CHEN; Wanjun
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEN; Wanjun.The latest application filed is for "die bonding process for manufacturing semiconductor device and semiconductor device manufactured thereby".
- CHEN; Wanjun - Xiamen CN
- Chen; Wanjun - Chengdu CN
- Chen; Wanjun - Hong Kong CN
Trademarks
| Patent | Date |
|---|---|
| Die Bonding Process For Manufacturing Semiconductor Device And Semiconductor Device Manufactured Thereby App 20200211861 - WANG; Feng ; et al. | 2020-07-02 |
| GaN-based bidirectional switch device Grant 10,672,896 - Chen , et al. | 2020-06-02 |
| GaN-BASED BIDIRECTIONAL SWITCH DEVICE App 20180158936 - CHEN; Wanjun ; et al. | 2018-06-07 |
| Integrated HEMT and lateral field-effect rectifier combinations, methods, and systems Grant 8,076,699 - Chen , et al. December 13, 2 | 2011-12-13 |
| Integrated HEMT and Lateral Field-Effect Rectifier Combinations, Methods, and Systems App 20100019279 - CHEN; Jing ; et al. | 2010-01-28 |
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