19 |
Supporting InFO packages to reduce warpage
Grant 10,651,131 - Chen , et al. | 2020-05-12 |
Structure and method of forming a joint assembly
Grant 10,643,965 - Chen , et al. | 2020-05-05 |
Semiconductor structure
Grant 10,629,560 - Chen , et al. | 2020-04-21 |
Semiconductor Device
App 20200075525 - CHEN; JIE ; et al. | 2020-03-05 |
Three-dimensional Integrated Circuit Structures
App 20200043861 - Chen; Jie ; et al. | 2020-02-06 |
Supporting InFO Packages to Reduce Warpage
App 20200013733 - Chen; Jie ; et al. | 2020-01-09 |
Underfill Control Structures and Method
App 20200006179 - Chen; Ying-Ju ; et al. | 2020-01-02 |
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
App 20200006313 - Chen; Jie ; et al. | 2020-01-02 |
Supporting InFO Packages to Reduce Warpage
App 20200006251 - Chen; Jie ; et al. | 2020-01-02 |
Structure and Method of Forming a Joint Assembly
App 20200006276 - Chen; Ying-Ju ; et al. | 2020-01-02 |
Three-dimensional Integrated Circuit Structures
App 20190393159 - Chen; Jie ; et al. | 2019-12-26 |
Underfill control structures and method
Grant 10,515,865 - Chen , et al. Dec | 2019-12-24 |
Three-dimensional integrated circuit structures
Grant 10,504,852 - Chen , et al. Dec | 2019-12-10 |
Redistribution Layer Structures For Integrated Circuit Package
App 20190348366 - CHEN; Jie ; et al. | 2019-11-14 |
Semiconductor device
Grant 10,475,760 - Chen , et al. Nov | 2019-11-12 |
Mechanisms for Forming Post-Passivation Interconnect Structure
App 20190326241 - Chen; Ying-Ju ; et al. | 2019-10-24 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20190326259 - Yu; Chen-Hua ; et al. | 2019-10-24 |
Semiconductor Structure
App 20190295964 - CHEN; Ying-Ju ; et al. | 2019-09-26 |
Recombinant Baculoviruses And Their Uses In Detecting Arthropod Born Virus
App 20190250161 - WU; Tzong-Yuan ; et al. | 2019-08-15 |
Redistribution layer structures for integrated circuit package
Grant 10,366,953 - Chen , et al. July 30, 2 | 2019-07-30 |
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 10,347,606 - Yu , et al. July 9, 2 | 2019-07-09 |
Mechanisms for forming post-passivation interconnect structure
Grant 10,340,240 - Chen , et al. | 2019-07-02 |
Semiconductor structure and manufacturing method thereof
Grant 10,325,865 - Chen , et al. | 2019-06-18 |
Semiconductor Structure
App 20190164925 - Chen; Jie ; et al. | 2019-05-30 |
Semiconductor Packages And Methods Of Forming Same
App 20190148276 - Chen; Jie ; et al. | 2019-05-16 |
Semiconductor Device and Method of Manufacture
App 20190131279 - Chen; Hsien-Wei ; et al. | 2019-05-02 |
Ring structures in device die
Grant 10,262,952 - Chen , et al. | 2019-04-16 |
Mask Assembly And Method For Fabricating A Chip Package
App 20190067001 - Chen; Jie ; et al. | 2019-02-28 |
Method and electronic apparatus for associating note and calendar event
Grant 10,216,371 - Chen , et al. Feb | 2019-02-26 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190051622 - CHEN; YING-JU ; et al. | 2019-02-14 |
Semiconductor structure
Grant 10,181,449 - Chen , et al. Ja | 2019-01-15 |
Alignment pattern for package singulation
Grant 10,163,807 - Chen , et al. Dec | 2018-12-25 |
Semiconductor device and method of manufacture
Grant 10,163,866 - Chen , et al. Dec | 2018-12-25 |
Semiconductor packages and methods of forming the same
Grant 10,157,892 - Chen , et al. Dec | 2018-12-18 |
Interconnect structure and method
