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name:-0.018152952194214
name:-0.0095920562744141
name:-0.0077400207519531
Chen; Ting-Gang Patent Filings

Chen; Ting-Gang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Ting-Gang.The latest application filed is for "semiconductor device with isolation structure".

Company Profile
7.8.16
  • Chen; Ting-Gang - Taipei City TW
  • Chen; Ting-Gang - Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device With Isolation Structure
App 20220293596 - WANG; Chieh-Ping ;   et al.
2022-09-15
Dielectric Spacer to Prevent Contacting Shorting
App 20220285529 - Chen; Ting-Gang ;   et al.
2022-09-08
Multi-Layered Insulating Film Stack
App 20220278000 - Wang; Chieh-Ping ;   et al.
2022-09-01
Semiconductor device with isolation structure
Grant 11,348,917 - Wang , et al. May 31, 2
2022-05-31
Dielectric spacer to prevent contacting shorting
Grant 11,342,444 - Chen , et al. May 24, 2
2022-05-24
Multi-layered insulating film stack
Grant 11,335,603 - Wang , et al. May 17, 2
2022-05-17
Multilayer Masking Layer and Method of Forming Same
App 20220020865 - Chen; Wen-Ju ;   et al.
2022-01-20
Semiconductor Device And Method
App 20220013364 - Chang; Ya-Lan ;   et al.
2022-01-13
Multi-layered Insulating Film Stack
App 20210407807 - Wang; Chieh-Ping ;   et al.
2021-12-30
Semiconductor Device With Isolation Structure
App 20210343709 - WANG; Chieh-Ping ;   et al.
2021-11-04
Semiconductor Devices And Methods Of Manufacture
App 20210335657 - Lu; Bo-Cyuan ;   et al.
2021-10-28
Cut metal gate devices and processes
Grant 11,152,262 - Lee , et al. October 19, 2
2021-10-19
Cut Metal Gate Refill With Void
App 20210313181 - Chen; Ting-Gang ;   et al.
2021-10-07
Dielectric spacer to prevent contacting shorting
Grant 11,107,902 - Chen , et al. August 31, 2
2021-08-31
Cut Metal Gate Devices and Processes
App 20200176259 - Lee; Chun-Yi ;   et al.
2020-06-04
Systems And Methods For A Plasma Enhanced Deposition Of Material On A Semiconductor Substrate
App 20200123656 - LIN; Kun-Mo ;   et al.
2020-04-23
Dielectric Spacer to Prevent Contacting Shorting
App 20200013875 - Chen; Ting-Gang ;   et al.
2020-01-09
Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate
Grant 10,519,545 - Lin , et al. Dec
2019-12-31
Dielectric Spacer to Prevent Contacting Shorting
App 20190393324 - Chen; Ting-Gang ;   et al.
2019-12-26
FinFETs and methods of forming the same
Grant 10,510,867 - Hsieh , et al. Dec
2019-12-17
FinFETs and Methods of Forming the Same
App 20190140076 - Hsieh; Bor Chiuan ;   et al.
2019-05-09
FinFETs and methods of forming the same
Grant 10,157,997 - Hsieh , et al. Dec
2018-12-18
FinFETs and Methods of Forming the Same
App 20180315830 - Hsieh; Bor Chiuan ;   et al.
2018-11-01
Systems And Methods For A Plasma Enhanced Deposition Of Material On A Semiconductor Substrate
App 20170342561 - LIN; Kun-Mo ;   et al.
2017-11-30

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