Chen; Wen-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Wen-Ming.The latest application filed is for "method for forming semiconductor die having edge with multiple gradients".
Company Profile
11.27.32
- Chen; Wen-Ming - Zhunan Township TW
- Chen; Wen-Ming - Taipei TW
- Chen; Wen-Ming - Miaoli County TW
- CHEN; Wen-Ming - Taipei City TW
- Chen; Wen-Ming - Chung-Li N/A TW
- Chen; Wen-Ming - Taichung N/A TW
- Chen; Wen-Ming - Shenzhen CN
- Chen; Wen-Ming - Taichung City TW
- CHEN; WEN-MING - Shenzhen City CN
- Chen; Wen-Ming - Miaoli TW
- Chen, Wen-Ming - Jhunan Township TW
- Chen, Wen-Ming - Maio-Li TW
- Chen, Wen-Ming - Mia-Lin Hsien TW
- Chen, Wen-Ming - Tsu-Nan TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor die singulation and structures formed thereby Grant 11,367,658 - Chang , et al. June 21, 2 | 2022-06-21 |
| Modem and communication method Grant 11,349,742 - Chen May 31, 2 | 2022-05-31 |
| Bump layout for coplanarity improvement Grant 11,211,318 - Li , et al. December 28, 2 | 2021-12-28 |
| Method For Forming Semiconductor Die Having Edge With Multiple Gradients App 20210233803 - TANG; Yu-Sheng ; et al. | 2021-07-29 |
| Semiconductor die having edge with multiple gradients and method for forming the same Grant 11,004,728 - Tang , et al. May 11, 2 | 2021-05-11 |
| Semiconductor packaged wafer and method for forming the same Grant 10,861,761 - Chang , et al. December 8, 2 | 2020-12-08 |
| Conductive External Connector Structure and Method of Forming App 20200373267 - Shih; Meng-Fu ; et al. | 2020-11-26 |
| Semiconductor Die Singulation and Structures Formed Thereby App 20200350209 - Chang; Fu-Chen ; et al. | 2020-11-05 |
| Conductive external connector structure and method of forming Grant 10,741,513 - Shih , et al. A | 2020-08-11 |
| Modem And Communication Method App 20200252352 - Kind Code | 2020-08-06 |
| Semiconductor die singulation and structures formed thereby Grant 10,720,360 - Chang , et al. | 2020-07-21 |
| Semiconductor Die Having Edge With Multiple Gradients And Method For Forming The Same App 20200152506 - TANG; Yu-Sheng ; et al. | 2020-05-14 |
| Bump Layout For Coplanarity Improvement App 20200105654 - Li; Ling-Wei ; et al. | 2020-04-02 |
| Semiconductor die having edge with multiple gradients and method for forming the same Grant 10,535,554 - Tang , et al. Ja | 2020-01-14 |
| Semiconductor die singulation and structures formed thereby Grant 10,510,605 - Chang , et al. Dec | 2019-12-17 |
| Bonding apparatus and method Grant 10,312,118 - Wu , et al. | 2019-06-04 |
| Conductive External Connector Structure and Method of Forming App 20190131263 - Shih; Meng-Fu ; et al. | 2019-05-02 |
| Semiconductor Packaged Wafer And Method For Forming The Same App 20190103389 - CHANG; FU-CHEN ; et al. | 2019-04-04 |
| Conductive external connector structure and method of forming Grant 10,163,836 - Shih , et al. Dec | 2018-12-25 |
| Semiconductor Die Singulation and Structures Formed Thereby App 20180330991 - Chang; Fu-Chen ; et al. | 2018-11-15 |
| Method for forming semiconductor device structure with bumps Grant 10,014,218 - Shih , et al. July 3, 2 | 2018-07-03 |
| Conductive External Connector Structure and Method of Forming App 20180166409 - Shih; Meng-Fu ; et al. | 2018-06-14 |
| Semiconductor Die Having Edge With Multiple Gradients And Method For Forming The Same App 20180166328 - TANG; Yu-Sheng ; et al. | 2018-06-14 |
| Semiconductor Die Singulation and Structures Formed Thereby App 20180033695 - Chang; Fu-Chen ; et al. | 2018-02-01 |