Grant 10,157,867 - Chen , et al. Dec | 2018-12-18 |
Wafer Level Dicing Method and Semiconductor Device
App 20180315656 - Chen; Ying-Ju ; et al. | 2018-11-01 |
Semiconductor Structure
App 20180315704 - Chen; Ying-Ju ; et al. | 2018-11-01 |
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
App 20180286847 - Chen; Jie ; et al. | 2018-10-04 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20180277520 - Yu; Chen-Hua ; et al. | 2018-09-27 |
Method of forming a semiconductor component comprising a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer
Grant 10,074,584 - Chen , et al. September 11, 2 | 2018-09-11 |
Semiconductor structure and manufacturing method thereof
Grant 10,074,618 - Chen , et al. September 11, 2 | 2018-09-11 |
Contact pad for semiconductor devices
Grant 10,037,953 - Chen , et al. July 31, 2 | 2018-07-31 |
Semiconductor structure
Grant 10,032,712 - Chen , et al. July 24, 2 | 2018-07-24 |
Wafer level dicing method
Grant 10,008,413 - Chen , et al. June 26, 2 | 2018-06-26 |
Method of forming a semiconductor device including strain reduced structure
Grant 9,997,480 - Chen , et al. June 12, 2 | 2018-06-12 |
Redistribution Layer Structures For Integrated Circuit Package
App 20180158777 - CHEN; Jie ; et al. | 2018-06-07 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 9,991,247 - Chen , et al. June 5, 2 | 2018-06-05 |
Alignment Pattern for Package Singulation
App 20180151507 - Chen; Ying-Ju ; et al. | 2018-05-31 |
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 9,984,998 - Yu , et al. May 29, 2 | 2018-05-29 |
Semiconductor devices with ball strength improvement
Grant 9,978,704 - Yu , et al. May 22, 2 | 2018-05-22 |
Ring Structures in Device Die
App 20180122751 - Chen; Ying-Ju ; et al. | 2018-05-03 |
Liquid Level Control System And Method
App 20180099305 - HUANG; Jung-Lung ; et al. | 2018-04-12 |
Underfill Control Structures and Method
App 20180102299 - Chen; Ying-Ju ; et al. | 2018-04-12 |
Semiconductor Device
App 20180082970 - CHEN; JIE ; et al. | 2018-03-22 |
Structure and method of forming a pad structure having enhanced reliability
Grant 9,911,707 - Chen , et al. March 6, 2 | 2018-03-06 |
Method Of Forming A Semiconductor Device Including Strain Reduced Structure
App 20180047686 - CHEN; Hsien-Wei ; et al. | 2018-02-15 |
Semiconductor Device and Method of Manufacture
App 20180019230 - Chen; Hsien-Wei ; et al. | 2018-01-18 |
Underbump metallization structure
Grant 9,859,235 - Liu , et al. January 2, 2 | 2018-01-02 |
Ring structures in device die
Grant 9,852,998 - Chen , et al. December 26, 2 | 2017-12-26 |
Underfill control structures and method
Grant 9,842,788 - Chen , et al. December 12, 2 | 2017-12-12 |
Structure and Method of Forming a Joint Assembly
App 20170345786 - Chen; Ying-Ju ; et al. | 2017-11-30 |
Semiconductor device and manufacturing method thereof
Grant 9,831,205 - Chen , et al. November 28, 2 | 2017-11-28 |
Semiconductor package and forming method thereof
Grant 9,831,215 - Chen , et al. November 28, 2 | 2017-11-28 |
Wafer having pad structure
Grant 9,831,140 - Chen , et al. November 28, 2 | 2017-11-28 |
Package-on-package device with supplemental underfill and method for manufacturing the same
Grant 9,825,008 - Chen , et al. November 21, 2 | 2017-11-21 |
Package on-package method
Grant 9,812,430 - Chen , et al. November 7, 2 | 2017-11-07 |
Package-on-package Device With Supplemental Underfill And Method For Manufacturing The Same
