Chen; U-Ting
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; U-Ting.The latest application filed is for "semiconductor devices and methods of manufacture thereof".
Company Profile
10.21.27
- Chen; U-Ting - Wanluan Township TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Devices And Methods Of Manufacture Thereof App 20220208749 - Tsai; Shu-Ting ; et al. | 2022-06-30 |
| BSI image sensor and method of forming same Grant 11,315,972 - Hsu , et al. April 26, 2 | 2022-04-26 |
| BSI Image Sensor and Method of Forming Same App 20210233945 - Hsu; Hung-Wen ; et al. | 2021-07-29 |
| BSI Image Sensor and Method of Forming Same App 20210066357 - Hsu; Hung-Wen ; et al. | 2021-03-04 |
| BSI image sensor and method of forming same Grant 10,847,560 - Hsu , et al. November 24, 2 | 2020-11-24 |
| Stacked image sensor having a barrier layer Grant 10,818,720 - Chen , et al. October 27, 2 | 2020-10-27 |
| 3DIC interconnect apparatus and method Grant 10,510,729 - Tsai , et al. Dec | 2019-12-17 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20190279974 - Tsai; Shu-Ting ; et al. | 2019-09-12 |
| Stacked Image Sensor Having A Barrier Layer App 20190259799 - Chen; U-Ting ; et al. | 2019-08-22 |
| BSI Image Sensor and Method of Forming Same App 20190252423 - Hsu; Hung-Wen ; et al. | 2019-08-15 |
| Method of manufacturing semiconductor devices having conductive plugs with varying widths Grant 10,304,818 - Tsai , et al. | 2019-05-28 |
| Stacked image sensor having a barrier layer Grant 10,283,547 - Chen , et al. | 2019-05-07 |
| BSI image sensor and method of forming same Grant 10,269,843 - Hsu , et al. | 2019-04-23 |
| 3DIC Interconnect Apparatus and Method App 20190115322 - Tsai; Shu-Ting ; et al. | 2019-04-18 |
| 3DIC Interconnect Apparatus and Method App 20180366447 - Tsai; Shu-Ting ; et al. | 2018-12-20 |
| 3DIC interconnect apparatus and method Grant 10,157,891 - Tsai , et al. Dec | 2018-12-18 |
| 3DIC interconnect apparatus and method Grant 10,056,353 - Tsai , et al. August 21, 2 | 2018-08-21 |
| BSI Image Sensor and Method of Forming Same App 20180197903 - Hsu; Hung-Wen ; et al. | 2018-07-12 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20180102351 - Tsai; Shu-Ting ; et al. | 2018-04-12 |
| BSI image sensor and method of forming same Grant 9,917,121 - Hsu , et al. March 13, 2 | 2018-03-13 |
| 3DIC Interconnect Apparatus and Method App 20180012870 - Tsai; Shu-Ting ; et al. | 2018-01-11 |
| BSI Image Sensor and Method of Forming Same App 20170278881 - Hsu; Hung-Wen ; et al. | 2017-09-28 |
| 3DIC interconnect apparatus and method Grant 9,754,925 - Tsai , et al. September 5, 2 | 2017-09-05 |
| Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods Grant 9,748,304 - Chen , et al. August 29, 2 | 2017-08-29 |
| Stacked Image Sensor Having a Barrier Layer App 20170110497 - Chen; U-Ting ; et al. | 2017-04-20 |
| Interconnect structure for connecting dies and methods of forming the same Grant 9,553,020 - Tsai , et al. January 24, 2 | 2017-01-24 |
| Stacked image sensor having a barrier layer Grant 9,536,920 - Chen , et al. January 3, 2 | 2017-01-03 |
| 3DIC Interconnect Apparatus and Method App 20160351546 - Tsai; Shu-Ting ; et al. | 2016-12-01 |
| Interconnect Structure For Connecting Dies And Methods Of Forming The Same App 20160336231 - Tsai; Shu-Ting ; et al. | 2016-11-17 |
| Interconnect structure for connecting dies and methods of forming the same Grant 9,406,712 - Tsai , et al. August 2, 2 | 2016-08-02 |
| Interconnect Structure for Connecting Dies and Methods of Forming the Same App 20150287757 - Tsai; Shu-Ting ; et al. | 2015-10-08 |
| Stacked Image Sensor Having a Barrier Layer App 20150279891 - Chen; U-Ting ; et al. | 2015-10-01 |
| Interconnect structure for connecting dies and methods of forming the same Grant 9,076,715 - Tsai , et al. July 7, 2 | 2015-07-07 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20150187701 - Tsai; Shu-Ting ; et al. | 2015-07-02 |
| 3DIC Interconnect Apparatus and Method App 20150179613 - Tsai; Shu-Ting ; et al. | 2015-06-25 |
| 3DIC Interconnect Apparatus and Method App 20150179612 - Tsai; Shu-Ting ; et al. | 2015-06-25 |
| Image Sensor Devices, Methods of Manufacture Thereof, and Semiconductor Device Manufacturing Methods App 20150171132 - Chen; U-Ting ; et al. | 2015-06-18 |
| Interconnect structure and method Grant 9,041,206 - Tsai , et al. May 26, 2 | 2015-05-26 |
| Image device and methods of forming the same Grant 9,040,891 - Chen , et al. May 26, 2 | 2015-05-26 |
| Scribe lines in wafers Grant 8,952,497 - Chen , et al. February 10, 2 | 2015-02-10 |
| Interconnect Structure and Method App 20140264862 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
| Interconnect Structure for Connecting Dies and Methods of Forming the Same App 20140264709 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
| Scribe Lines in Wafers App 20140077320 - Chen; U-Ting ; et al. | 2014-03-20 |
| Image Device And Methods Of Forming The Same App 20130327921 - CHEN; U-Ting ; et al. | 2013-12-12 |
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