Patent | Date |
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Semiconductor package Grant 11,450,626 - Chen , et al. September 20, 2 | 2022-09-20 |
Inductive Device App 20220231116 - CHOU; Wei-Yu ;   et al. | 2022-07-21 |
Dual Micro-electro Mechanical System And Manufacturing Method Thereof App 20220194783 - CHEN; Yang-Che ;   et al. | 2022-06-23 |
Inductive device Grant 11,322,576 - Chou , et al. May 3, 2 | 2022-05-03 |
Dual micro-electro mechanical system and manufacturing method thereof Grant 11,274,037 - Chen , et al. March 15, 2 | 2022-03-15 |
Semiconductor Package App 20220068845 - Chen; Yang-Che ;   et al. | 2022-03-03 |
Inductive Device App 20220037458 - CHOU; Wei-Yu ;   et al. | 2022-02-03 |
Method For Detecting Defects In Semiconductor Device App 20210366794 - CHEN; YANG-CHE ;   et al. | 2021-11-25 |
Semiconductor device having probe pads and seal ring Grant 11,088,037 - Chen , et al. August 10, 2 | 2021-08-10 |
Semiconductor Package And Method For Making The Same App 20210202329 - CHEN; Yang-Che ;   et al. | 2021-07-01 |
Dual Micro-electro Mechanical System And Manufacturing Method Thereof App 20210130167 - CHEN; Yang-Che ;   et al. | 2021-05-06 |
Semiconductor package and method for manufacturing the same Grant 10,937,772 - Chen , et al. March 2, 2 | 2021-03-02 |
Method for manufacturing semiconductor and structure thereof Grant 10,937,858 - Chen , et al. March 2, 2 | 2021-03-02 |
Semiconductor Package Structure And Method For Manufacturing The Same App 20200402892 - CHEN; YANG-CHE ;   et al. | 2020-12-24 |
Semiconductor packages having dummy connectors and methods of forming same Grant 10,867,976 - Chen , et al. December 15, 2 | 2020-12-15 |
Semiconductor Package And Method For Manufacturing The Same App 20200381409 - CHEN; YANG-CHE ;   et al. | 2020-12-03 |
Method For Manufacturing Semiconductor And Structure Thereof App 20200251552 - Kind Code | 2020-08-06 |
Method of detecting delamination in an integrated circuit package structure Grant 10,699,977 - Chen , et al. | 2020-06-30 |
Semiconductor Device With Enhanced Thermal Dissipation And Method For Making The Same App 20200135613 - CHEN; Yang-Che ;   et al. | 2020-04-30 |
Method for manufacturing semiconductor and structure thereof Grant 10,629,673 - Chen , et al. | 2020-04-21 |
Semiconductor Packages Having Dummy Connectors and Methods of Forming Same App 20200118984 - Chen; Chen-Shien ;   et al. | 2020-04-16 |
Method For Manufacturing Semiconductor And Structure Thereof App 20200098851 - CHEN; YANG-CHE ;   et al. | 2020-03-26 |
Semiconductor Device And Manufacturing Method Of The Same App 20200075435 - CHEN; YANG-CHE ;   et al. | 2020-03-05 |
Semiconductor packages having dummy connectors and methods of forming same Grant 10,510,734 - Chen , et al. Dec | 2019-12-17 |
Method Of Detecting Delamination In An Integrated Circuit Package Structure App 20190333829 - CHEN; Yang-Che ;   et al. | 2019-10-31 |
Integrated circuit package structure and testing method using the same Grant 10,347,548 - Chen , et al. July 9, 2 | 2019-07-09 |
Semiconductor packages having dummy connectors and methods of forming same Grant 10,276,548 - Chen , et al. | 2019-04-30 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same App 20190115326 - Chen; Chen-Shien ;   et al. | 2019-04-18 |
Integrated Circuit Package Structure And Testing Method Using The Same App 20180156865 - Chen; Yang-Che ;   et al. | 2018-06-07 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same App 20180076184 - Chen; Chen-Shien ;   et al. | 2018-03-15 |
Mechanisms for forming micro-electro mechanical device Grant 9,254,999 - Chou , et al. February 9, 2 | 2016-02-09 |
Mechanisms For Forming Micro-electro Mechanical Device App 20150137303 - CHOU; Bruce C.S. ;   et al. | 2015-05-21 |