App 20170317057 - CHEN; Ying-Ju ; et al. | 2017-11-02 |
Strain reduced structure for IC packaging
Grant 9,806,042 - Chen , et al. October 31, 2 | 2017-10-31 |
Light emitting diode bracket
Grant 9,806,235 - Wu , et al. October 31, 2 | 2017-10-31 |
Semiconductor device and method of manufacture
Grant 9,793,245 - Chen , et al. October 17, 2 | 2017-10-17 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,786,591 - Tsai , et al. October 10, 2 | 2017-10-10 |
Semiconductor device and manufacturing method thereof
Grant 9,773,745 - Chen , et al. September 26, 2 | 2017-09-26 |
Mechanisms for Forming Post-Passivation Interconnect Structure
App 20170200687 - Chen; Ying-Ju ; et al. | 2017-07-13 |
Underfill Control Structures and Method
App 20170194226 - Chen; Ying-Ju ; et al. | 2017-07-06 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20170194292 - Yu; Chen-Hua ; et al. | 2017-07-06 |
Method for enhancing collagen secretion and preventing cutaneous aging using chenopodium formosanum extract
Grant 9,687,438 - Su , et al. June 27, 2 | 2017-06-27 |
Contact Pad for Semiconductor Devices
App 20170179051 - Chen; Jie ; et al. | 2017-06-22 |
Semiconductor Device and Method of Manufacture
App 20170141080 - Chen; Hsien-Wei ; et al. | 2017-05-18 |
Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof
Grant 9,646,941 - Chen , et al. May 9, 2 | 2017-05-09 |
Mechanisms for forming post-passivation interconnect structure
Grant 9,620,469 - Chen , et al. April 11, 2 | 2017-04-11 |
Semiconductor device including an embedded surface mount device and method of forming the same
Grant 9,589,938 - Chen , et al. March 7, 2 | 2017-03-07 |
Contact pad for semiconductor devices
Grant 9,589,891 - Chen , et al. March 7, 2 | 2017-03-07 |
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
App 20170062401 - Chen; Jie ; et al. | 2017-03-02 |
Structure and method for package warpage control using dummy interconnects
Grant 9,570,418 - Chen , et al. February 14, 2 | 2017-02-14 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20170040256 - Tsai; Hao-Yi ; et al. | 2017-02-09 |
Package-on-Package Method
App 20170040298 - Chen; Hsien-Wei ; et al. | 2017-02-09 |
Post passivation interconnect structures and methods for forming the same
Grant 9,553,066 - Chen , et al. January 24, 2 | 2017-01-24 |
Inductor for post passivation interconnect and a method of forming
Grant 9,553,045 - Tsai , et al. January 24, 2 | 2017-01-24 |
Information displaying method, mobile phone, and storage device
Grant 9,549,054 - Tsui , et al. January 17, 2 | 2017-01-17 |
Bump pad structure
Grant 9,536,847 - Wei , et al. January 3, 2 | 2017-01-03 |
Semiconductor Devices With Ball Strength Improvement
App 20160372435 - Yu; Tsung-Yuan ; et al. | 2016-12-22 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 9,502,270 - Chen , et al. November 22, 2 | 2016-11-22 |
Semiconductor structure and manufacturing method thereof
Grant 9,490,192 - Chen , et al. November 8, 2 | 2016-11-08 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,490,203 - Tsai , et al. November 8, 2 | 2016-11-08 |
Light Emitting Diode Bracket
App 20160312990 - WU; CHING-HUEI ; et al. | 2016-10-27 |
Package-on-package Structure
Grant 9,478,521 - Chen , et al. October 25, 2 | 2016-10-25 |
Semiconductor package including an embedded surface mount device and method of forming the same
Grant 9,461,020 - Yeh , et al. October 4, 2 | 2016-10-04 |
