Chen; Ying-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Ying-Hao.The latest application filed is for "apparatus and methods for sensing long wavelength light".
Company Profile
8.18.26
- Chen; Ying-Hao - Tainan City TW
- Chen; Ying-Hao - Tainan TW
- CHEN; Ying-Hao - Taichung City TW
- CHEN; Ying-Hao - Hsinchu TW
Patent Activity
| Patent | Date |
|---|---|
| Apparatus And Methods For Sensing Long Wavelength Light App 20220310677 - Cheng; Yun-Wei ; et al. | 2022-09-29 |
| Apparatus and methods for sensing long wavelength light Grant 11,367,745 - Cheng , et al. June 21, 2 | 2022-06-21 |
| Method For Manufacturing Semiconductor Device App 20220172986 - HO; Chang-Ju ; et al. | 2022-06-02 |
| Apparatus And Methods For Sensing Long Wavelength Light App 20220059581 - CHENG; Yun-Wei ; et al. | 2022-02-24 |
| Image Sensor Having Stress Releasing Structure And Method Of Forming Same App 20210384247 - CHENG; Yun-Wei ; et al. | 2021-12-09 |
| Image sensor and method of forming the same Grant 11,171,172 - Cheng , et al. November 9, 2 | 2021-11-09 |
| Metal-insulator-metal capacitors with high breakdown voltage Grant 11,171,199 - Chen , et al. November 9, 2 | 2021-11-09 |
| Bonding Pad on a Back Side Illuminated Image Sensor App 20210273009 - Chien; Volume ; et al. | 2021-09-02 |
| Image Sensors With Stress Adjusting Layers App 20210265399 - HSIEH; Feng-Chien ; et al. | 2021-08-26 |
| Image Sensor Having Stress Releasing Structure And Method Of Forming Same App 20210225920 - CHENG; Yun-Wei ; et al. | 2021-07-22 |
| Image Sensor Device And Fabrication Method Thereof App 20210225916 - HSIEH; Feng-Chien ; et al. | 2021-07-22 |
| Bonding pad on a back side illuminated image sensor Grant 11,011,566 - Chien , et al. May 18, 2 | 2021-05-18 |
| Image sensor having stress releasing structure and method of forming same Grant 10,985,199 - Cheng , et al. April 20, 2 | 2021-04-20 |
| Heat Dissipation Structures App 20210082784 - CHENG; Yun-Wei ; et al. | 2021-03-18 |
| Metal-insulator-metal Capacitors With High Breakdown Voltage App 20210057517 - CHEN; Wei-Ting ; et al. | 2021-02-25 |
| Image Sensor And Method Of Forming The Same App 20210020671 - CHENG; Yun-Wei ; et al. | 2021-01-21 |
| Glass Separation Systems And Glass Manufacturing Apparatuses Comprising The Same App 20200407261 - Chang; Tai Hsin ; et al. | 2020-12-31 |
| Heat dissipation structures Grant 10,854,530 - Cheng , et al. December 1, 2 | 2020-12-01 |
| Method Of Forming Semiconductor Device With Gate App 20200295188 - JENG; Jung-Chi ; et al. | 2020-09-17 |
| Method of forming semiconductor device with gate Grant 10,680,103 - Jeng , et al. | 2020-06-09 |
| Image Sensor Having Stress Releasing Structure And Method Of Forming Same App 20200135789 - CHENG; Yun-Wei ; et al. | 2020-04-30 |
| Fabrication of semiconductor device Grant 10,516,048 - Chen , et al. Dec | 2019-12-24 |
| Semiconductor device and manufacturing method thereof Grant 10,090,392 - Chen , et al. October 2, 2 | 2018-10-02 |
| Fabrication Of Semiconductor Device App 20180061987 - CHEN; I-Chih ; et al. | 2018-03-01 |
| Semiconductor device and manufacturing method thereof Grant 9,865,731 - Chen , et al. January 9, 2 | 2018-01-09 |
| Method Of Forming Semiconductor Device With Gate App 20170338342 - JENG; Jung-Chi ; et al. | 2017-11-23 |
| Semiconductor device and fabricating method thereof Grant 9,812,569 - Chen , et al. November 7, 2 | 2017-11-07 |
| Pad structure layout for semiconductor device Grant 9,768,221 - Wu , et al. September 19, 2 | 2017-09-19 |
| Mechanism for forming semiconductor device with gate Grant 9,728,637 - Jeng , et al. August 8, 2 | 2017-08-08 |
| Semiconductor wafer and semiconductor die Grant 9,728,511 - Wu , et al. August 8, 2 | 2017-08-08 |
| Metal pad offset for multi-layer metal layout Grant 9,659,859 - Chen , et al. May 23, 2 | 2017-05-23 |
| Bonding Pad on a Back Side Illuminated Image Sensor App 20160148967 - Chien; Volume ; et al. | 2016-05-26 |
| Mechanism for forming gate Grant 9,281,215 - Jeng , et al. March 8, 2 | 2016-03-08 |
| Bonding pad on a back side illuminated image sensor Grant 9,252,180 - Chien , et al. February 2, 2 | 2016-02-02 |
| Metal Pad Offset For Multi-layer Metal Layout App 20150333007 - Chen; I-Chih ; et al. | 2015-11-19 |
| Metal pad offset for multi-layer metal layout Grant 9,093,430 - Chen , et al. July 28, 2 | 2015-07-28 |
| Semiconductor Device And Manufacturing Method Thereof App 20150206945 - CHEN; I-CHIH ; et al. | 2015-07-23 |
| Semiconductor Device And Fabricating Method Thereof App 20150200299 - CHEN; I-Chih ; et al. | 2015-07-16 |
| Semiconductor Wafer And Semiconductor Die App 20150170985 - Wu; Hsi-Jung ; et al. | 2015-06-18 |
| Semiconductor Device And Manufacturing Method Thereof App 20150137247 - CHEN; I-CHIH ; et al. | 2015-05-21 |
| Mechanism For Forming Semiconductor Device With Gate App 20150129987 - JENG; Jung-Chi ; et al. | 2015-05-14 |
| Mechanism For Forming Gate App 20150129940 - JENG; Jung-Chi ; et al. | 2015-05-14 |
| Metal Pad Offset For Multi-layer Metal Layout App 20150048518 - Chen; I-Chih ; et al. | 2015-02-19 |
| Pad Structure Layout For Semiconductor Device App 20150001658 - Wu; Shang-Yen ; et al. | 2015-01-01 |
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