CHEN; William Tze-You
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEN; William Tze-You.The latest application filed is for "overmolded optical package".
- CHEN; William Tze-You - Endicott NY
- Chen; William Tze-You - Singapore SG
| Patent | Date |
|---|---|
| Overmolded Optical Package App 20070166866 - APPELT; Bernd Karl ; et al. | 2007-07-19 |
| Overmolded optical package Grant 7,199,438 - Appelt , et al. April 3, 2 | 2007-04-03 |
| Bump and fabricating process thereof App 20050200014 - Chen, William Tze-You ; et al. | 2005-09-15 |
| Under-bump-metallurgy layer for improving adhesion Grant 6,891,274 - Chen , et al. May 10, 2 | 2005-05-10 |
| Overmolded optical package App 20050073036 - Appelt, Bernd Karl ; et al. | 2005-04-07 |
| Bump and fabricating process thereof Grant 6,864,168 - Chen , et al. March 8, 2 | 2005-03-08 |
| Vibratory in-plane tunneling gyroscope Grant 6,838,806 - Chua , et al. January 4, 2 | 2005-01-04 |
| Under-ball-metallurgy layer Grant 6,819,002 - Chen , et al. November 16, 2 | 2004-11-16 |
| Under-bump-metallurgy Layer For Improving Adhesion App 20040113273 - Chen, William Tze-You ; et al. | 2004-06-17 |
| [bump And Fabricating Process Thereof] App 20040113272 - CHEN, WILLIAM TZE-YOU ; et al. | 2004-06-17 |
| [under-ball-metallurgy Layer] App 20040104484 - Chen, William Tze-You ; et al. | 2004-06-03 |
| [solder Bump] App 20040065949 - Chen, William Tze-You ; et al. | 2004-04-08 |
| Miniaturized chip scale ball grid array semiconductor package Grant 6,429,530 - Chen August 6, 2 | 2002-08-06 |
| Testing laminates with x-ray moire interferometry Grant 6,013,355 - Chen , et al. January 11, 2 | 2000-01-11 |
| Method of forming a solderless electrical connection with a wirebond chip Grant 5,709,336 - Ingraham , et al. January 20, 1 | 1998-01-20 |
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