Semiconductor devices with ball strength improvement
Grant 9,437,567 - Yu , et al. September 6, 2 | 2016-09-06 |
Method For Treating Chikungunya Virus Infection
App 20160250166 - KUO; Szu-Cheng ; et al. | 2016-09-01 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20160247757 - Tsai; Hao-Yi ; et al. | 2016-08-25 |
Integrated circuit dies having alignment marks and methods of forming same
Grant 9,391,028 - Chen , et al. July 12, 2 | 2016-07-12 |
Method for treating Chikungunya virus infection
Grant 9,381,175 - Kuo , et al. July 5, 2 | 2016-07-05 |
Semiconductor devices and methods of manufacture thereof having guard ring structure
Grant 9,379,067 - Chen , et al. June 28, 2 | 2016-06-28 |
Contact test structure and method
Grant 9,368,417 - Chen , et al. June 14, 2 | 2016-06-14 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,355,954 - Tsai , et al. May 31, 2 | 2016-05-31 |
Semiconductor Device And Manufacturing Method Thereof
App 20160148886 - CHEN; Ying-Ju ; et al. | 2016-05-26 |
Methods and apparatus of packaging of semiconductor devices
Grant 9,349,665 - Chen , et al. May 24, 2 | 2016-05-24 |
Semiconductor Device Including An Embedded Surface Mount Device And Method Of Forming The Same
App 20160133606 - Chen; Hsien-Wei ; et al. | 2016-05-12 |
Semiconductor Devices And Methods Of Manufacture Thereof Having Guard Ring Structure
App 20160133583 - Chen; Hsien-Wei ; et al. | 2016-05-12 |
Recombinant baculovirus vector and uses thereof
Grant 9,328,147 - Wu , et al. May 3, 2 | 2016-05-03 |
Method and system for filtering incoming messages to a mobile device
Grant 9,313,629 - Chen , et al. April 12, 2 | 2016-04-12 |
Package-on-Package Structure and Method
App 20160093590 - Chen; Hsien-Wei ; et al. | 2016-03-31 |
Contact Pad for Semiconductor Devices
App 20160079158 - Chen; Hsien-Wei ; et al. | 2016-03-17 |
Semiconductor Package Including An Embedded Surface Mount Device And Method Of Forming The Same
App 20160079171 - Yeh; Der-Chyang ; et al. | 2016-03-17 |
Novel Recombinant Baculovirus Vector And Uses Thereof
App 20160068575 - WU; TZONG-YUAN ; et al. | 2016-03-10 |
Hybrid baculovirus and uses thereof
Grant 9,267,113 - Wu , et al. February 23, 2 | 2016-02-23 |
Method of forming bump structure
Grant 9,269,682 - Yu , et al. February 23, 2 | 2016-02-23 |
Semiconductor device and manufacturing method thereof
Grant 9,269,675 - Chen , et al. February 23, 2 | 2016-02-23 |
Pillar structure having cavities
Grant 9,263,354 - Chen , et al. February 16, 2 | 2016-02-16 |
Bump Pad Structure
App 20160035684 - Wei; Hsiu-Ping ; et al. | 2016-02-04 |
Semiconductor devices having guard ring structure and methods of manufacture thereof
Grant 9,245,842 - Chen , et al. January 26, 2 | 2016-01-26 |
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
App 20160013124 - Chen; Jie ; et al. | 2016-01-14 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20150380351 - Tsai; Hao-Yi ; et al. | 2015-12-31 |
Contact Test Structure and Method
App 20150380329 - Chen; Jie ; et al. | 2015-12-31 |
Semiconductor device including an embedded surface mount device and method of forming the same
Grant 9,224,709 - Chen , et al. December 29, 2 | 2015-12-29 |
Structure And Method For Package Warpage Control
App 20150357302 - Chen; Ying-Ju ; et al. | 2015-12-10 |
Note management methods and systems
Grant 9,208,222 - Folchi , et al. December 8, 2 | 2015-12-08 |
