loadpatents
Patent applications and USPTO patent grants for Chen; Ting-Gang.The latest application filed is for "semiconductor device with isolation structure".
Patent | Date |
---|---|
Semiconductor Device With Isolation Structure App 20220293596 - WANG; Chieh-Ping ;   et al. | 2022-09-15 |
Dielectric Spacer to Prevent Contacting Shorting App 20220285529 - Chen; Ting-Gang ;   et al. | 2022-09-08 |
Multi-Layered Insulating Film Stack App 20220278000 - Wang; Chieh-Ping ;   et al. | 2022-09-01 |
Semiconductor device with isolation structure Grant 11,348,917 - Wang , et al. May 31, 2 | 2022-05-31 |
Dielectric spacer to prevent contacting shorting Grant 11,342,444 - Chen , et al. May 24, 2 | 2022-05-24 |
Multi-layered insulating film stack Grant 11,335,603 - Wang , et al. May 17, 2 | 2022-05-17 |
Multilayer Masking Layer and Method of Forming Same App 20220020865 - Chen; Wen-Ju ;   et al. | 2022-01-20 |
Semiconductor Device And Method App 20220013364 - Chang; Ya-Lan ;   et al. | 2022-01-13 |
Multi-layered Insulating Film Stack App 20210407807 - Wang; Chieh-Ping ;   et al. | 2021-12-30 |
Semiconductor Device With Isolation Structure App 20210343709 - WANG; Chieh-Ping ;   et al. | 2021-11-04 |
Semiconductor Devices And Methods Of Manufacture App 20210335657 - Lu; Bo-Cyuan ;   et al. | 2021-10-28 |
Cut metal gate devices and processes Grant 11,152,262 - Lee , et al. October 19, 2 | 2021-10-19 |
Cut Metal Gate Refill With Void App 20210313181 - Chen; Ting-Gang ;   et al. | 2021-10-07 |
Dielectric spacer to prevent contacting shorting Grant 11,107,902 - Chen , et al. August 31, 2 | 2021-08-31 |
Cut Metal Gate Devices and Processes App 20200176259 - Lee; Chun-Yi ;   et al. | 2020-06-04 |
Systems And Methods For A Plasma Enhanced Deposition Of Material On A Semiconductor Substrate App 20200123656 - LIN; Kun-Mo ;   et al. | 2020-04-23 |
Dielectric Spacer to Prevent Contacting Shorting App 20200013875 - Chen; Ting-Gang ;   et al. | 2020-01-09 |
Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate Grant 10,519,545 - Lin , et al. Dec | 2019-12-31 |
Dielectric Spacer to Prevent Contacting Shorting App 20190393324 - Chen; Ting-Gang ;   et al. | 2019-12-26 |
FinFETs and methods of forming the same Grant 10,510,867 - Hsieh , et al. Dec | 2019-12-17 |
FinFETs and Methods of Forming the Same App 20190140076 - Hsieh; Bor Chiuan ;   et al. | 2019-05-09 |
FinFETs and methods of forming the same Grant 10,157,997 - Hsieh , et al. Dec | 2018-12-18 |
FinFETs and Methods of Forming the Same App 20180315830 - Hsieh; Bor Chiuan ;   et al. | 2018-11-01 |
Systems And Methods For A Plasma Enhanced Deposition Of Material On A Semiconductor Substrate App 20170342561 - LIN; Kun-Mo ;   et al. | 2017-11-30 |
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