Chen; William T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; William T..The latest application filed is for "semiconductor device packages and stacked package assemblies including high density interconnections".

Company Profile

10.18.13

Chen; William T. - Kaohsiung TW
Chen; William T - Endicott NY
CHEN; William T. - Endicott NY
Chen; William T. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,916,429 - Hunt , et al. February 9, 2	2021-02-09
Stacked semiconductor package assemblies including double sided redistribution layers Grant 10,886,263 - Chen , et al. January 5, 2	2021-01-05
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20200111671 - HUNT; John Richard ; et al.	2020-04-09
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,535,521 - Hunt , et al. Ja	2020-01-14
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,515,806 - Hunt , et al. Dec	2019-12-24
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20190206684 - HUNT; John Richard ; et al.	2019-07-04
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20190206683 - HUNT; John Richard ; et al.	2019-07-04
Semiconductor device packages and stacked package assemblies including high density interconnections Grant 10,276,382 - Hunt , et al.	2019-04-30
Stacked Semiconductor Package Assemblies Including Double Sided Redistribution Layers App 20190103386 - CHEN; William T. ; et al.	2019-04-04
Semiconductor Package And Method Of Manufacturing The Same App 20190088506 - APPELT; Bernd Karl ; et al.	2019-03-21
Semiconductor Device Packages And Stacked Package Assemblies Including High Density Interconnections App 20180047571 - HUNT; John Richard ; et al.	2018-02-15
Semiconductor Package And Method Of Manufacturing The Same App 20160218021 - APPELT; Bernd Karl ; et al.	2016-07-28
Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package Grant 8,399,776 - Appelt , et al. March 19, 2	2013-03-19
Substrate Having Single Patterned Metal Layer, And Package Applied With The Substrate , And Methods Of Manufacturing Of The Substrate And Package App 20100288541 - APPELT; Bernd Karl ; et al.	2010-11-18
Placement of sacrificial solder balls underneath the PBGA substrate Grant 7,227,268 - Chang , et al. June 5, 2	2007-06-05
Method and apparatus for forming a metallic feature on a substrate App 20060134338 - Chen; William T. ; et al.	2006-06-22
Method and apparatus for forming a metallic feature on a substrate Grant 7,026,012 - Chen , et al. April 11, 2	2006-04-11
Placement of sacrificial solder balls underneath the PBGA substrate App 20050063165 - Chang, Chi Shih ; et al.	2005-03-24
Method of forming selective electroless plating on polymer surfaces Grant 6,863,936 - Chen , et al. March 8, 2	2005-03-08
Placement of sacrificial solder balls underneath the PBGA substrate Grant 6,829,149 - Chang , et al. December 7, 2	2004-12-07
Method and apparatus for forming a metallic feature on a substrate App 20020119251 - Chen, William T. ; et al.	2002-08-29
Method of forming selective electroless plating on polymer surfaces App 20020076497 - Chen, William T. ; et al.	2002-06-20
Rolling ball connector Grant 6,358,627 - Benenati , et al. March 19, 2	2002-03-19
Underfill preform interposer for joining chip to substrate Grant 6,258,627 - Benenati , et al. July 10, 2	2001-07-10
Rolling ball connector App 20010002330 - Benenati, Joseph A. ; et al.	2001-05-31
Area array stud bump flip chip device and assembly process Grant 6,214,642 - Chen , et al. April 10, 2	2001-04-10
Rolling ball connector Grant 6,177,729 - Benenati , et al. January 23, 2	2001-01-23
Multilayered circuit board Grant 5,442,144 - Chen , et al. August 15, 1	1995-08-15
Method of making multilayered circuit board Grant 5,359,767 - Chen , et al. November 1, 1	1994-11-01
Flexible supporting cable for an electronic device and method of making same Grant 4,906,803 - Albrechta , et al. March 6, 1	1990-03-06

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