Ring Structures In Device Die
App 20150348916 - Chen; Ying-Ju ; et al. | 2015-12-03 |
Method Of Forming A Semiconductor Component Comprising A Second Passivation Layer Having A First Opening Exposing A Bond Pad And A Plurality Of Second Openings Exposing A Top Surface Of An Underlying First Passivation Layer
App 20150348922 - Chen; Ying-Ju ; et al. | 2015-12-03 |
Method For Treating Chikungunya Virus Infection
App 20150342911 - Kuo; Szu-Cheng ; et al. | 2015-12-03 |
Semiconductor package including an embedded surface mount device and method of forming the same
Grant 9,196,586 - Chen , et al. November 24, 2 | 2015-11-24 |
Contact pad for semiconductor devices
Grant 9,196,529 - Chen , et al. November 24, 2 | 2015-11-24 |
Wafer Having Pad Structure
App 20150318225 - CHEN; Ying-Ju ; et al. | 2015-11-05 |
Bump pad structure
Grant 9,171,811 - Tsai , et al. October 27, 2 | 2015-10-27 |
Hybrid baculovirus having the capability of infecting at least three insect hosts and uses thereof
Grant 9,157,072 - Wu , et al. October 13, 2 | 2015-10-13 |
Method For Enhancing Collagen Secretion And Preventing Cutaneous Aging Using Chenopodium Formosanum Extract
App 20150265527 - Su; Hsiang-Ling ; et al. | 2015-09-24 |
Pillar Structure having Cavities
App 20150262895 - Chen; Ying-Ju ; et al. | 2015-09-17 |
Capacitor in post-passivation structures and methods of forming the same
Grant 9,136,318 - Tsai , et al. September 15, 2 | 2015-09-15 |
Hybrid Baculovirus Having The Capability Of Infecting At Least Three Insect Hosts And Uses Thereof
App 20150252333 - Wu; Tzong-Yuan ; et al. | 2015-09-10 |
Hybrid Baculovirus And Uses Thereof
App 20150252332 - Wu; Tzong-Yuan ; et al. | 2015-09-10 |
Contact test structure and method
Grant 9,129,816 - Chen , et al. September 8, 2 | 2015-09-08 |
Semiconductor Package Including An Embedded Surface Mount Device And Method Of Forming The Same
App 20150228580 - Chen; Hsien-Wei ; et al. | 2015-08-13 |
Semiconductor Device Including An Embedded Surface Mount Device And Method Of Forming The Same
App 20150228606 - Chen; Hsien-Wei ; et al. | 2015-08-13 |
Semiconductor component having a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer
Grant 9,105,588 - Chen , et al. August 11, 2 | 2015-08-11 |
Inductor for Post Passivation Interconnect and A Method of Forming
App 20150214148 - Tsai; Hao-Yi ; et al. | 2015-07-30 |
Pad structure having contact bars extending into substrate and wafer having the pad structure
Grant 9,093,411 - Chen , et al. July 28, 2 | 2015-07-28 |
Mechanisms For Forming Post-passivation Interconnect Structure
App 20150137352 - CHEN; Ying-Ju ; et al. | 2015-05-21 |
Semiconductor Device And Manufacturing Method Thereof
App 20150137349 - CHEN; JIE ; et al. | 2015-05-21 |
Semiconductor Device And Manufacturing Method Thereof
App 20150130049 - CHEN; YING-JU ; et al. | 2015-05-14 |
Post Passivation Interconnect Structures and Methods for Forming the Same
App 20150130057 - Chen; Hsien-Wei ; et al. | 2015-05-14 |
Semiconductor Device And Manufacturing Method Thereof
App 20150108641 - CHEN; YING-JU ; et al. | 2015-04-23 |
Method of making a semiconductor device having a post-passivation interconnect structure
Grant 9,006,891 - Liang , et al. April 14, 2 | 2015-04-14 |
Inductor for post passivation interconnect
Grant 9,000,876 - Tsai , et al. April 7, 2 | 2015-04-07 |
Contact Pad for Semiconductor Devices
