CHEN; YEN-HSIN
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEN; YEN-HSIN.The latest application filed is for "optical component packaging structure".
- CHEN; YEN-HSIN - HSIN-CHU TW
- Chen; Yen-Hsin - Hsin-Chu City TW
| Patent | Date |
|---|---|
| Optical Component Packaging Structure App 20210091238 - CHANG; YI-CHANG ; et al. | 2021-03-25 |
| Optical component packaging structure Grant 10,896,983 - Chang , et al. January 19, 2 | 2021-01-19 |
| Optical Component Packaging Structure App 20190363199 - CHANG; YI-CHANG ; et al. | 2019-11-28 |
| Optical component packaging structure Grant 10,439,077 - Chang , et al. O | 2019-10-08 |
| Optical Component Packaging Structure App 20180269337 - CHANG; YI-CHANG ; et al. | 2018-09-20 |
| Optical component packaging structure Grant 10,002,975 - Chang , et al. June 19, 2 | 2018-06-19 |
| Optical sensing module with multi-directional optical sensing function Grant 9,976,898 - Shen , et al. May 22, 2 | 2018-05-22 |
| Optical Component Packaging Structure App 20180122960 - CHANG; YI-CHANG ; et al. | 2018-05-03 |
| Sensor chip package structure and manufacturing method thereof Grant 9,741,875 - Shen , et al. August 22, 2 | 2017-08-22 |
| Optical Sensing Module With Multi-directional Optical Sensing Function App 20170167914 - Shen; Chi-Chih ; et al. | 2017-06-15 |
| Sensor Chip Package Structure And Manufacturing Method Thereof App 20170062628 - SHEN; CHI-CHIH ; et al. | 2017-03-02 |
| Chip package with improved heat dissipation and manufacturing method thereof Grant 9,142,529 - Chang , et al. September 22, 2 | 2015-09-22 |
| Chip Package And Manufacturing Method Thereof App 20140210069 - Chang; Yi-Chang ; et al. | 2014-07-31 |
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