| Conductive external connector structure and method of forming Grant 9,875,979 - Shih , et al. January 23, 2 | 2018-01-23 |
| Wafer taping scheme Grant 9,748,130 - Chen , et al. August 29, 2 | 2017-08-29 |
| Conductive External Connector Structure and Method of Forming App 20170141059 - Shih; Meng-Fu ; et al. | 2017-05-18 |
| Bonding Apparatus And Method App 20150200118 - WU; Pei-Shan ; et al. | 2015-07-16 |
| Wafer Taping Scheme App 20150155195 - Chen; Wen-Ming ; et al. | 2015-06-04 |
| Method to produce PHBV by recombinant Escherichia coli Grant 8,859,246 - Chien , et al. October 14, 2 | 2014-10-14 |
| Pen barrel assembling device Grant 8,387,222 - Chen , et al. March 5, 2 | 2013-03-05 |
| Audio and video apparatus and method for controlling the same Grant 8,086,095 - Hung , et al. December 27, 2 | 2011-12-27 |
| Audio apparatus Grant 8,073,161 - Hung , et al. December 6, 2 | 2011-12-06 |
| Electronic device and power supply unit thereof Grant 8,072,784 - Hung , et al. December 6, 2 | 2011-12-06 |
| Pen Barrel Assembling Device App 20110094077 - Siddall; Steven Eugene ; et al. | 2011-04-28 |
| Power interface circuit and electronic device using the same Grant 7,916,440 - Hung , et al. March 29, 2 | 2011-03-29 |
| Power supply system and protection method Grant 7,804,195 - Hung , et al. September 28, 2 | 2010-09-28 |
| Audio amplifier Grant 7,663,433 - Hung , et al. February 16, 2 | 2010-02-16 |
| Video Server, Video Client Device And Video Processing Method Thereof App 20090257730 - CHEN; WEN-MING ; et al. | 2009-10-15 |
| System And Method For Password Entry App 20090235197 - CHEN; WEN-MING ; et al. | 2009-09-17 |
| Audio Apparatus App 20090167433 - HUNG; CHUN-LUNG ; et al. | 2009-07-02 |
| Laser Control Apparatus And Electronic Device Using The Same App 20090168822 - HUNG; CHUN-LUNG ; et al. | 2009-07-02 |
| Electronic Device And Power Supply Unit Thereof App 20090161394 - HUNG; CHUN-LUNG ; et al. | 2009-06-25 |
| Audio And Video Apparatus And Method For Controlling The Same App 20090154900 - HUNG; CHUN-LUNG ; et al. | 2009-06-18 |
| Power Interface Circuit And Electronic Device Using The Same App 20090147419 - HUNG; CHUN-LUNG ; et al. | 2009-06-11 |
| Electronic Device App 20090134934 - Hung; Chun-Lung ; et al. | 2009-05-28 |
| Power Supply System And Protection Method App 20090127935 - HUNG; CHUN-LUNG ; et al. | 2009-05-21 |
| Audio Amplifier App 20090115511 - HUNG; CHUN-LUNG ; et al. | 2009-05-07 |
| Composite shadow ring assembled with dowel pins and method of using Grant 7,396,432 - Li , et al. July 8, 2 | 2008-07-08 |
| Heating system for load-lock chamber App 20050284572 - Chen, Wen-Ming ; et al. | 2005-12-29 |
| Backfill prevention system for gas flow conduit Grant 6,822,575 - Chen , et al. November 23, 2 | 2004-11-23 |
| Microchip fabrication chamber wafer detection Grant 6,723,201 - Chen , et al. April 20, 2 | 2004-04-20 |
| Balance switch for controlling gas App 20040025940 - Chang, Tse-Lun ; et al. | 2004-02-12 |
| Backfill prevention system for gas flow conduit App 20040017297 - Chen, Wen-Ming ; et al. | 2004-01-29 |
| Composite shadow ring assembled with dowel pins and method of using App 20030226822 - Li, Chang-Jung ; et al. | 2003-12-11 |
| Stocker conveyor particle removing system App 20030173189 - Chen, Wen-Ming ; et al. | 2003-09-18 |
| Microchip fabrication chamber wafer detection App 20030155080 - Chen, Wen-Ming ; et al. | 2003-08-21 |
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