App 20150091191 - Chen; Jie ; et al. | 2015-04-02 |
Bond pad structure to reduce bond pad corrosion
Grant 8,994,181 - Chen , et al. March 31, 2 | 2015-03-31 |
Portable electronic apparatus to bypass screen lock mode for electronic notebook and operation method thereof and computer readable media
Grant 8,982,077 - Chen , et al. March 17, 2 | 2015-03-17 |
Wafer Level Dicing Method
App 20150061079 - Chen; Ying-Ju ; et al. | 2015-03-05 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,963,328 - Yang , et al. February 24, 2 | 2015-02-24 |
Post passivation interconnect structures and methods for forming the same
Grant 8,952,530 - Chen , et al. February 10, 2 | 2015-02-10 |
Semiconductor Devices With Ball Strength Improvement
App 20150028481 - YU; Tsung-Yuan ; et al. | 2015-01-29 |
Bump Pad Structure
App 20150031200 - Tsai; Hao-Yi ; et al. | 2015-01-29 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20150017778 - Tsai; Hao-Yi ; et al. | 2015-01-15 |
UBM structures for wafer level chip scale packaging
Grant 8,916,465 - Yu , et al. December 23, 2 | 2014-12-23 |
Bump pad structure
Grant 8,907,478 - Tsai , et al. December 9, 2 | 2014-12-09 |
Capacitor in Post-Passivation structures and methods of forming the same
Grant 8,884,400 - Tsai , et al. November 11, 2 | 2014-11-11 |
Methods of and semiconductor devices with ball strength improvement
Grant 8,871,629 - Yu , et al. October 28, 2 | 2014-10-28 |
Semiconductor Structure
App 20140264922 - Chen; Ying-Ju ; et al. | 2014-09-18 |
Method Of Forming Bump Structure
App 20140242791 - Yu; Tsung-Yuan ; et al. | 2014-08-28 |
Structure And Method Of Forming A Pad Structure Having Enhanced Reliability
App 20140225253 - CHEN; Hsien-Wei ; et al. | 2014-08-14 |
Methods and Apparatus of Packaging of Semiconductor Devices
App 20140203438 - Chen; Hsien-Wei ; et al. | 2014-07-24 |
Capacitor in Post-Passivation Structures and Methods of Forming the Same
App 20140183693 - Tsai; Hao-Yi ; et al. | 2014-07-03 |
Menu Management Methods And Systems
App 20140181720 - CHEN; Ying-Ju ; et al. | 2014-06-26 |
UBM Structures for Wafer Level Chip Scale Packaging
App 20140170850 - Yu; Tsung-Yuan ; et al. | 2014-06-19 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20140145346 - Chen; Hsien-Wei ; et al. | 2014-05-29 |
Structure and method of forming a pad structure having enhanced reliability
Grant 8,723,325 - Chen , et al. May 13, 2 | 2014-05-13 |
Double solid metal pad with reduced area
Grant 8,722,529 - Chen , et al. May 13, 2 | 2014-05-13 |
UBM structures for wafer level chip scale packaging
Grant 8,692,378 - Yu , et al. April 8, 2 | 2014-04-08 |
Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure
App 20140087522 - Yang; Ching-Jung ; et al. | 2014-03-27 |
Post Passivation Interconnect Structures and Methods for Forming the Same
App 20140077356 - Chen; Hsien-Wei ; et al. | 2014-03-20 |
Method Of Making A Semiconductor Device Having A Post-passivation Interconnect Structure
App 20140045326 - LIANG; Shih-Wei ; et al. | 2014-02-13 |
Double Solid Metal Pad with Reduced Area
App 20140045327 - Chen; Hsien-Wei ; et al. | 2014-02-13 |
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device
Grant 8,618,827 - Shao , et al. December 31, 2 | 2013-12-31 |
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device
Grant 08618827 - | 2013-12-31 |
Reducing delamination between an underfill and a buffer layer in a bond structure
Grant 8,610,267 - Yang , et al. December 17, 2 | 2013-12-17 |
Double solid metal pad with reduced area
Grant 8,581,423 - Chen , et al. November 12, 2 | 2013-11-12 |
Post-passivation interconnect structure
Grant 8,581,400 - Liang , et al. November 12, 2 | 2013-11-12 |
Strain Reduced Structure For Ic Packaging
App 20130270698 - CHEN; Hsien-Wei ; et al. | 2013-10-17 |
Contact Test Structure and Method
App 20130240883 - Chen; Jie ; et al. | 2013-09-19 |
Inductor for Post Passivation Interconnect
App 20130241683 - Tsai; Hao-Yi ; et al. | 2013-09-19 |
Differential voltage sensing system and method for using the same
Grant 8,519,792 - Chang , et al. August 27, 2 | 2013-08-27 |
Method And Electronic Apparatus For Associating Note And Calendar Event
App 20130212492 - Chen; Ying-Ju ; et al. | 2013-08-15 |
Bump Pad Structure
App 20130181347 - Tsai; Hao-Yi ; et al. | 2013-07-18 |
Method And System For Filtering Incoming Messages To A Mobile Device
App 20130150099 - Chen; Ying-Ju ; et al. | 2013-06-13 |
UBM Structures for Wafer Level Chip Scale Packaging
App 20130140706 - Yu; Tsung-Yuan ; et al. | 2013-06-06 |
Semiconductor test pad structures
Grant 8,450,126 - Chen , et al. May 28, 2 | 2013-05-28 |
Differential voltage sensing method
Grant 8,442,628 - Chang , et al. May 14, 2 | 2013-05-14 |
Methods Of And Semiconductor Devices With Ball Strength Improvement
App 20130113097 - YU; Tsung-Yuan ; et al. | 2013-05-09 |
Post-passivation Interconnect Structure
App 20130093077 - LIANG; Shih-Wei ; et al. | 2013-04-18 |
Bump pad structure
Grant 8,405,211 - Tsai , et al. March 26, 2 | 2013-03-26 |
Electronic Device, Controlling Method Thereof And Computer Program Product
App 20130069893 - Brinda; David ; et al. | 2013-03-21 |
Portable Electronic Apparatus And Operation Method Thereof And Computer Readable Media
App 20130069896 - Chen; Ying-Ju ; et al. | 2013-03-21 |
Bond Pad Structure To Reduce Bond Pad Corrosion
App 20130043598 - CHEN; Ying-Ju ; et al. | 2013-02-21 |
Method and system for filtering incoming messages to a mobile device
Grant 8,315,607 - Chen , et al. November 20, 2 | 2012-11-20 |
Structure for improving die saw quality
Grant 8,278,737 - Chen , et al. October 2, 2 | 2012-10-02 |
Information Displaying Method, Mobile Phone, And Storage Device
App 20120220343 - TSUI; Yuan-Mao ; et al. | 2012-08-30 |
Systems And Methods For Screen Data Management
App 20120206374 - CHEN; Ying-Ju ; et al. | 2012-08-16 |
Probe pad on a corner stress relief region in a semiconductor chip
Grant 8,237,160 - Chen , et al. August 7, 2 | 2012-08-07 |
Differential Voltage Sensing Method
App 20120194268 - CHANG; Wen Ying ; et al. | 2012-08-02 |
Package structure and method for reducing dielectric layer delamination
Grant 8,227,916 - Wei , et al. July 24, 2 | 2012-07-24 |
Note Management Methods And Systems
App 20120137255 - FOLCHI; David ; et al. | 2012-05-31 |
Conductive Feature For Semiconductor Substrate And Method Of Manufacture
App 20120098121 - CHEN; Ying-Ju ; et al. | 2012-04-26 |
Measurement Of Electrical And Mechanical Characteristics Of Low-k Dielectric In A Semiconductor Device
App 20120092033 - Shao; Tung-Liang ; et al. | 2012-04-19 |
Pad Structure Having Contact Bars Extending Into Substrate And Wafer Having The Pad Structure
App 20120091455 - CHEN; Ying-Ju ; et al. | 2012-04-19 |
Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure
App 20120018875 - Yang; Ching-Jung ; et al. | 2012-01-26 |
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip
App 20110284843 - Chen; Hsien-Wei ; et al. | 2011-11-24 |
Semiconductor Test Pad Structures
App 20110287627 - Chen; Hsien-Wei ; et al. | 2011-11-24 |
Semiconductor test pad structures
Grant 8,013,333 - Chen , et al. September 6, 2 | 2011-09-06 |
Differential Voltage Sensing System And Method For Using The Same
App 20110204971 - CHANG; Wen Ying ; et al. | 2011-08-25 |
Isolated or synthesized Rhopalosiphum padi virus polynucleotides having a promotor activity
App 20110207210 - Wu; Tzong-Yuan ; et al. | 2011-08-25 |
Slim display
Grant D641,020 - Shih , et al. July 5, 2 | 2011-07-05 |
Backend interconnect scheme with middle dielectric layer having improved strength
Grant 7,936,067 - Tsai , et al. May 3, 2 | 2011-05-03 |
Package Structure And Method For Reducing Dielectric Layer Delamination
App 20110018128 - WEI; Hsiu-Ping ; et al. | 2011-01-27 |
Structure And Method Of Forming A Pad Structure Having Enhanced Reliability
App 20100283149 - CHEN; Hsien-Wei ; et al. | 2010-11-11 |
Bump Pad Structure
App 20100283148 - Tsai; Hao-Yi ; et al. | 2010-11-11 |
Method And System For Filtering Incoming Messages To A Mobile Device
App 20100255817 - Chen; Ying-Ju ; et al. | 2010-10-07 |
Structure For Improving Die Saw Quality
App 20100252916 - Chen; Hsien-Wei ; et al. | 2010-10-07 |
Isolated Polynucleotide Sequence with IRES Activity
App 20100223683 - Wu; Tzong-Yuan ; et al. | 2010-09-02 |
Methods and systems for identifying polynucleotide sequences with translational self-cleavage activity
App 20100209910 - Wu; Tzong-Yuan ; et al. | 2010-08-19 |
Underbump Metallization Structure
App 20100187687 - Liu; Yu-Wen ; et al. | 2010-07-29 |
Double Solid Metal Pad with Reduced Area
App 20100123246 - Chen; Hsien-Wei ; et al. | 2010-05-20 |
Semiconductor Test Pad Structures
App 20100117080 - Chen; Hsien-Wei ; et al. | 2010-05-13 |
Backend Interconnect Scheme with Middle Dielectric Layer Having Improved Strength
App 20090283911 - Tsai; Hao-Yi ; et al. | 2009-11-19 |
Image Processing Method, Electronic Device Thereof, And Recording Medium Thereof
App 20090273699 - Lin; Yu-Chao ; et al. | 2009-11-05 |
Use of biocistronic DNA constructs for identifying compounds that inhibit IRES-dependent translation
Grant 7,588,885 - Wu , et al. September 15, 2 | 2009-09-15 |
Display Hook Assembly With Flexible Hook
App 20090184219 - Chen; Ying-Ju | 2009-07-23 |
Card with Decoration Attaching Arrangement
App 20090178310 - Chen; Ying-Ju | 2009-07-16 |
Method For Operating Software Input Panel
App 20090167705 - Chen; Ying-Ju | 2009-07-02 |
Use of Biocistronic DNA Constructs for Identifying Compounds that Inhibit IRES-Dependent Translation
App 20080241922 - Wu; Tzong-Yuan ; et al. | 2008-10-02 |
Use of Biocistronic DNA Constructs for Identifying Compounds that Inhibit IRES-Dependent Translation
App 20080242734 - Wu; Tzong-Yuan ; et al. | 2008-10-02 |
Use of biscistronic DNA constructs for identifying compounds that inhibit IRES-dependent translation
Grant 7,262,051 - Wu , et al. August 28, 2 | 2007-08-28 |
Isolated polynucleotide sequence with IRES activity
App 20070065924 - Wu; Tzong-Yuan ; et al. | 2007-03-22 |
Use of biscistronic DNA constructs for identifying compounds that inhibit IRES-dependent translation
App 20060024680 - Wu; Tzong-Yuan ; et al. | 2006-02-02 |
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